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WO/2008/059654A1 |
A composition for preventing solder flux scrambling which contains a polymer comprising monomer units derived from an unsaturated compound having a C6 or lower polyfluoroalkyl group. Despite the constitution, this composition is comparab...
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WO/2008/056676A1 |
Disclosed is a lead-free solder paste composed of a solder powder and a flux (13) mixed with the solder powder. The solder powder is composed of a first base alloy powder (11) which is a first alloy in a powder form, and a second base al...
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WO/2008/053899A1 |
Contacts (10, 20) are formed of a metal thin plate including base sections (11, 21), elastic deformation sections (12, 22) and contact sections (13, 23). Recessed sections (15, 25) are formed on the bottom surface of the base section, an...
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WO/2008/046589A1 |
The invention relates to a device for welding a strip of material, comprising a plurality of tools for processing a strip (2). Said device has welding means (5, 3a) comprising at least one welding electrode (3a) and guide means (4a) for ...
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WO/2008/041692A1 |
Provided are a capillary working apparatus and a working method using a femto-second laser. The working method comprises splitting one laser beam of a femto-second into a plurality of beams by beam splitting means, changing the direction...
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WO/2008/035679A1 |
A silicon wafer (11) is irradiated with a reflection light of a laser light (L) reflected by a surface (17a) of a metal film (17) facing a surface (3) which is a laser light incoming surface of a processing object (1). A melting region (...
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WO/2008/035610A1 |
Six rows of melting regions (131, 132) to be cut starting points are formed inside a silicon wafer (11) along a cut-planned line (5). At the time of forming the melting region (131) closest to the rear surface (21) of a processing object...
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WO/2008/036521A1 |
The present invention relates to a system (100) for dicing a bonded wafer (110) including a plurality of substrates having at least a first substrate (120) bonded to at least a second substrate (130). A first laser (140) is configured to...
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WO/2008/029885A1 |
A normal temperature joining method for joining substrates at a normal temperature through intermediate members comprises a step of forming the intermediate member on the surfaces to be joined of the substrates by physically sputtering t...
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WO/2008/026532A1 |
Provided is a heat accumulator having a vacuum heat-insulating layer (2) in the outer peripheral portion of a liquid reserving portion (1). The liquid reserving portion (1) and the vacuum heat-insulating layer (2) are formed by laminatin...
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WO/2008/023461A1 |
A soldering iron which prevents scattering of flux and is not likely to clog, and a process of soldering an electronic apparatus in which the amount of solder fed at a time for soldering is made constant and soldering is performed well. ...
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WO/2008/017800A1 |
A method of friction welding comprises providing a first workpiece (24) having a first weld surface (38) and a second workpiece (26) having a second weld surface (40). The first workpiece (24) is arranged such that it tapers away from th...
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WO2007135955A9 |
A processing method for forming a through-hole in a workpiece (1) by using a pulse laser beam. The method has a step of forming a detachable sacrificial layer (la) on the workpiece (1), a step of forming the through-hole (5) in the workp...
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WO/2008/011908A1 |
The invention relates to a device for welding an annular welding element (12) to a workpiece, when welding the annular welding element (12) in alignment with a borehole in the workpiece (11). A forming gas F supplied through the welding ...
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WO/2008/009730A2 |
The present invention relates to a method for producing a cooler made of aluminium sections and optionally of lamellar material. The assembled cooler or the sections that form the cooler are formed with a solder layer at least on the par...
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WO/2008/004394A1 |
Intended is to suppress the warpage of a working target at a laser working time. Inside of a wafer (11), there is formed a modified area (M2), from which cracks (a2, b2) parallel to the thickness direction of the wafer (11) and extending...
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WO/2008/004395A1 |
In the case of forming a plurality of rows of modified regions, in the thickness direction of a processing object, along a line to be cut, a first modified region closest to a first surface and a second modified region closest to a secon...
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WO/2008/004531A2 |
A cream solder obtained by kneading an Sn-Ag-Cu alloy together with a flux, wherein the Sn-Ag-Cu alloy comprises a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn-Ag phase diag...
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WO/2007/148339A1 |
A method is provided for forming a metallurgical bond. A first metal workpiece (10) and one or more second metal workpieces (15) are brought into proximity to one another such that a first portion (12) of the first workpiece (10) is in g...
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WO/2007/147900A1 |
The invention relates to a device for the linear butt welding of thin metal sheets without weld filler materials comprising movable welding head, a carrier table (1), a clamping device (3) having at least two pressing elements (4, 5) whi...
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WO/2007/147992A1 |
The invention relates to a device (30) designed to produce the connection between two parts of a motor vehicle bodywork by induction, characterized in that it comprises a magnetic field application surface (13) whose shape is substantial...
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WO/2007/144114A2 |
The invention relates to an assembly station (1) for vehicle bodies (3) and to a method for changing clamping frames (8, 9) in the assembly station (1). The assembly station (1) has a stand (5) with at least one working point (35), a plu...
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WO/2007/137903A1 |
The invention relates to a method for spark-erosive treatment of electrically nonconductive materials, wherein a predrilled hole (3) into the electrically nonconductive material is provided, for example, by means of a laser, wherein an e...
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WO/2007/137553A2 |
The invention relates to a line (1), especially a hydraulic or pneumatic pressure line for use in a motor vehicle. Said line comprises a first substantially hollow-cylindrical line section (2) and a second substantially hollow-cylindrica...
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WO/2007/134590A1 |
The invention relates to a method and a device for joining conductive parts (11, 12) in a soldering fashion by feeding solder material (5) to the connection zone (13) of the parts (11, 12), fusing off solder material (5) and introducing ...
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WO/2007/134586A1 |
The invention relates to a device for carrying out an inductive low-frequency or high-frequency pressure welding method for joining metallic components (12, 24), particularly gas turbine components. Said device comprises at least one gen...
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WO/2007/134627A1 |
The invention relates to a work rest (12) for accommodating an, in particular tabular, workpiece (19) in a machining unit (11) which machines the workpiece (19) using a cutting beam, in particular a laser beam, wherein the work rest (14)...
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WO/2007/136019A1 |
A high-strength steel pipe for line pipings which has excellent unsusceptibility to strain aging and gives an expanded pipe whose lengthwise-direction yield strength is inhibited from increasing upon heating for corrosion-resistant coati...
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WO/2007/129177A2 |
The present application relates to a method for brazing a first metal member (1), on which an oxide (Ia' ) forms during brazing, and a second metal member (2), in which a high-wettability metal (3) having a wettability with a brazing fil...
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WO/2007/128265A1 |
A method for friction-welding a first part (1) to a second part (2) is disclosed. A joint surface (3) on the first part (1) for friction-welding is arranged together with a joint surface (3) on the second part (2) for friction-welding su...
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WO/2007/125677A1 |
Provided are a shield conductor cutting method and a laser treatment device capable of sufficiently assuring insulation between an internal conductor and a shield conductor layer without leaving a shield line not cut on the shield conduc...
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WO/2007/125799A1 |
[PROBLEMS] To provide a method and an apparatus for efficiently performing processing, even in the case of applying laser beams having different intensities and wavelengths at a plurality of stages in patterning of an electronic circuit ...
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WO/2007/116522A1 |
As shown in Fig. 3, diamond coating (30) is irradiated with oxide ion beams to thereby efficiently etch the diamond coating (30) by both of sputtering phenomenon and oxidation in step S2. Thereafter, in step S3, irradiation with argon io...
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WO/2007/116853A1 |
[PROBLEMS] Conventional jet solder baths using screw pumps have a problem that molten solder jetted from a jet nozzle pulsates up and down. The pulsation in the screw pump is due to a reverse flow caused by a wide gap between the screw p...
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WO/2007/116805A1 |
A method and device for improving residual stress in a tube body, reliably improving residual stress without excessively heating the tube body. From a start angle θS of laser beam application to the tube body up to a first predetermined...
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WO/2007/115533A1 |
Disclosed is a method for repairing a guide vane segment (1, 2) of a gas turbine, said guide vane segment comprising at least two guide vanes as well as an inner and an outer shroud. At least one guide vane (4, 6) is irreparably damaged ...
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WO/2007/116666A1 |
[PROBLEMS] In conventional reflow furnaces having suction ports in the vicinity of many hot-air blowing ports, there have been some cases where the hot-air blowing nozzles are cooled when hot air at a reduced temperature after printed bo...
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WO/2007/116523A1 |
A hard coating film (30) is efficiently etched with a beam of krypton ions, which have a relatively large mass, in a step (S2) and then slowly etched with a beam of argon ions, which have a small mass, in a step (S3) as shown in Fig. 3. ...
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WO/2007/114366A1 |
A method of producing a brazed pipe including steps A-D. In step A, a first inclined surface (21) inclined downwardly from the above toward the right end is formed on the top surface of the right-side edge of a blank plate (20) having br...
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WO/2007/111505A1 |
The present invention relates to a method and a device for cutting with a laser beam of a substantially flat carrier provided with encapsulated electronic components, in particular with electronic components which are shielded by a metal...
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WO/2007/110147A1 |
The present invention relates to a method of welding a wear layer onto a parent material (8), wherein a welding current is applied in each case to a first wire electrode (5) and at least one second wire electrode (5a), which are continuo...
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WO/2007/105953A1 |
The invention relates to a device (20) for cutting with a laser beam of a substantially flat carrier (21) provided with encapsulated electronic components (22) by mutually displacing the laser beam and the carrier (21), comprising: suppl...
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WO/2007/099986A1 |
Provided is a wafer processing method by which a wafer diced by a laser dicing apparatus can be supplied to the subsequent process without being cut into pieces. The wafer processing method is provided with a first machining step wherein...
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WO/2007/095907A1 |
The invention relates to a joining method, especially for gas turbine components, a first component section being joined to a second component section in such a manner that a joining zone of the two component sections is heated by induct...
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WO/2007/088795A1 |
A method for rapidly performing laser irradiation in a desired position as laser irradiation patterns are switched is proposed. A laser beam emitted from a laser oscillator is entered into a deflector, and a laser beam which has passed t...
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WO/2007/087822A1 |
A process for making a heat exchanger comprising extruding a number of heat exchanging tubes, connecting the end portions of the heat exchanger tubes with connection elements, and optionally applying fins to the outer surface of the heat...
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WO/2007/085848A1 |
An assembly of crown wheel (12) and casing (11) of a differential gear assembly (10) is adapted to welding. The casing (11) has a circular flange (17) with an axially extending lip engaged in a circular groove (33) which is further relie...
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WO/2007/080896A1 |
A welding process is divided into a preliminary energizing process and a regular welding process. During the preliminary energizing process, prior to regularly welding a connection plate to a battery, the electrode of a resistance weldin...
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WO/2007/074823A1 |
A focusing point P is adjusted to the inside of a substrate (4) of a working object (1) comprising a substrate (4) and a plurality of functional elements (15) provided on a surface (3) of the substrate (4). A laser beam L is applied to t...
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WO/2007/072709A1 |
A laser material processing system comprising a condenser lens (31) for condensing a processing laser beam and a range finding laser beam (L2) toward a wafer (1), an actuator for operating the lens (31), a shaping optical system (49) for...
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