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WO/2006/093264A1 |
A laser heating device and a laser heating method enabling soldering that does not burn the periphery and resin bonding that does not burn resin by detecting a temperature change when solder or resin at a processing point is melted and a...
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WO/2006/091410A1 |
A wave solder nozzle (42) is capable of delivering solder material to perform a wave soldering operation on a printed circuit board (18) in an inert atmosphere. The wave solder nozzle (42) includes a front plate (48) and a back plate (50...
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WO/2006/090511A1 |
A method for manufacturing a battery pack in which an electrode tab is not removed easily when electrode tabs led out from battery cells are welded, and the electrode tabs can be electrically connected with each other with high reliabili...
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WO/2006/084439A1 |
The invention relates to a method for producing and/or repairing an integrally bladed rotor (10), particularly an integrally bladed gas turbine rotor (10), during which at least one moving blade (12) is joined to a rotor base body for th...
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WO/2006/082959A1 |
[PROBLEMS] A reflow furnace having a conventional apparatus for removing fume has required much work for removing solids resulting from fume being attached to the inside of a piping connected to the above apparatus. [MEANS FOR SOLVING PR...
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WO/2006/079230A1 |
The invention relates to a method for laser-cutting sheet steel (1), wherein a sheet steel (1) is gradually inserted in a defined position into the cutting area (2) of a laser cutter in a direction of advance V in order to machine it. Th...
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WO/2006/080815A1 |
Disclosed are an apparatus and a method for manufacturing an absorption pad used for picking up a package or a strip during a semiconductor manufacturing process. The apparatus includes a workpiece transfer device on which a workpiece is...
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WO/2006/070825A1 |
A cutting method by which an excellent substrate cut plane can be provided without generating damages such as chipping on a brittle material substrate. The substrate is broken with a breaking trigger crack as a starting point by performi...
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WO/2006/062017A1 |
A starting point forming method suitable for dividing a body to be divided by irradiating the body with a laser beam. A location at which the body (M) to be divided is divided is irradiated with a laser beam having energy not strong enou...
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WO/2006/060832A1 |
The invention relates to a method for joining points parts or intersecting parts made of hard cast manganese steel or hard manganese steel rails to rails made of carbon steel, wherein the parts that are to be joined are optionally joined...
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WO/2006/060313A1 |
A connection assembly suitable for coupling a first component (42) to a second component (80) is provided. The connection assembly includes a first component having a projection (46). The projection has a peripheral surface that outwardl...
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WO/2006/040984A1 |
A laser beam machining method capable of precisely cutting a platy object of machining having an uneven surface which a machining laser beam enters. This laser beam machining method forms modified areas (71-77), serving as the starting p...
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WO/2006/037200A1 |
The present patent of invention refers to a robotic system designed for the performance of welding of pipelines, i.e., for the performance of all the necessary passes (root pass, filling pass and finishing pass. The robotic system posses...
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WO/2006/035870A1 |
In a grooving process and a cutting process of a semiconductor material and a ceramics material by using laser beams, processing performance is improved. A laser processing method and a laser processing apparatus are provided for perform...
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WO/2006/015430A1 |
A solar cell sub-module (100) for a photovoltaic device, including a plurality of elongate solar cells (slivers) (101) mounted in a structure that maintains the elongate solar cells in a longitudinally parallel and generally coplanar con...
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WO/2006/013763A1 |
A laser processing method capable of reliably forming a reformed region inside an object to be processed, along a desired portion of a planned cutting line. In this laser processing method, a quality reformed region (71) as the start poi...
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WO/2006/011540A1 |
A device for improving residual stress of piping capable of reducing (including removal) residual stress of piping by heating the outer circumferential surface thereof using a relatively compact device arrangement, and also capable of he...
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WO/2006/011645A1 |
A closed battery in which the inner face of a lid (50) closing a jar (60) is connected to the upper face of an upper current collecting plate (2) through leads (40, 44). The closed battery is characterized in that after one face of the l...
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WO/2006/011539A1 |
A welded part and its vicinity of T-shaped piping is efficiently heated by laser to remove residual stress in the piping. More specifically, residual stress is removed by irradiating and heating a welded part of T-shaped piping (50) with...
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WO/2005/118207A1 |
A laser beam apparatus for processing a workpiece (20), comprising an optical system consisting of optical components for guiding a laser beam emitted from a laser oscillator (1) to the workpiece (20), wherein one laser beam is split by ...
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WO/2005/098914A1 |
A laser processing method, by which a stacked part can be highly accurately cut with a substrate, at the time of cutting the substrate, whereupon the stacked part including a plurality of function elements is formed, into a plurality of ...
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WO/2005/098915A1 |
A laser processing method is provided for highly accurately cutting a board and a stacked part, even when the board whereupon the stacked part including a plurality of functional elements is formed is thick. In the laser processing metho...
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WO/2005/098916A1 |
A laser processing method is provided for highly accurately cutting a board and a stacked part, even when the board whereupon the stacked part including a plurality of functional elements is formed is thick. In the laser processing metho...
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WO/2005/090862A1 |
[PROBLEMS] To provide an alloy-coated boiler part that at all regions to be protected, is furnished with a weld deposit coating of alloy material excelling in erosion/corrosion resistance and that even when joined by welding, is free fro...
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WO/2005/065881A1 |
Displacement of a laser beam concentration point at an end of an object to be processed is reduced as much as possible, and simultaneously, laser processing is efficiently performed. A laser processing method has displacement acquiring s...
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WO/2005/033606A1 |
A heat exchanger tube, wherein a brazing filler metal required for brazing the top parts (310) of an inner fin (300) as a flow passage compartment body to the internal surface of a tube body part (200) is not cladded to a first raw mater...
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WO/2005/025797A1 |
To prevent oxidation and carbonization of a diamond, a heating unit includes an outside wall, a second furnace core tube coupled from an inlet to an outlet, and a heating device for heating a brazing object moved from the inlet into the ...
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WO/2005/027213A1 |
A method for manufacturing a semiconductor chip wherein a semiconductor thin film can be cut in a relatively short time and the cut surface can be relatively smooth. When an Si substrate on which a diamond thin film is formed is cut into...
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WO/2004/110666A1 |
A method for connecting a thin tube to a heat transfer tube capable of securely maintaining the high pressure resisting strength of a connected portion between the heat transfer tube and the thin tube when the thin tube is connected dire...
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WO/2004/108337A1 |
A method for brazing by the use of an aluminum alloy brazing sheet, which comprises using a brazing sheet having an core material of an aluminum alloy containing 0.2 to 1 mass % of Mg and a brazing material alloy having an Mg content of ...
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WO/2004/109783A1 |
A laser annealing process capable of suppressing a variation in sheet resistance. A surface layer formed shallower than 100 nm in a substrate of semiconductor material is added with impurities. The substrate is irradiated with a laser be...
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WO/2004/105109A1 |
A dicing device is provided with a dicing section, an expand section for enlarging the spacing between individual chips obtained by stretching and dicing a dicing sheet, and an inspection means for confirming the dicing state and expand ...
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WO/2004/105110A1 |
A laser dicing device includes: first position detection means for detecting a position on a wafer surface at the laser beam incident point; second position detection means for detecting in advance a position on the wafer surface; and a ...
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WO/2004/099866A1 |
A defect correction device includes: a defect detection section (41) for detecting a defect generated on a substrate by comparison with a reference image; an inhibit area setting section (39) for setting an inhibit area (KA) of correctio...
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WO/2004/099697A1 |
A flat tube for an aluminum heat exchanger formed by laterally bending and folding an aluminum band-shaped material, in which a sacrificial anode material (2) is applied to the inner surface of a core material (1) and a brazing filler me...
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WO/2004/100629A1 |
A flux transferring device for forming a high-quality flat flux film without irregularities by squeegeeing. The device comprises a scrape squeegee (15) for scraping the used flux in a film-forming recessed portion (12) of a transfer tabl...
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WO/2004/093174A1 |
A laser processing apparatus and method for processing macro portions with small pitches at a time with high energy efficiency and high processing accuracy. The laser processing apparatus comprises an optical element (microlens array (16...
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WO/2004/084594A1 |
A process for producing an electronic component and an electronic component exhibiting excellent heat dissipation characteristics in which low resistivity can be attained and the conductive part can be prevented from falling off a basic ...
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WO/2004/082885A1 |
A laser beam machining method for a printed circuit board capable of machining stop holes, grooves, and through holes by radiating laser beam onto an insulation layer on the printed circuit board, comprising a first step for machining th...
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WO/2004/076114A1 |
A small soldering apparatus capable of increasing the reliability of products by reducing the occurrence of dross and using lead-free solder, wherein a primary jet nozzle (1), a secondary jet nozzle (2), and an unshown pump forming jet w...
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WO/2004/065055A1 |
A laser cutting device (5), comprising a material feeding means (A) for feeding a sheet-like material (11) in a feeding direction, a processing head (B) capable of radiating laser beam toward the material, a head moving means (C) for mov...
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WO/2004/052586A1 |
A device and method for laser processing, where laser light for processing can be collected at a predetermined position with excellent accuracy. In the laser processing device, laser light (L1) for processing and laser light (L2) for mea...
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WO/2004/050291A1 |
A laser processing device (20) has a diaphragm member (38) with a first light passage hole (32) and a second light passage hole (39) that has the same diameter as the first light passage hole, and the device is provided on a light path o...
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WO/2004/048026A1 |
A method of welding a shaft-like part (1) on plurally piled steel plates. The shaft-like part (1) comprises a shaft portion (2), a flange (3) integrally formed with the shaft portion (2), and a projection portion (4) provided at the cent...
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WO2002088615A9 |
The invention refers to a lining device (15) for a plate heat exchanger, a plate heat exchanger, and a method for manufacturing a plate heat exchanger with a package of heat transfer plates and an end plate (5), which has at least one po...
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WO/2004/026523A1 |
A laser welding method allowing lap welding with mother material and an attaching member overlapping each other, without incurring a lowering of strength. In laser welding, a laser beam is directed to a flange (4) along a welding locus (...
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WO/2004/026517A2 |
A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module (20) to a circuit board (120). An off-eutectic solder (60) concentration of SnCu or SnAg is used for...
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WO/2004/018138A1 |
A method for manufacturing a tubular assembly (10). A first tube (14) is obtained. A first tubular connector (18) having first and second end portions (20, 22) is obtained. The first end portion (20) is metallurgically attached to the fi...
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WO/2004/018098A1 |
Disclosed is a method for producing a honeycomb member, particularly a support element for a catalytic converter, comprising hollow spaces through which a fluid can flow at least in part. Said method comprises the following steps: a) a m...
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WO/2004/014595A1 |
A laser processing method for performing processing such as perforation etc. on a ceramic green sheet etc. by more effectively using laser light. Light path systems (30, 40) are provided between a laser oscillator (1) in the laser proces...
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