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JP2022043869A |
To provide a processing device that is able to accurately detect a depth to which a cut is to be made into a workpiece by a cutting blade.A processing device 1 includes: a setup unit 40 that detects a tip position Z1 of a cutting blade 2...
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JP2022043853A |
To provide a new wafer processing method for forming a chip of a desired thickness from a wafer.A wafer processing method includes a groove forming step of forming a groove (cutting groove 141) having a depth 140 which is equal to or mor...
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JP7035369B2 |
To provide a processing device and a processing method capable of performing proper processing even when a processing tool is abraded by processing.In processing method of moving a processing tool 2 by a processing device 1 to process a ...
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JP2022042709A |
To provide a processing method for a work piece by which flying of an individual piece and chipping of an individual piece can be prevented during a cutting process.A processing method for a work piece includes: a fixing step of fixing a...
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JP7034650B2 |
To provide a processing device capable of removing a pollutant from a holding area of holding means where processing has been applied to a workpiece.Holding means 14 of a processing device comprises at least a holding area 18 for sucking...
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JP7034548B2 |
Provided is a blade cover which can easily adjust the position of a blade cooler nozzle. The blade cover covering a cutting blade mounted at a front end of a spindle comprises: a first block having a pair of blade cooler nozzles for supp...
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JP2022041697A |
To provide a cutting device and a cutting method of a workpiece, capable of further reducing vibrations of a cutting blade than before.A cutting device has a chuck table that holds a workpiece, a cutting unit 20 that cuts the workpiece h...
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JP2022041448A |
To provide a processing device which can quickly notify an operator of occurrence of abnormality when the abnormality occurs in exhaust of a treatment chamber.A processing device 2 for processing a workpiece includes: a chuck table 16 fo...
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JP2022041447A |
To provide a wafer processing method capable of confirming whether a residue of a protective member is present in a wafer.A wafer processing method of processing a back surface 11b side of a wafer 11 with unevenness on the front surface ...
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JP2022039182A |
To provide an alignment method that can quickly complete the focusing prior to an alignment process.In the present invention, prior to an alignment process, the surface of a wafer is imaged using an image pickup unit arranged such that t...
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JP2022039183A |
To provide an alignment method that can quickly complete the focusing prior to an alignment process.In the present invention, an image pickup unit takes an image of the surface of a wafer through a transparent member having a plurality o...
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JP2022038528A |
To provide a processing apparatus which can immediately generate a three-dimensional image.A processing apparatus comprises: holding means which holds a processing object; processing means which processes the processing object held by th...
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JP2022037488A |
To provide a dicing groove inspection method and a dicing device that can perform calf check accurately and easily when performing step cut.A dicing groove inspection method includes the steps of forming a first dicing groove on the surf...
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JP7031963B2 |
To provide a chip manufacturing method capable of manufacturing a plurality of chips by dividing a plate-like workpiece without using an expanded sheet.A chip manufacturing method includes a first laser processing step, a second laser pr...
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JP7031964B2 |
To provide a chip manufacturing method capable of manufacturing a plurality of chips by dividing a plate-like workpiece without using an expanded sheet.A chip manufacturing method includes a first laser processing step, a second laser pr...
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JP7032122B2 |
An objective of the present invention is to provide a cutting apparatus with excellent productivity. According to the present invention, the cutting apparatus (2) comprises: first and second retaining means (4a, 4b) retaining a workpiece...
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JP7031962B2 |
To provide a processing method for a package substrate, by which occurrence of metal burr is hindered and occurrence of abnormal wear of a cutting blade can be prevented.A processing method for a package substrate comprising: a metal fra...
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JP7031965B2 |
To provide a chip manufacturing method capable of manufacturing a plurality of chips by dividing a plate-like workpiece without using an expanded sheet.A chip manufacturing method includes a first laser processing step, a second laser pr...
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JP7030606B2 |
The present invention provides a cutting device capable of excellently collecting cutting fragments such as a material which is cut. The cutting device includes: a cutting fragment guiding casing (70) receiving cutting water and the cutt...
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JP2022035316A |
To provide a diametrical dimension detection method that can eliminate the problem of the newest notch becoming unclear by mingling with previously formed notches, flaws or dirt on a tabular object on which a new notch is to be formed.A ...
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JP2022035502A |
To cut a workpiece by applying ultrasonic vibration to a cutting blade and to reduce excessive wear of the cutting blade.A cutting method for cutting a workpiece by using a cutting device including a chuck table for holding a workpiece, ...
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JP2022035558A |
To provide a method of manufacturing LEDs emitting deep ultraviolet light.A method includes: a primitive wafer production step of producing an N-type low resistance AlN ingot, and cutting the ingot along a c-plane with reference to the b...
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JP2022035062A |
To provide a processing device including an imaging unit capable of quickly completing autofocusing.A processing device of the present invention performs autofocusing by adjusting a voltage applied to a liquid lens. Here, the voltage is ...
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JP7029625B2 |
To provide a blade fixing device and a dicing device capable of preventing meandering of a dicing blade with respect to a workpiece by suppressing the swing of the dicing blade, even for the dicing blade in which a protrusion amount in t...
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JP7028607B2 |
A cutting apparatus includes a rotatable holding table having a rectangular holding surface, a cutting unit having a cutting blade mounted to a rotatable spindle, and a sensor unit detecting a tip of the cutting blade entering between a ...
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JP7027234B2 |
Provided is a processing method of a wafer, which is able to properly divide the wafer with a plurality of flash memory chips formed. According to the present invention, the processing method of the wafer at least comprises: a step of fo...
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JP2022032453A |
To provide a cutting device and a processing method such that electrostatic discharge damage to the device can be avoided, and neither a cylinder for storing CO2 nor a storage space for the cylinder is required.In a cutting device, proce...
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JP2022032303A |
To provide a rectangular substrate having a flattened copper film on a front surface without causing damage to a byte tool.A method for processing substrate by a cutting device 2 processing a substrate 1 in which copper films 3 and 7 are...
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JP2022032082A |
To prevent tension applied to a wire from varying and partially equalize tension applied to a wire pulled by a plurality of pulleys.A wire transport device 10 comprises a wire supply portion that delivers a wire 11, a wire recovery porti...
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JP2022032728A |
To provide a cutting device in which adhesion of a cutting chip in cutting liquid to a cleaning unit can be suppressed and which furthermore enables the increase of the cost thereof to be suppressed.A cutting device 1 includes: a chuck t...
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JP2022032302A |
To provide a processing method for processing a rectangular substrate having a flattened copper film on a surface thereof without occurrence of damage on a bite tool.A substrate processing method for processing a substrate on a top face ...
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JP2022032460A |
To make a depth of a cutting groove uniform.A wafer 14 is ground using a cutting device 1 including: cutting means 5 which grinds the wafer 14; holding means 2 which holds the wafer 14; cutting feed means 6 which moves the holding means ...
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JP7023211B2 |
To improve the quality of reading an alignment mark when the alignment mark is provided on the back surface of a polished silicon wafer, which is a non-mirror surface.In a method for adjusting an etching condition of a polished silicon w...
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JP2022030669A |
To provide a cutting device capable of automatically exchanging a board.A cutting device for cutting a workpiece with a cutting blade, includes: a cutting unit having: a chuck table that holds a board in which a groove is formed by being...
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JP2022030051A |
To provide a cutting device and the like which can detect the height position of a workpiece at a lower cost.A cutting device is configured to cut a workpiece. The cutting device includes a light source, an imaging unit, and a detection ...
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JP2022029092A |
To provide a processing method of workpiece which can appropriately process workpiece made of a fluorine resin by a cutting device.A processing method of workpiece for processing workpiece made of a fluorine resin includes: a sticking st...
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JP2022029258A |
To adjust the position of a cutting blade by detecting the position of a cutting groove in a step cut.A wafer processing method includes a groove formation step of forming a first groove (first cutting groove 61) having a first width alo...
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JP7020286B2 |
A method for slicing an ingot, including: forming a wire row by a wire spirally wound between a plurality of wire guides and configured to travel in an axial direction; and pressing an ingot against the wire row while supplying a contact...
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JP7020454B2 |
A workpiece cutting method according to the present invention is for simultaneously cutting a workpiece, by a wire saw, at a plurality of portions arranged axially by infeeding the workpiece held by a workpiece holding means with respect...
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JP7019254B2 |
The purpose of the present invention is to provide a method for cutting a workpiece, which can prevent the occurrence of a machining failure of a workpiece and efficiently suppress the generation of burrs of a diamond touch film. The met...
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JP2022025971A |
To provide a cutting device which can prevent the contact of a cutting edge of a cutting blade to an upper surface of a housing of a cutting blade detection mechanism when detecting a tip position of the cutting blade.By referring to coo...
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JP7011955B2 |
To make it possible to easily perform setup of a work-piece to be processed.Before starting cutting of a work-piece 25, a storage part stores a value of a length of the work-piece 25, a position of a displacement end part α3 of a cuttin...
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JP7018323B2 |
To suppress adhesion of a processed waste to a washing roller immersed in a washing fluid.A processing device comprises: processing mechanisms 6A, 6B for processing a workpiece W; and a washing mechanism 8 for washing the workpiece W whi...
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JP7017934B2 |
The invention relates to a device (100) for machining a surface of a workpiece (200a). According to one embodiment, the device (100) comprises a frame (160) and a roller carrier (401), on which a first roller (101) is rotatably supported...
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JP2022024886A |
To provide a processing device that can grasp a position where many abrasions of a cutting blade are found in a wafer.A processing device 1 comprises: a cutting unit 20 that cuts a wafer 200 held on a holding table 10, with a cutting bla...
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JP2022024096A |
To allow for optimal accessibility to the cutting wire path.A wire saw (10) includes: a first compartment (1) in which wire guide rollers (13, 14) for supporting a cutting field (5) formed from a cutting wire (6) are arranged; a second c...
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JP2022022831A |
To provide a cutting device which inhibits a waste liquid mixed with chips from entering a chuck table from its outer periphery and causing contamination in the chuck table when a cutting groove is formed at a wafer, and to provide the c...
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JP7003897B2 |
By suppressing the deterioration in processing quality that results from the quality of reuse slurry for slice processing by means of a wire saw, a wafer manufacturing method that is capable of stabilizing and improving wafer flatness is...
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JP7014733B2 |
Described is an apparatus for robot-aided grinding, comprising the following: a manipulator, a linear actuator, and a grinding machine which includes a rotating grinding tool and is connected to the manipulator via the linear actuator. T...
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JP2022020255A |
To reduce difficulty in finding the cause of trouble to a device chip.A method of managing a workpiece comprises: a frame unit forming step 1001 in which a workpiece having a surface where a device is formed in a region sectioned with mu...
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