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JP2023031472A |
To provide a new technique capable of reducing time and labor for removing a sub-table when a holding table is replaced in accordance with a workpiece shape.A holding table mechanism 2 comprises: a first holding table 21 having a first h...
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JP2023031920A |
To easily and safely discharge residual water remaining in a cooling water passage without removing a pipeline of the cooking water passage.A processing device with a holding table, a processing unit and a movement mechanism, includes: a...
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JP7235433B2 |
To provide a processor for a rotor such as an electric generator or the like which has an occupancy area as small as possible and is excellent in portability.A processor, which is configured from plural units, comprises: a fixation mecha...
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JP7233813B2 |
An objective of the present invention is to provide a machining apparatus capable of preventing damage to a workpiece during transport. The machining apparatus comprises: a chuck table to hold a plate-shaped workpiece; a machining unit t...
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JP7233154B2 |
To provide a wire saw which has highly accurate workpiece feeding accuracy.A wire saw 1 includes a workpiece feeding mechanism 4 which moves a workpiece W between a machining position P1 for cutting the workpiece W by a wire 33 and a wor...
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JP2023028705A |
To provide a wire saw which can further improve cutting accuracy of a workpiece.A wire saw 1 includes a saddle 4 which is arranged so as to move in a vertical direction, a column 3 which has guide surfaces 3a, 3b, 3c, 3d arranged along a...
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JP2023028108A |
To efficiently inspect the inside of a work-piece.An inspection device, which inspects a work-piece, comprises: a holding table; an infrared camera unit that photographs the work-piece held on the holding table to form a photographed ima...
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JP7232390B2 |
To provide a method for producing an R-T-B-based sintered magnet without requiring preparation of an inert atmosphere.There is provided a method for producing an R-T-B-based sintered magnet which comprises: a pulverization step S10 of pr...
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JP2023029020A |
To provide a wire saw that is configured so as to make force acting on a work-piece feeding mechanism constant even if cutting resistance at the time of cutting a work-piece varies.A wire saw 1 comprises: a wire 54 that cuts a work-piece...
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JP2023508108A |
A floor finish removal pad assembly is described. A method of removing floor finish with a floor finish removal pad assembly is described. In particular, the floor finish removal pad assembly comprises a plurality of discontinuously arra...
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JP7229093B2 |
A blade attachment-detachment assisting apparatus includes a nut rotating part having an engagement pin that engages with an engagement hole of a nut, a nut grip part that grips an annular groove of the nut, a housing that supports the n...
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JP7229094B2 |
To provide a cutting method and a cutting device that shorten time taken for processing, without affecting the quality of processing.A cutting method comprises: a cutting step in which a cutting blade is fed while processing, from a cutt...
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JP2023026126A |
To propose a novel technique for preventing particles from sticking to a surface of a workpiece.A workpiece processing method uses a cutting device that comprises a holding table 20 for holding a workpiece, and a cutting unit 5 having a ...
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JP2023025889A |
To provide a cutting blade shaping method capable of shaping the shape of a cutting blade easily at low cost.The cutting blade shaping method comprises: a shaping preparation step of configuring a state where a tip of a cutting blade 21 ...
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JP7228750B2 |
A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc pla...
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JP7226286B2 |
The present invention provides a method of reworking a wire saw, which, in cutting a work by a wire saw using a fixed grain wire and resuming the cutting of the work, which has been stopped because of a disorder such as disconnection of ...
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JP7223964B2 |
A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing one of tungsten and a tungsten alloy. A surface roughness Ra of the metal wire is at most 0.15 μm. A diameter of the metal...
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JP2023023263A |
To provide a cutting method of a substrate in which processing can be excellently done in step cut.A cutting method of substrate in which a substrate is cut along scheduled division lines by a cutting blade having a cutting blade on whic...
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JP2023023042A |
To adjust liquid to a prescribed temperature by a small-sized configuration which is simple and at operation cost.A constant temperature liquid supply device for supplying liquid with an adjusted temperature to a processing device provid...
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JP2023023578A |
To provide a cutting device which can efficiently clean a light emitting part and a light receiving part while inhibiting adhesion of sawdust to the light emitting part and the light receiving part.A cutting device includes a cutting bla...
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JP2023023057A |
To provide a processing apparatus and a method for manufacturing a processed product, which simplifies a configuration and prevents scattering of working liquid while reducing footprint.A processing apparatus includes processing tables 2...
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JP2023022775A |
To process workpiece without teaching at a site.A robot system 100 includes a robot 1 for processing a processed part B of an object W, a storage part 32 for storing an image of the object W and three-dimensional information, a specifica...
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JP2023022450A |
To properly diagnose an abnormality of a wire saw by sufficiently monitoring its operation state before cutting processing.An abnormality diagnosis device for a wire saw 1 comprises a diagnosis mode execution unit 51, a data group acquis...
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JP2023022522A |
To provide a processing device configured so as to prevent processing water from leaking and enable loads acting on processing/feeding means to reduce.A processing device includes holding means 4 that holds a work-piece, processing means...
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JP2023022523A |
To provide a cutting device that can properly cool a cutting blade and a work-piece, while removing powder dust scattering from a cut site.In a cutting device that cuts a wafer W, cutting means 4 comprises: a rotating shaft 44; a cutting...
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JP2023022562A |
To provide a processing apparatus for storing a workpiece to be processed while eliminating the need for a moving mechanism for moving a processing table.A processing apparatus 100 includes processing tables 2A and 2B, a first holding me...
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JP7221778B2 |
To provide a wafer processing method that can efficiently produce chamfered chips.A wafer processing method is constituted of at least: a step of cutting a first division scheduled line to form reed-shaped members 22 comprising first cut...
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JP7221560B1 |
An object of the present invention is to provide a processed portion fixing structure that directly fixes a processed portion to a horn main body using a simple mechanical fixing structure. A processed part 11 is directly fixed to a horn...
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JP2023021282A |
To provide a compact grinding machine which is suitable for robot-supported grinding, and enables comparatively accurate control of processing force during grinding.A grinding machine has: a housing; a motor arranged inside the housing; ...
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JP2023019193A |
To provide a workpiece processing method that can firmly fix the thermocompression sheet to a workpiece and a frame.A workpiece processing method includes an integration step 1 for heating and press-bonding a thermocompression sheet to a...
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JP2023019355A |
To provide a processing device which can suppress fluctuation of a supply amount of a working fluid.A processing device processes a workpiece, and includes a holding table for holding the workpiece, processing units 20A, 20B which proces...
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JP2023018559A |
To provide a cutting device which can inhibit occurrence of dew condensation while enabling supply of a low temperature cutting fluid.A cutting device 1 includes: a holding table which holds a workpiece; a spindle to which a cutting blad...
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JP2023018319A |
To simplify input of information regarding dressing for an operator.A cutting device has: a chuck table for holding a dressing board; and a cutting unit which has a spindle and in which a cutting blade is attached to a tip of the spindle...
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JP2023018320A |
To simplify input of cutting conditions to a cutting device for an operator.A cutting device has: a chuck table for holding a substrate; and a cutting unit which has a spindle and in which a cutting blade is attached to a tip of the spin...
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JP2023015609A |
To prevent both chipping of a chip and adhesion of cutting waste to the chip.After a second cutting step, a washing step of washing the upper surface of a wafer 100 and a second cutting groove is performed. Thus, it is possible to preven...
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JP2023503609A |
A repaired area on the work surface is presented. The repaired area includes the repair boundary. Inside the repair boundary, the work surface has a repair texture, and outside the repair boundary, the work surface has a work surface tex...
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JP7214364B2 |
The purpose of the present invention is to provide a wafer machining method capable of cutting a wafer, in which a plurality of devices formed of a metal pattern are formed by deposition on an upper surface of a glass substrate, without ...
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JP7213559B2 |
To effectively use grinding surfaces of grinding belts that are wider than the width of rail heads and swiftly and accurately re-profile rail joints.It includes a trolley body 11, a rail re-profiling part 12 provided on the trolley body ...
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JP2023503341A |
A dual-mounted end effector system attached to a driven robotic arm for preparing object surfaces is discussed. The system includes a first tool configured to contact and prepare the object surface and a second tool configured to contact...
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JP2023012778A |
To provide a traverse device which has a low component replacement frequency, is not susceptible to the influence of disturbance like scatter of slurry and vibration, and has high detection accuracy.A traverse device comprises: traverse ...
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JP7212905B2 |
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JP2023012963A |
To suppress deterioration in reliability of a chip and a connection failure.A processing method comprises: a half-cut step 1002 of forming a cut remaining part at a lower side of a first cutting groove while forming the first cutting gro...
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JP2023013329A |
To provide a durable metal wire.The metal wire is made of tungsten or tungsten alloy, and the number of times until wire breakage is 20,000 or more when a fatigue test is performed at maximum stress of 4400 MPa according to the JIS C6821...
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JP2023012425A |
To provide a method for cutting semiconductor materials that prevents dimensional accuracy of the package after cutting from being reduced due to shrinkage caused by cooling of the workpiece due to spraying of cutting fluid during blade ...
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JP2023010304A |
To simplify a device configuration, reduce footprint, and reduce a size of a storage space for segmentalized workpieces.A processing apparatus includes processing tables 2A and 2B for holding a sealed substrate W, a first holding mechani...
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JP7208700B2 |
To provide a chuck table unit which can omit a process for forming a groove at a holding plate in advance.In a chuck table unit of a cutter for cutting and splitting a plate-shaped workpiece which is partitioned into a plurality of regio...
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JP2023008342A |
To provide a processing liquid tank capable of uniformly dispersing a processing liquid, for improving processing accuracy and processing efficiency.A processing liquid tank 1 has: a cylindrical peripheral wall part 2; a bottom 3 forming...
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JP7208732B2 |
An objective of the present invention is to quickly find an alignment mark. An alignment method comprises: a process of registering an alignment mark (MA) in an area smaller than a photographing area of a photographing means (51); a proc...
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JP2023006188A |
To provide an information exchange system that enables processing information to be effectively utilized in an inspection performed by an inspection device.An information exchange system includes a processing device and an inspection dev...
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JP7208036B2 |
To provide an alignment method of a wafer, capable of performing an accurate θ matching for the wafer in which a key pattern is exposed only at an outer periphery.An alignment method of a wafer, comprises: a rough alignment step of dete...
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