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JP7128073B2 |
To determine whether the depth of a formed groove is appropriate when grooving is performed with a cutting blade, etc.Before and after groove formation using a blade (groove forming step), a weight meter 4 is used to measure the weight o...
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JP7127972B2 |
Provided by a processing method, when a workpiece formed of a hard-to-grind material or the like is processed, abrasion of the processing tool can be suppressed, and processing can be smoothly performed. The processing method has the fol...
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JP2022126089A |
To provide a wafer processing method in which cutting waste does not adhere to the surface of a device chip and a part of an adhesive layer does not remain.A wafer processing method includes: a thermocompression sheet disposing step of a...
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JP7126857B2 |
To provide a processing device capable of suppressing rusting caused by processing waste.A cutting device 1 to be a processing device includes: a chuck table 10 which holds a workpiece including a magnetic body; a cutting unit 20 which c...
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JP2022125669A |
To detect a failure of a screwing state of a fixing nut.A cutting device is equipped with a cutting unit that has a spindle, and is installed with an annular cutting blade at a tip end portion of the spindle via a blade mount, and a dete...
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JP7126849B2 |
A cutting apparatus includes a chuck table that holds a workpiece, a processing unit that forms a processed groove in the workpiece, an imaging unit that images the workpiece, a display unit that displays a captured image of a processed ...
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JP7126750B2 |
A cutting apparatus includes a cutting unit that cuts a workpiece included in a frame unit, an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays, and a control unit. The control unit includes a process...
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JP7126749B2 |
A cutting apparatus includes a blade changing apparatus. The blade changing apparatus includes a blade mounting and removal portion, which in turn includes: a holding portion that removably holds a circular base of a cutting blade; a mov...
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JP2022124114A |
To provide a processing device which uniformizes fastening manners of a main roller fastened to a roller unit and enables improvement of quality and production efficiency of a processed product by improving working efficiency related to ...
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JP2022124134A |
To cut a workpiece so that the centers of processed grooves in a width direction on a back surface side and a front side of the workpiece are aligned with each other.A method of processing a workpiece includes a holding step of holding a...
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JP7123915B2 |
A process for automated sanding of a vehicle component surface is provided and includes providing a sanding mechanism having a sanding head engaged with a housing, a rotary motor contained within the housing, the rotary motor having a dr...
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JP2022122141A |
To provide a holding surface cleaning method capable of removing a foreign matter remaining on a holding surface without deteriorating a state of the holding surface.A holding surface cleaning method includes a polishing step of polishin...
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JP2022121824A |
To reduce scattering of end material chips, reduce the risk of device chip damage, etc., in pickup time after a cutting step, and improve throughput in the cutting step.A cutting method includes: a detection step of detecting a region to...
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JP7121788B2 |
This cutting device comprises a cutting mechanism. The cutting mechanism has a blade for cutting an object to be cut. The blade has a first side surface, and a second side surface. The cutting device further comprises first and second pr...
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JP7121846B1 |
A cutting device capable of efficiently detecting a dressable region of a dress board and a method for manufacturing a cut product using the cutting device are provided. A cutting device is configured to cut an object to be cut with a bl...
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JP2022120277A |
To provide a cutting device capable of executing setting-up at a suitable timing according to the consumption amount of a cutting blade.A cutting device cutting a workpiece, is equipped with a chuck table that has a holding surface holdi...
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JP2022120278A |
To provide a blade fixture which can increase an amount of a cutting liquid supplied to a workpiece while achieving low costs for manufacturing of a cutting blade, a consumable supply, and to provide a blade mounter.A blade fixture is us...
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JP7119706B2 |
To provide a manufacturing method for piezoelectric oxide monocrystal wafers that can perform mirror-polishing without leaving beveling processing traces in an edge-polish process and efficiently process a plurality of monocrystal wafers...
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JP7118521B2 |
To provide a wafer processing method capable of preforming an alignment process through a sealing material including a carbon black coated on a surface of a wafer.A method for processing a wafer in which a surface of the wafer 27 in whic...
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JP2022116208A |
To provide a method for automated sanding of a vehicle component surface.A method for automated sanding of a vehicle component surface includes the steps of: providing a sanding mechanism having a sanding head 12 engaged with a housing 1...
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JP2022115616A |
To provide a cutting device that eliminates the need to manually remove a cutting blade from a blade case.A cutting device comprises: a cutting unit including a spindle serving as a rotation shaft, and a mount flange which is fixed to a ...
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JP2022115618A |
To provide a cutting device that is able to properly determine a state of a cutting-edge detection unit.A cutting device includes: a chuck table holding a work piece; a cutting unit including a spindle and that cuts the work piece, held ...
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JP7114169B2 |
To provide a cutting blade forming method that can save a dresser board.The cutting blade forming method for forming a slope on a side of a tip part of a cutting blade comprises: a first cutting step in which the cutting blade is positio...
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JP7114166B2 |
Provided is a cutting blade management method capable of more appropriately determining a breakage of a cutting blade. The cutting blade management method comprises: an initial adjustment step of adjusting the amount of light emitted fro...
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JP7113365B2 |
A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A surface roughness Ra of the metal wire is at most 0.15 μm. A tensile stre...
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JP2022113376A |
To provide a polishing method that can suitably polish even a member of interest having a complicated surface, and a method for producing a metal die-cast article, a polishing device, a computer program and a controller.A polishing metho...
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JP2022112635A |
To reduce work loads and work man-hours of a worker in end face correction.An end face correction jig used in a cutting device includes: an annular base member which can be held by a chuck table mechanism of a cutting device and has an i...
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JP7111562B2 |
To provide a processing method in which a work-piece in a dome shape, constituted of brittle materials, which has a recess part therein is cut off.The processing method according to the invention, in which a work-piece 10 in a dome shape...
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JP7111778B2 |
To provide a polishing robot device that is configured to employ a polishing unit as an end effector of a multi-joint type robot, so that the device can deal with multi-products and has higher versatility in comparison with a dedicated m...
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JP2022112339A |
To provide a processing device which is capable of improving the quality of a processed product by suppressing a positional change of a groove due to thermal expansion of a resin layer of a main roller and, at the same time, is capable o...
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JP7109736B2 |
To provide an assist device and an assist method, for positioning in order to perform a positioning of a rotational axis and a photographing optical axis with high accuracy.An assist device assists a positioning of a rotational axis of a...
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JP7109769B2 |
To provide a machining device capable of realizing an appropriate movement with respect to a flat processed surface such as a vertical surface and performing the teaching efficiently.A machining device is a device for performing machinin...
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JP2022110511A |
To provide a wafer division method capable of suppressing chipping on front and back surfaces.A wafer division method includes a holding step 1001 of holding a tape side of a wafer to a holding table, a first cutting step 1002 of cutting...
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JP7108429B2 |
The present invention relates to a processing method for forming a work (W) which becomes a long piece using the surplus size of a plate-shaped object (10) having a product area (12). The purpose of the present invention is to prevent a ...
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JP2022109746A |
To provide a wafer cutting method capable of reducing adhesion of cutting scraps accompanying drying in kerf check.A wafer cutting method for cutting a wafer 100 having a device region 107 in which a plurality of devices 103 are formed a...
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JP7106382B2 |
To provide a wafer processing method capable of performing plasma etching while holding down costs.A wafer processing method for dividing a wafer along division schedule lines comprises a base sticking step (ST1), a cutting step (ST2), a...
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JP7106298B2 |
A chuck table includes a main part having a holding surface for holding thereon a workpiece through a dicing tape, and a frame holder disposed around the main part for holding the annular frame. The main part has a flat surface that func...
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JP2022108406A |
To provide a semiconductor chip capable of suppressing the occurrence of cracks and chipping during dicing of a semiconductor wafer and suppressing the occurrence of cracks and chipping when the chip is peeled off from a dicing tape.In a...
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JP2022107988A |
To provide a processing device that allows a user to easily and reliably recognize the relation between a processed area of a work piece seen in an image and processing conditions which have been applied for the processing on the area.A ...
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JP2022107952A |
To provide an auxiliary device that can automatically carry an end face correction jig into a cutting device.An auxiliary device 2 that is connected to a cutting device comprises: an end face correction jig housing part 158 that houses a...
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JP2022107951A |
To provide an auxiliary device that can automatically carry a dressing board into a cutting device.An auxiliary device 2 that is connected to a cutting device comprises: a dressing board housing part 144 that houses a dressing board 142 ...
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JP2022108181A |
To provide a cutting device that can make scraps smaller.A control unit 50 included in a cutting device 1 includes a processing condition storage portion 51 and a scrap size calculation portion 52. The processing condition storage portio...
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JP7105093B2 |
To detect an abnormality in a state of a tip of a cutting blade in real time.A cutting apparatus comprises: a laser detection light irradiation part (61) that applies laser detection light toward an outer peripheral part (53) of a cuttin...
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JP7103305B2 |
The present invention immediately grasps a decrease in sharpness of slurry and immediately reflects a decrease in sharpness on a cutting condition. The method for cutting an ingot comprises the steps of: forming a wire row with a wire wh...
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JP7102422B2 |
A multiplicity of wafers are simultaneously cut from an ingot using a structured sawing wire having indentations and protrusions along its length, wherein the structured sawing wire is guided through grooves of two wire guide rolls, and ...
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JP7102157B2 |
The invention provides a cutting device that has a strong holding force on a working table even if the object is cut. In order to achieve the above-mentioned objective, the cutting device of the invention includes a working table (10), a...
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JP7101682B2 |
The invention relates to a method for cutting refractory metals, in which a solid body (1) made of a refractory metal is mechanically machining cut with a cutting apparatus (4, 7), wherein the cutting apparatus (4, 7) is wetted for cutti...
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JP7100864B1 |
To provide a method and an apparatus for manufacturing a semiconductor crystal wafer capable of easily and surely manufacturing a high-quality semiconductor crystal wafer. A method for manufacturing a SiC wafer, which is a semiconductor ...
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JP7099755B2 |
To provide a rust remover that reduces the labor aggregation degree of workers, saves costs, and guarantees the quality of a product.The rust remover includes at least two rust removing wheels 1, and one of them is horizontally disposed ...
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JP7098581B2 |
An objective of the present invention is to allow a blade to be automatically exchanged even if the fit tolerance of the blade for a flange is strict. A blade exchange mechanism comprises: a first suction unit (711) to suck a blade (61);...
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