Document |
Document Title |
JP5790633B2 |
|
JP5788249B2 |
The object of the present invention provides a heat sealing adhesive tape which can adhere to various kinds of products to be treated comprising various polymer materials as the outer surface thereof in a sufficient heat sealing adhesive...
|
JP2015166253A |
To provide a cover tape for packaging an electronic component which can be sealed again, even if the tape is removed from a carrier tape.A cover tape 1 for packaging an electronic component comprising a mixture including at least two or ...
|
JP2015527952A |
The carrier tape for transporting a plurality of parts includes a flexible base material extending along the longitudinal axis of the carrier tape and a plurality of carriers molded in the base material and spaced along the longitudinal ...
|
JP3199888U |
To provide a pamphlet package capable of solving a problem that document publication in a conventional package is restricted. By providing a package with a pamphlet function and integrating the package and the pamphlet, a document restri...
|
JP5778698B2 |
Disclosed are a multilayer styrenic resin sheet comprising 10 to 50 laminated layers which are each made of a styrenic resin composition that comprises 29 to 65 mass% of a styrene/conjugated diene copolymer (A), 51 to 15 mass% of a polys...
|
JP5778417B2 |
|
JP3199823U |
To provide a display hanging package in which a consumer can easily peel off a shrink-wrapped article from a mount, and even when the article includes an article having a large mass, the mount and the article are peeled off by the mass o...
|
JP2015160645A |
To provide a mount with a shrink film and a package using the same in which the mount is less like to be warped even when packing an article having a step in a portion corresponding to the mount side, and contracting the shrink film.In a...
|
JP2015140200A |
To provide a cover tape which does not cause blocking even when stored for a long period of time under a high temperature environment of 60°C in a wound body state, or under a high temperature high humidity environment of a temperature ...
|
JP3198911U |
To provide a locking structure of a package which is easy to insert and hard to come off with a simpler structure for locking the side walls of a package. A package locking structure is formed in a box shape by bending a sheet-shaped mem...
|
JP5757713B2 |
|
JP5752143B2 |
Disclosed is a cover film which is used in combination with a carrier tape and comprises at least a base layer (A), an intermediate layer (B), a releasing layer (C) and a heat seal layer (D) that is capable of being heat sealed to the ca...
|
JP3198405U |
To provide a card sending mount which ensures the effect of an advertisement by taking an advertisement performed together with sending a card or the like into the view of a member with a higher probability. A card sending mount 1 is arr...
|
JP5740957B2 |
|
JP5736908B2 |
|
JP5732260B2 |
The arrangement (1,1') has a transport packaging (2) which comprises a cover layer (10), an intermediate layer (20) with a recess (230), and a cover foil. The cover layer is formed with a main surface (100) in laminar manner, where the m...
|
JP5732229B2 |
|
JP5732261B2 |
The arrangement (1) comprises a transportation packaging (2) provided with a planar sheet (10), a covering film (30), and a drip-tray type plastic structure (80). The plastic structure partly encloses the power semiconductor module (5). ...
|
JP5732635B2 |
|
JP2015105136A |
To provide a chip type electronic component storage mount which does not generate wrinkle or interlayer peeling during winding processing, has preferable seal property with a cover tape and a bottom tape, and which does not cause impleme...
|
JP2015515419A |
A package (1000) for containing, storing, displaying, and moving items such as pharmaceutical products. The package has a receptacle (300) that can be attached to paperboard (200). The attachable receptacle has, for example, a clam shell...
|
JP5719856B2 |
|
JP5717389B2 |
|
JP5701350B2 |
|
JP5695644B2 |
Disclosed is a cover tape which comprises at least a base layer (A), an intermediate layer (B), a peeling layer (C), the primary component of which is a thermoplastic resin, and a heat seal layer (D), the primary component of which is a ...
|
JP5685051B2 |
|
JP2015508048A |
The present invention generally relates to a unit package for containing and taking out product materials. In particular, the unit package comprises a print base card and a fluid container that is permanently adhered to a portion of the ...
|
JP5683096B2 |
|
JP3196015U |
To provide a blister pack which is excellent in reusability because it is not necessary to peel off or cut off a mount or a blister when taking out a product, the product can be easily taken out, and the product can be stored again. prov...
|
JP5667760B2 |
|
JP5665520B2 |
|
JP2015020750A |
To provide a cover tape capable of sufficiently: reducing the loosening of the cover tape occurring during heat sealing; suppressing the warp of the cover tape; suppressing the dimensional change of the cover tape before and after heat s...
|
JP2014240283A |
To fix an article on a mount.In a method for bonding a paper board and a thermoplastic resin film, the paper board and the thermoplastic resin film are bonded by that: the thermoplastic resin film is disposed on the paper board; a heatin...
|
JP5647440B2 |
|
JP2014227216A |
To provide a conductive carrier tape: where the occurrence of failures due to triboelectric charging and peeling electrostatic charging at the peeling of a cover tape is aborted, effectively suppressed and prevented as a paper mount elec...
|
JP2014532602A |
To provide an antistatic cover tape for a carrier tape provided with a sealing layer. An antistatic cover tape characterized in that a surface portion that comes into contact with an object transported to the carrier tape is provided wit...
|
JP5626311B2 |
|
JP2014529528A |
A cover film that is heat-sealed on a carrier tape for carrying electronic components will be described. The cover film includes a polyester base layer, a first antistatic layer disposed on the first surface of the base layer, an interme...
|
JP2014205516A |
To provide a product displaying body that can reliably attach a product to a mount, detach the product from the mount without placing a burden on a user, and allows a detached product to be fixedly attached to a prescribed article, and t...
|
JP5610414B2 |
|
JP5610377B2 |
The object of the present invention is to provide a resin composition sheet that when used in the manufacture of product packaging such as carrier tapes, and the like, molding temperatures can be lowered from 260-280° C. to 200-250° C....
|
JP2014196109A |
To provide a packing method of an optical element which easily and securely fixes the optical element to pack the optical element, increases the capacity per area, and easily matches the shape and the size of the optical element to enabl...
|
JP3193581U |
To provide a carrier tape capable of mounting a surface mount component which is a columnar component having an axial length longer than a diameter on a substrate without changing its orientation. The carrier tape 3 has a plurality of po...
|
JP5602067B2 |
To provide a sealant material excellent in adhesive strength to a carrier tape, even under a short-time adhesion condition required in the carrier tape containing a polycarbonate for transporting an electronic component, capable of restr...
|
JP5600834B2 |
[Problem to be solved] To provide a display strip capable of attaching by heat sealing bags comprising a biaxial oriented film and having no low-melting-point layer on the outer surface of the bag. [Solution] In the display strip compris...
|
JP5587181B2 |
A component tape comprising a base tape that includes pockets configured to house electrical components for placement on a printed circuit board and a cover tape, covering the base tape wherein a portion of the cover tape is configured t...
|
JP5586716B2 |
|
JP5588166B2 |
|
JP2014141279A |
To provide a mount for storing a chip-type electronic component, which hardly causes a mounting trouble due to adhesion of a chip-type electronic component to a cavity wall surface.A mount for storing a chip-type electronic component is ...
|