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WO/2004/050516A1 |
A device for working material plates (1), such as glass sheets, comprises a supporting device (25, 26, 29) for the material plate (1) and a tool (12, 18) for working the material plates (1). The supporting device (25, 26, 29) has support...
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WO/2004/051735A1 |
A wafer separation apparatus (2) capable of safely and easily separating a wafer at an increased speed. The center portion of the uppermost wafer is pressed by wafer pressing means provided on the center portion of the lower surface of a...
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WO/2004/051736A1 |
In a semiconductor producing device using a mini- environment system, the open air is prevented from entering through a clearance between the opening in the semiconductor producing device and the wafer gateway in a closed vessel to preve...
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WO/2004/048052A1 |
The invention relates to a device for machining glass panes (1), said device comprising a support device (5) for the glass panes (1), and a nozzle (2) from which a water jet is ejected for cutting the glass panes (1). Said nozzle (2) can...
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WO/2004/048057A1 |
A clamping device (50) is installed on a stand (10) with a hollow rectangular parallelepiped shape such that at least one place at a side edge portion of a mother board transported in the stand (10) is clamped. A pair of substrate-cuttin...
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WO/2004/048284A1 |
The invention relates to a device for machining a glass plate (5). Said device is provided with a lifting element (10,11) which is used to lift the glass plate (5) from a transport device (3) located on a lower edge of a supporting wall ...
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WO/2004/041627A1 |
The invention concerns an aerial conveyor, advantageously designed for a conveying assembly with two symmetrical conveyors for transporting motor vehicle body shells resting on sleds individually suspended to tractive carrier cables (60)...
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WO/2004/041628A1 |
In a preferred embodiment, the objects to be transported, in particular motor car body shells on sleds (3, 5) are carried suspended each by four independent pendular arms (4) with two symmetrical conveyors which travel through the instal...
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WO2004019387A9 |
A system comprising a first robotic arm assembly for capturing and releasing a semiconductor wafer, a second robotic arm for capturing and releasing an interleaf, and a controller for actuation of the first and second robotic arms, the f...
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WO2003106310A9 |
A specially adapted SMIF pod (20) receives and holds one particular type of reticle cassette (36) or reticle holder (132) selected from among dozens of different configurations thereof. The SMIF pod (20) may be interrogated to determine ...
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WO/2004/035493A1 |
Disclosed is an installation which divides glass plates into cuts and comprises at least one cutting location (A, B). In order to align a glass plate that is to be divided or a glass plate cut in a defined position, contact edges (21, 44...
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WO/2004/033149A1 |
A glass pane machining device (1) capable of disposing suction cups at positions most suitable for suckingly fixing a glass pane according to the shape of the glass pane, comprising a grinding means (7) for grinding the peripheral edges ...
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WO2003086917B1 |
A substrate conveying device, wherein air is blown up through a plurality of air holes (4, 18, 12) formed in substrate placing tables (1, 16) and a floating block (11) to float a glass substrate (3), and the floated glass substrate (3) i...
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WO/2004/025711A2 |
A system and method for processing large area substrates is provided. In one embodiment, a processing system includes a transfer chamber having at least one processing chamber and a substrate staging system coupled thereto. The staging s...
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WO/2004/024598A1 |
The present invention refers to a spacer for creating distance (18) and/or absorbing loads, pressure, relative motion between glass sheets (3) and/or between glass packages (5) containing several glass sheets (3), when they are packed in...
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WO/2004/024597A1 |
The present invention refers to a packaging device (1), preferably a support (8), for packing sheet units, preferably glass sheets (3). The packaging device (1) comprises at least one storage unit (6), which is directly or indirectly con...
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WO/2004/025701A2 |
A method and system of optimizing a state change can include isolating a load at a first state, such as a wafer cassette, a wafer photoresist, a prosthetic device, or other device to be implanted, in a load lock of a wafer implanter, and...
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WO/2004/023530A2 |
The invention relates to a system of transporting and storing containers (1) of semiconductor wafers, which is intended to be used in a bay (2) of a wafer factory, said bay comprising one or more wafer processing tools (3, 4). The aforem...
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WO/2004/019375A2 |
A structure for use in a semiconductor processing environment is provided, including a first plate (24), a second plate (26) bonded to the first plate (24). A distal end (32) of the second plate (26) extends beyond a distal end (34) of t...
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WO2003008157A9 |
A substrate transport apparatus comprising a drive section (42), an articulated arm (44), and a gripper. The articulated arm (44) is connected to the drive section (42). The articulated arm (44) has an end effector (64) for transporting ...
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WO/2004/017366A2 |
A reticle manipulating device (1) with an at least substantially closed housing (2) for maintaining clean-room conditions inside the housing, an input/output station (7) for introducing and discharging reticles in and out of the housing,...
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WO2003038869A9 |
The present invention is a wafer transfer system that transports individual wafers between chambers within an isolated environment. In one embodiment, a wafer is transported by a wafer shuttle that travel within a transport enclosure. Th...
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WO2002062680A9 |
A configurable storage system particularly suited for use with clean-environment conveyors is disclosed. The storage system includes modular conveyor track elements (310, 320, 330, 340) which may be provided parallel to and adjacent a ce...
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WO/2004/012873A1 |
A lens holding jig used for immersing a lens (L) in a liquid by holding the lens (L) at at least three positions that are side holding portions (41, 42) for holding both left and right edges of the lens (L), and at a lower-side holding p...
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WO/2004/011248A1 |
A method of transporting precision equipment materials without absorption of thermal energy through the heat sensitive material or device such as flat panel displays. The transfer member has a carbon fiber reinforced composite material b...
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WO/2004/010476A2 |
A semiconductor workpiece processing apparatus (10) having a first chamber (18), a transport vehicle (22), and another chamber. The first chamber (18) is capable of being isolated from an outside atmosphere. The transport vehicle (22) is...
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WO/2004/009862A2 |
A substrate processing apparatus having a station (140) for loading and unloading substrates from the apparatus, includes an aperture closure for sealing a loading and unloading aperture of the station (140), apparatus (230, 235) for rem...
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WO/2004/010171A1 |
A production line system comprises a core apparatus (10) of a stacker crane form in which system a glass substrate-receiving cassette is stored and transported, and comprises various processing lines for producing color filters, includin...
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WO/2004/009480A1 |
The invention relates to a concept for handling and processing thin glass and ultra-thin glass (glass having a thickness that does not significantly exceed 200 nm) by means of a detachable joining to a stable support, whereby existing su...
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WO/2004/010480A1 |
An apparatus through which a substrate may be transferred between a first chamber and a second chamber in which the first chamber is maintained at a high temperature relative to the ambient temperature of the second chamber. The apparatu...
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WO/2004/008505A2 |
A method and apparatus for preventing substrate damage in a factory interface. In one embodiment, a method for preventing substrate damage in a factory interface includes the steps of receiving an indicia of potential substrate damage, a...
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WO/2004/007164A1 |
A cutting device (400) has a first cutting device (410) opposed to a first base board, and a second cutting device (420) opposed to a second base board. The first cutting device (411) has a cutter wheel (412) for forming a scribe line in...
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WO/2004/005106A1 |
A device for handling glass or other sheet material is in the form of a wheeled trolley capable of manual manipulation and having a support shaft which extends upright in use of the trolley. Two or more vacuum grips are mounted on the sh...
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WO/2004/002704A1 |
A glass plate hole forming device (1) comprises a recess forming means (8) that, in a recess forming area (2), forms a recess (5) in the upper surface (4) of a glass plate (3) and that forms a recess (6) in the lower surface (7) of the g...
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WO/2003/103845A1 |
A nozzle device and a substrate processing device capable of preventing liquid from dripping after completing the application of the liquid and forming processing liquid film of uniform thickness on a substrate with small amount of proce...
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WO/2003/105218A1 |
A receiving container body for an object to be processed comprises a box container that is capable of receiving an open-type cassette capable of holding first objects to be processed and has a size capable of receiving second objects to ...
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WO/2003/102476A1 |
A sheet-like electronic component clean transfer device, wherein a first floor (11) formed of punched plate and allowing air to flow thereto is installed in the casing (2a) of the clean transfer device (2) just under an arm (17) at the m...
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WO/2003/100836A1 |
In accordance with one aspect of the present invention, a method is provided for transporting a workpiece in a semiconductor processing apparatus comprising a transfer chamber, a process chamber, and a gate valve between the transfer cha...
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WO/2003/095341A1 |
A conveying device capable of conveying base material without damaging it, the maintenance operation thereof being easy to perform. A feed roller (23) is provided with a ring member (24) in direct contact with a glass base plate (7), and...
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WO/2003/096395A1 |
A semiconductor manufacturing apparatus (76) of minienvironment system for conveying a wafer (73) up to a semiconductor manufacturing apparatus equipped with a wafer carry−in opening (98) with a wafer hermetic container (71). This appa...
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WO/2003/093144A2 |
A conveyor (10) for moving hot or cold material along a trough (12) receiving the material. One or more heat transfer fluid flow tubes (36) extend over the outer surface of a trough liner wall (38) to indirectly cause cooling or heating ...
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WO/2003/094211A1 |
A multi-set robot is provided that includes a first robot set having a first motor coupled to a first rotatable member that is rotatable about an axis; a second motor coupled to a second rotatable member that is rotatable about the axis;...
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WO/2003/092050A2 |
A wafer handler having a central body with a first end and a central axis of rotation is provided. A first end effector, adapted to support a first wafer, is rotatably coupled to the first end of the central body so as to define a first ...
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WO/2003/089345A1 |
A stackable, folding transport rack (10) generally including a base, (12) a plurality of supports, (14) at least one foldable A-frame (16) hingedly secured to the base (12) and an optional securing assembly (18). The base (12) of the tra...
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WO/2003/086914A1 |
The invention relates to a holding-down device (23) for pressing essentially flat products to be transported onto transport rolls, and a transport system. Said essentially cylindrical holding-down device (23) is embodied in at least two ...
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WO/2003/086913A1 |
The invention relates to transport rolls for transporting essentially flat products to be transported, and to a transport system. The transport roll is embodied in at least two parts and consists of an axle element and at least one track...
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WO/2003/088350A1 |
A closed container conveying system (10) used in a production line inside a clean room and capable of freely conveying closed containers (6) between a plurality of processing devices in the clean room, comprising a plurality of closed co...
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WO/2003/088326A2 |
One or more of three different measures are taken to preheat a wafer (44) before it is loaded into direct contact with a wafer holder (42), in order to provide optimal throughput while reducing the risk of thermal shock to the wafer (44)...
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WO/2003/085704A2 |
The invention concerns a device for accommodating substrates (S), particularly wafers or silicon substrates used for producing photovoltaic elements. The inventive device comprises two walls (1) situated opposite one another, whereby at ...
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WO/2003/084043A2 |
A linear motion assembly (300) is provided as part of a robot for processing substrates in a vacuum. An effector assembly (12) is mounted for linear movement on linear bearings (34). The end effectors are driven by cables (60)which in tu...
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