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WO/2005/074020A1 |
A semiconductor manufacturing apparatus (100) comprises vacuum vessels (10, 20) separated by a shutter (30) and corresponding to processing sections, evacuators (11, 21) connected to the respective vacuum vessels (10, 20), guide plates (...
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WO/2005/071736A1 |
A substrate holding device, comprising a support structure (23) fitted to a hand body (22) and supporting the peripheral edge parts of a substrate from the lower side, first and second guide parts (51a) and (51b) fitted to the hand body ...
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WO/2005/067634A2 |
Workpiece processing uses a transfer chamber (12) in cooperation with a process chamber (32). The workpiece (30) is to be heated to a treatment temperature, at a preheating pressure, and subsequently exposed to a plasma at a treatment pr...
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WO/2005/063456A1 |
A handling device, wherein a floating plate (41) is installed in a device body (10) installed on a moving member movably in the radial direction, and a work holder holding a work is fitted to the floating plate (41). A lock plate (33) ti...
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WO/2005/057627A2 |
A system (100) for manufacturing product, in which a first work station (101) is operable to perform a first manufacturing action on the product parts; this first station has a first entrance (l0la) and a first exit (101b). A second work...
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WO/2005/054085A1 |
The invention provides a glass plate packing box, a glass plate packing method, a glass plate unpacking method and a glass plate unpacking device, which allows efficient conveyance of large-sized glass plates for flat panel displays (liq...
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WO/2005/053925A1 |
A substrate machining device for dicing a motor substrate into unit substrates, comprising a scribe part forming scribe lines on the motor substrate, a break part breaking the mother substrate along the formed scribe lines, and a substra...
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WO/2005/047198A1 |
The invention relates to a method and machine for the production of convex glass sheets. According to the invention, the glass sheets (1) are brought to the softening temperature thereof and are then conveyed to a formation block (6) com...
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WO/2005/045920A1 |
It is arranged that boards can be carried in and out of optional shelves in a board cassette. When it is desired to carry out a board (1G) stored in each shelf (1R) formed as a shelf plate by use of a plurality of wires (4) attached unde...
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WO/2005/037452A1 |
An apparatus or system for handling and processing of substrates, more specifically electro-chemically active metal substrates, including a bath or dipping station having an autodepositable coating composition. In one embodiment, the app...
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WO/2005/037691A1 |
A free ball bearing (1, 11), comprising a body (2, 12) with a semi-spherical recessed face, a large number of small balls (3, 13) disposed in the semi-spherical recessed face of the body, a large ball (4, 14) placed on the large number o...
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WO/2005/036635A1 |
A teaching tool (11) enabling an increase in accuracy for estimating the position of a wafer, the accurate positioning thereof even in a device of such type that supports the wafer by a pin, and the self-collection thereof by the robot. ...
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WO/2005/035147A1 |
The invention relates to a holding device for very thin substrates, comprising a frame structure (1) and at least one holder (2) that is mounted within or on the frame structure (1). The at least one holder forms a plurality of intermedi...
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WO/2005/028172A1 |
A substrate dicing system enabling a reduction in an overall size and capable of efficiently dicing various substrates, comprising a pair of scribing line forming means disposed oppositely to each other, a pair of scribing devices suppor...
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WO/2005/026066A2 |
A method is described herein for packaging a plurality of glass sheets by: (1) coating a top surface of each glass sheet with a removable top protective film; (2) coating a bottom surface of each glass sheet with a removable bottom prote...
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WO/2005/022627A1 |
A substrate processing device comprises a plurality of processing chambers (20) for applying processing to internally received substrates, a transfer case (24) for transferring received substrates to the processing chambers (20), and a m...
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WO/2005/014497A1 |
Disclosed is a glass cutting table (1) comprising a support in the form of a plate (3) for the glass plate that is to be divided, a cutting bridge (4) which can be displaced along the support and on which a cutting head (6) encompassing ...
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WO/2005/014182A2 |
The invention relates to a device (1) for hardening a coating of an object (4), more particularly a car body, said coating consisting of UV paint or a thermally hardening paint. The inventive device comprises at least one radiator (12) p...
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WO/2005/012816A2 |
The invention relates to a device (10) for hardening an UV varnish and thermohardening varnish or the similar for coating an object, in particular a motor car body (12) comprising at least one emitter (48, 48'') generating electromagneti...
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WO/2005/010980A1 |
A structure for supporting a bellows (1) from the inside has a guiding track (8) provided inside the bellows and extending in the axial direction of the bellows. A moving member (10) is provided so as to be movable in the bellows’ axia...
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WO/2005/004230A1 |
A carrying apparatus and a carrying control method for sheet-like substrates, the apparatus for carrying the sheet-like substrates such as liquid crystal display panels and glass substrates into a treatment device, comprising a rather la...
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WO/2005/002804A1 |
The invention relates to a transfer device for transferring thin plate-like articles, such as liquid crystal display panels and glass substrates, into a processing device. The invention provides, in a transfer device provided with a rela...
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WO/2005/004228A1 |
A device for treating an object to be treated is characterized by having a separation wall, an opening portion, a door mechanism, a lid body opening/closing mechanism, drive means, a cover member, and a gas-discharging mechanism. The sep...
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WO/2005/001363A1 |
The invention relates to a device for the automated handling of ceramic moulded parts of different shapes and sizes, especially for placing said moulded parts on a combustible product support and removing the same therefrom.
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WO/2005/001925A1 |
A vacuum processing device operating method for performing a high purification degree of processing for which contamination of atmosphere should be avoided and for performing a medium purification degree of processing for which contamina...
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WO/2005/001896A2 |
A wet chemical processing chamber comprising a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the...
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WO/2004/113205A1 |
A thin plate-supporting body for supporting ridges produced in a glass substrate (6) for a large-sized liquid crystal display device when the glass substrate (6) bending by its own weight is placed in position. The supporting body suppor...
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WO/2004/112106A1 |
A flat transmission type resist exfoliating apparatus capable of solving a problem on the generation of strong lye by mixing a remover with washing water without using a liquid substitute. A substrate (40) is passed in order through a pe...
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WO/2004/110698A2 |
Tools having mounting modules with registration systems are disclosed. The mounting includes positioning elements for precisely locating a reactor and a workpiece transport that moves workpieces to and for the reactor. The relative posit...
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WO/2004/107412A2 |
A transfer system for use with a tool for treating a work-piece at sub-atmospheric pressure such as an ion implanter for implanting silicon wafers. An enclosure defines a low pressure region for treatment of work-pieces placed at a work-...
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WO/2004/100254A1 |
A suction pad (16) is placed on a tube member (15) in an opening portion (1b) of a housing (1). The suction pad (16) has a suction portion (16a) and a hemispherically curved contact surface portion (16c) being in point-contact at at leas...
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WO/2004/097912A1 |
The plasma produced by an electrode is reliably prevented from entering the space behind the back of a substrate (4) even though a large mask panel (35) wholly covering the edge of the substrate (4) is not installed in a film-forming cha...
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WO/2004/096679A1 |
A contact member (13) provided on the top of a support member (10) is lifted by a lifting mechanism (6) with a substrate (2) levitated. This causes the contact member (13) to be in contact with the back face of the substrate (2), limitin...
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WO/2004/096678A1 |
The invention relates to a device for transporting a flat substrate through a coating plant consisting, for example of a plurality of different sputtering cathodes to which flat substrates, for example glass plates, are successively tran...
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WO/2004/089792A1 |
This invention is intended to provide a conveying system that can convey thin and large plate-shaped members such as LCD, PDP, and organic EL without generating dust or causing damage to the plate-shaped members, and to improve the perfo...
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WO/2004/090948A1 |
A substrate handler is provided comprising a carriage positionable along a first axis of motion, a first substrate gripper coupled to the carriage and positionable relative to the carriage along a second axis of motion oriented substanti...
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WO/2004/084297A1 |
A workpiece processing system, which is capable of accurate and efficient positioning during teaching. A workpiece processing system, comprising processing devices (12A, 12B) having mounts (14A, 14B) for mounting workpieces (W) thereon f...
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WO2004025713A9 |
A system for handling substrates held in a carrier, the system comprising a robot having an articulating robotic arm, a processor for controlling the robotic arm, an end effector attached to a moveable end of the robotic arm, the end eff...
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WO/2004/081996A1 |
A gate valve (20) for a semiconductor treatment system, comprising a housing (21) forming a plurality of passages (22A to 22D) arranged parallel with each other along a first direction, the passages further comprising ports (23A to 23D) ...
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WO/2004/079496A2 |
A method for supporting a flat substrate (122) during fabrication, employing a fluid flow supporter (125,127) operating at a first fluid pressure and a first flow volume. A high pressure, low volume, fluid input is converted to reduce th...
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WO/2004/079283A1 |
A carrying mechanism used for carrying in order a plurality of heated articles in a heat treating furnace for heat-treating the heated articles, comprising wire materials (5) installed to be moved relative to the heat treating furnace, w...
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WO/2004/075286A1 |
A transfer device (17) in a semiconductor processing system includes first and second actuation mechanisms (9A, 9B) having first and second support sections movable on first and second vertical planes, respectively, the latter being para...
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WO/2004/075285A1 |
A substrate transporting robot incorporated in a substrate treating device has a pair of holding columns (35R and 35L). The columns (35R and 35L) are constituted so that the columns (35R and 35L) can be rotationally moved around a shaft ...
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WO/2004/069695A2 |
A conveyor assembly (10) including a conveyor (16) defining a conveying direction and a carrier assembly (22) operably coupled to the conveyor (16). The carrier assembly includes a carrier frame (30), a rotating mechanism (40) coupled to...
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WO/2004/069698A2 |
Thc present invention provides an improved transport system for transfer of media. More specifically, the present invention provides a transport system having shared load-lock front-end assembly or subsystem (100) suitable for transferri...
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WO/2004/068563A2 |
According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop alo...
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WO/2004/066379A1 |
There is provided a substrate processing device capable of improving the foot print and having an excellent extension characteristic. In the substrate processing device, a stage capable of rectilinear movement not requiring rotational op...
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WO/2004/055229A2 |
A reinforcing underlayment including dry uniform particles evenly applied to a wet bonding material layer on a surface of a substrate. The substrate, including the layers, is then cured to harden the one or more of the layers. A final co...
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WO/2004/055890A1 |
One embodiment of the present invention provides a system that uses electrostatic forces to align semiconductor chips relative to each other. The system operates by fabricating a first set of conductors (GND, Vpp) on the top surface of a...
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WO/2004/052763A1 |
Methods and apparatus for useful for protecting stacked sheets are provided. A separator (306) in accordance with an exemplary embodiment of the present invention comprises a film (320) carrying a plurality of particles (322). Each parti...
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