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JP7207392B2 |
An acrylic rubber composition includes a carboxyl group-containing acrylic rubber; a polyvalent amine compound; and a heteroatom-containing alcohol.
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JP7203409B2 |
To provide bismaleimide having both excellent dielectric characteristics (dielectric constant and dielectric loss tangent) and excellent dimentional stability, and usable as an isolation layer of a printed circuit for a high-frequency ba...
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JP2023000739A |
To provide an antimicrobial particle dispersion which has high safety and a wide antimicrobial spectrum, and exhibits stable antiseptic effect (bactericidal and fungicidal properties) and excellent redispersibility even under harsh stora...
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JP7187048B2 |
Disclosed are methods, compositions, reagents, systems, and kits to prepare and utilize branched multi-functional macromonomers, which contain a ring-opening metathesis polymerizable norbornene group, one or more reactive sites capable o...
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JP2022183267A |
To provide a (co)polymer that has an improved property in terms of filterability and an improved chemical and thermal stability as compared to conventional ATBS-made polymers.The problem is solved by a (co)polymer that is a (co)polymer o...
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JP2022173419A |
To provide novel compounds, and specifically, bis compounds comprising a photoactive unit, the novel compounds being specifically suitable for compositions and ophthalmic devices.The invention provides oligomers or polymers that are poly...
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JP7172975B2 |
A novel onium salt of formula (1) and a chemically amplified resist composition comprising the same as a PAG are provided. When processed by photolithography using KrF or ArF excimer laser, EB or EUV, the resist composition has a high se...
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JP2022167874A |
To provide a method for producing a resin-containing composition, the method enabling production of a resist pattern that is reduced in defects, and enabling production of a resin-containing composition having good storage stability, and...
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JP2022167863A |
To provide a method for producing a resin-containing composition which enables production of a resist pattern that is reduced in defects, and enables production of a resin-containing composition having good storage stability, and a resin...
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JP2022167861A |
To provide a method for producing a resin-containing composition which enables production of a resist pattern that is reduced in defects, and enables production of a resin-containing composition having good storage stability, and a resin...
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JP2022165898A |
To provide a molded article that achieves both washability of oil-based contamination and impact resistance, and a sensor cover.A molded article includes a base material and a surface protective layer. A polar component of surface energy...
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JP2022164255A |
To provide methods for purifying a membrane protein complex-derived protein by eluting the membrane protein complex in the complexed state even when the protein complex is formed.Provided is a method for purifying a membrane protein comp...
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JP2022161634A |
To provide a solid surface hydrophilizing method having a high hydrophilizing effect.A solid surface hydrophilizing method includes a step 1 of bringing an aqueous medium into contact with a solid surface to which a surface treatment com...
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JP7150737B2 |
The invention relates to novel polymerizable compounds of formula (I), especially to compounds comprising a photoactive unit, said compounds being suitable for ophthalmic devices, in particular for intraocular lenses. The invention also ...
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JP2022542823A |
The present invention belongs to a three-dimensional printing method. The present invention relates to a method for printing three-dimensional articles, a system thereof, its use and three-dimensional prints produced by the method. The p...
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JP7147680B2 |
The present invention provides a heat-curable maleimide resin composition capable of yielding a cured product superior in tracking resistance (high comparative tracking index, CTI) and a semiconductor device encapsulated by the cured pro...
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JP2022144651A |
To provide an adhesive sheet and a laminate sheet excellent in durability that do not generate delamination when folding, in particular, when folding in a low temperature state, and excellent in performance of recovering rapidly to a fla...
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JP2022142745A |
To provide: a novel photosensitive resin precursor that can undergo alkali development, can undergo ring closure even at a low temperature, and preferably has excellent heat characteristics and electrical characteristics after curing; an...
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JP7140307B1 |
The present invention provides a maleimide resin and a maleimide compound characterized by being a maleimidated product of a polyamine compound (C) which is a reaction product of a plurality of types of aromatic monoamine compounds (A) a...
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JP7135328B2 |
The invention provides a liquid crystal aligning agent, a liquid crystal alignment film and a manufacturing method thereof, and a liquid crystal element. When a polymer having a main skeleton different from that of polyamic acid, polyami...
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JP7130922B2 |
To provide a printed wiring board excellent in metal foil adhesion and heat resistance.In a printed wiring board having a cured product of a prepreg containing a thermosetting resin composition, a wiring circuit portion provided on the c...
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JP7128877B2 |
The invention relates to a solid single-ion conductive polymer comprising a repeat unit of formula (Ia):wherein R1 is H, or C1 to C16 linear or branched alkyl, alkenyl, alkinyl;m is 1 to 5;each M+ is independently selected from Li+, Na+ ...
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JP2022535815A |
The polyfunctional compound is represented by the formula XC(R)RF-Y, where X and Y are each independently -C(O)-OM, -C(O)-HAL, -C( O)-NR12, -CN, -C(O)NR1-SO2-Rf1-W, or a fluorinated alkenyl group optionally interrupted by one or more -O-...
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JP7104366B2 |
To provide a photopolymerization sensitizer providing practically sufficient photosetting rate.There is provided a 9,10-bis(dihydroxyalkoxy)anthracene compound having a primary hydroxyl group represented by the general formula (1). In th...
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JP7102992B2 |
A composition contains an acrylamide compound A1 having an ester structure and a polymerization initiator B1 having a molecular weight of 800 or more.
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JP7098686B2 |
To provide a water dispersion composition for heat sealants that has excellent heat sealability and heat seal layer blocking resistance without using a lamination process.A water dispersion composition for heat sealants contains an aliph...
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JP2022102940A |
To provide a novel resin composition capable of forming a molding having excellent transparency, hardness, thermostability, optical properties or the like.The inventive composition is (i) or (ii) described below: (i) a composition that c...
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JP2022098629A |
To provide a composition for forming a coating film on a metal surface (a composition for forming an oxidation-preventing film of rewiring for semiconductor to prevent surface oxidation of rewiring metal, a composition for forming an oxi...
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JP7093246B2 |
To provide a lens made of a methacrylic resin that has high heat resistance, high light transmittance and a small change in color.A lens contains 100 pts.mass of a methacrylic resin, 5×10to 4×10pts.mass of metal elements whose atomic n...
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JP7089487B2 |
The present invention relates to a compound according to Formula (3), wherein the compound comprises from 28 wt.% to 100 wt.% bio-based carbon content, relative to the total mass of carbon in the compound, measured according to standard ...
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JP7088457B2 |
To provide a resin emulsion excellent in fixability to a resin printing medium and resistance to document offset properties at a high temperature when being mixed in ink and printed on the medium, and to provide aqueous ink containing th...
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JP7087295B2 |
To provide a novel polymer which can be converted to an optical compensation film having excellent phase difference characteristics such as having a high phase difference even in a thin film and the like and compatibility.Provided is a p...
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JP2022089100A |
To provide: a curable composition that can contain a heterocyclic compound (A) having a triazine ring as a component for increasing the refractive index of a cured product at high concentration and gives a cured product which exhibits a ...
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JP7078089B2 |
To provide a polymerizable compound giving such properties when added to a solution comprising a polymerizable composition that the resultant polymerizable composition has high storage stability and can induce a liquid crystal phase alig...
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JP7078047B2 |
This specification provides an aqueous binder for a non-aqueous-electrolyte secondary battery, and a composition for a non-aqueous-electrolyte secondary battery electrode mixed layer and non-aqueous electrolyte secondary battery electrod...
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JP2022526988A |
The present invention relates to a photocurable composition comprising a cyanoacrylate component, a metallocene component, a photoinitiator and a plasticizer component, wherein the reaction product exhibits improved flexibility, among ot...
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JP7069618B2 |
To provide a maleimide compound, and a composition and a cured product using the maleimide compound.There are provided: a maleimide compound represented by formula (1); a composition containing the compound; a cured product obtained by c...
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JP7066654B2 |
A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) b...
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JP7065135B2 |
The disclosed technology relates to pure polyitaconic acid homo- and co-polymers free of the less reactive tri-substituted vinyl monomers (e.g., citraconic acid or mesaconic acid) that may be used, for example, as builders in detergent a...
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JP2022064623A |
To provide a bonding material excellent in adhesive strength to a poorly adhesive material, and an article obtained by using the bonding material.The bonding material is a curable composition which contains a 2-cyanoacrylate compound rep...
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JP2022064622A |
To provide a sealing agent excellent in sealability and quick curability, and an article obtained by using the sealing agent.The sealing agent is a curable composition which contains a 2-cyanoacrylate compound represented by the followin...
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JP2022064605A |
To provide a curable composition for producing a peelable adhesive article, which gives a cured product excellent in re-adhesiveness.The curable composition for producing a peelable adhesive article is a curable composition which contain...
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JP2022064606A |
To provide a curable composition for bonding an optical component, which gives a cured product having optical transparency and excellent adhesiveness.The curable composition for bonding an optical component is a curable composition which...
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JP2022064607A |
To provide a curable composition for a vibration absorbing material, which gives a cured product having vibration absorbing ability and excellent adhesiveness.The curable composition for a vibration absorbing material is a curable compos...
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JP2022062515A |
To provide a phenolic hydroxy group-containing resin that has excellent developability even with tetramethylammonium hydroxide used as a developer and is suitable for a photosensitive resin composition with excellent colorant dispersibil...
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JP7055968B2 |
Composite granules that contain a binder and a polymeric sorbent material for capturing aldehydes such as formaldehyde are provided. Additionally, methods of making the composite granules, methods of using the composite granules to captu...
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JP7055967B2 |
Composite granules that contain a binder and a polymeric sorbent material for capturing aldehydes such as formaldehyde are provided. Additionally, methods of making the composite granules, methods of using the composite granules to captu...
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JP7056024B2 |
A resin comprising a structural unit represented by formula (I0):wherein A1, A2 and A3 each independently represent a C2-C18 divalent hydrocarbon group,R1, R2, R3 and R4 each independently represent a hydrogen atom or a C1-C6 saturated h...
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JP7054061B2 |
The present invention provides a resin composition for an underfill material, comprising a maleimide compound (A) and a secondary monoamino compound (B), wherein the secondary monoamino compound (B) has a boiling point of 120°C or more.
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JP2022051791A |
To provide a process for preparing N,N-(di)alkylaminoalkyl(meth)acrylamide or N,N-(di)alkylaminoalkyl (meth)acrylate and the quaternary ammonium salts thereof with a low content of a compound of formula (IV), and to provide a process for...
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