| Document |
Document Title |
|
WO/2021/246479A1 |
One purpose of the present invention is to provide a novel dihydrazide compound. Another purpose of the present invention is to provide: a curable resin composition which contains the above-described dihydrazide compound and exhibits exc...
|
|
WO/2021/240328A1 |
The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a thermally curable resin; a thermal curing initiator for the thermally curable resin; a radiation self-polymerizable multi-functiona...
|
|
WO/2021/241286A1 |
Provided is an epoxy resin composition that contains an epoxy resin (A), a curing agent (B), and an imidazole adduct type curing accelerator (C). The curing agent (B) contains a compound (B-1) represented by formula (B-1) [R1 represents ...
|
|
WO/2021/241288A1 |
Provided is an epoxy resin composition which comprises an epoxy resin (A), a hardener (B), and an imidazole adduct type hardening accelerator (C), wherein the hardener (B) includes a compound (B-1) represented by formula (B-1) [wherein R...
|
|
WO/2021/241513A1 |
A compound which comprises a metal powder and a resin composition comprising an epoxy resin, a hardener, and a dispersant, wherein the content of the metal powder is 90-98 mass% and the dispersant comprises a phosphoric acid ester.
|
|
WO/2021/241287A1 |
Provided is an epoxy resin composition which comprises an epoxy resin (A) and an imidazole adduct type hardening accelerator (B) and contains no phenolic hardener, the epoxy resin composition having a chlorine content of 1,350 mass ppm o...
|
|
WO/2021/241734A1 |
The present invention addresses the problem of providing an epoxy resin composition which has an extremely low viscosity and excellent impregnation properties, is resistant to an increase in viscosity at an injection temperature, is stab...
|
|
WO/2021/239686A1 |
The present invention is directed to a liquid one component (1K) composition comprising, based on the weight of the composition: from 10 to 90 wt.% of a) at least one epoxy resin; from 0.5 to 30 wt.% of b) at least one organoboron compou...
|
|
WO/2021/241521A1 |
This compound comprises at least a metal powder and a resin composition. The resin composition contains at least an epoxy resin and a phosphoric acid ester, and the metal powder content of the compound is 97.0 to 97.5 mass%.
|
|
WO/2021/241437A1 |
This photosensitive composition includes a polymerizable compound and a photoinitiator, and contains hydroxy compounds having 2-40 carbon atoms at a concentration of 0.01-12000 ppm. The hydroxy compounds having 2-40 carbon atoms may incl...
|
|
WO/2021/241548A1 |
One purpose of the present invention is to provide a curable resin composition having excellent applicability by spin coating and giving cured objects which are excellent in terms of adhesiveness and long-term heat resistance. Another pu...
|
|
WO/2021/241129A1 |
The present invention addresses the problem of providing a sealant for display devices, which has low viscosity, high viscosity stability, and low-temperature curability, and can form a cured product having high moisture resistance. Th...
|
|
WO/2021/241515A1 |
This compound contains at least a metal powder and a resin composition; the resin composition contains at least an epoxy resin and a phosphoric acid ester; and the content of the epoxy resin in the compound is from 1.0% by mass to 2.0% b...
|
|
WO/2021/235480A1 |
Provided is a curable epoxy composition from which it is possible to form a cured product having excellent heat resistance even in a high temperature environment. This first curable epoxy composition contains an alicyclic epoxy compoun...
|
|
WO/2021/234012A1 |
The present invention relates to resin-composition which is curable and polymerizable by an electromagnetic radiation. The composition comprises one or more polymerizable and/or crosslinkable organic compounds; a photoinitiator comprisin...
|
|
WO/2021/235299A1 |
Provided are: a photosensitive resin composition capable of patterning at exceptional resolution by alkaline development, the photosensitive resin composition yielding a cured product that can be applied to an insulating film, etc., havi...
|
|
WO/2021/236893A1 |
Disclosed herein are compounds, compositions, and methods for modulating the monocarboxylic acid transporter 4 (MCT4) with the compounds and compositions disclosed herein. Also described are methods of treating diseases or conditions tha...
|
|
WO/2021/229909A1 |
A fiber treatment agent according to the present invention contains a copolymer (X), a polyepoxy compound (Y) that does not comprise an ethylenically unsaturated bond and does comprise at least two epoxide groups per molecule, and an aqu...
|
|
WO/2021/230002A1 |
The present invention provides a curable composition capable of giving thermally conductive materials having excellent thermal conductivity. Also provided are a thermally conductive material, a thermally conductive sheet, a device with a...
|
|
WO/2021/230097A1 |
Provided are: an epoxy acrylate resin or an alkali-soluble resin that can be cured by light or heat; and a photosensitive resin composition capable of patterning through alkaline development. This epoxy acrylate resin is represented by g...
|
|
WO/2021/230326A1 |
A primer for forming a primer layer on the surface of a substrate having surface free energy of 50 mN/m or higher, the primer including a liquid crystalline epoxy compound and a curing agent.
|
|
WO/2021/229028A1 |
The present invention relates to a fire protection composition, comprising a component A and a component B. The component A comprises an epoxy liquid resin and ammonium polyphosphate. The component B comprises: - an adduct B1 of (i) at l...
|
|
WO/2021/230336A1 |
An objective of the present disclosure is to provide: a novel epoxy resin that makes it possible to obtain a cured product with excellent heat resistance and mechanical characteristics, and that is useful as an electronic material, vario...
|
|
WO/2021/230335A1 |
An objective of the present disclosure is to provide: a novel epoxy resin that makes it possible to obtain a cured product with excellent heat resistance and mechanical characteristics, and that is useful as an electronic material, vario...
|
|
WO/2021/229008A1 |
The present invention is directed to a polymeric thermosetting multi-component powder composition for use in a 3D printing process comprising at least component A and component B, wherein component A is present in a multitude of discrete...
|
|
WO/2021/230112A1 |
The present invention provides a method for manufacturing a cartridge-type hollow fiber membrane module comprising: a casing; a hollow fiber membrane bundle having a plurality of hollow fiber membranes positioned in the casing; a first p...
|
|
WO/2021/229006A1 |
The present invention relates to a thermosetting material for use in additive manufacturing, the material comprising at least one thermosetting resin and at least two curing compounds different from said thermosetting resin that are able...
|
|
WO/2021/230152A1 |
Provided are: a polyorganosilsesquioxane from which it is possible to form a cured product having excellent mechanical properties and surface hardness; and a curable composition containing said polyorganosilsesquioxane. The polyorganos...
|
|
WO/2021/229012A1 |
The present invention relates to a thermosetting material for use in a 3D printing process comprising: a) at least one epoxy resin A, b) at least one elastomer-modified epoxy resin B, c) at least one resin C with a dynamic viscosity of b...
|
|
WO/2021/217551A1 |
Disclosed are a composite material for preparing a dumbbell and a method for manufacturing a dumbbell using same. The material comprises the following components in parts by weight: 65-70 parts of a bisphenol A type epoxy resin; 45-50 pa...
|
|
WO/2021/220711A1 |
Provided is an electroconductive composition that has good shielding properties against electromagnetic waves of 100 MHz to 1 GHz, and excellent filling properties for a trench portion formed in a molded resin. An electroconductive com...
|
|
WO/2021/220741A1 |
The present invention provides a polarizing plate having excellent durability despite being extremely thin. A polarizing plate according to the present invention has a polarizer, and a protective layer that is disposed on one side of the...
|
|
WO/2021/220864A1 |
Provided is an epoxy resin composition comprising (A) a blocked polyurethane, (B) an epoxy resin that has more than two glycidyl groups in each molecule, (C) an epoxy resin that has not more than two glycidyl groups in each molecule, and...
|
|
WO/2021/220740A1 |
The present invention provides a polarizing plate having excellent durability and excellent flexibility despite being extremely thin. A polarizing plate according to the present invention has a polarizer, and a protective layer that is d...
|
|
WO/2021/220726A1 |
An epoxy resin composition for sealing, according to the present invention, contains an epoxy resin, a phenol curing agent, an inorganic filler, and triazine ring-containing compound, and the content of the phenol curing agent is 40 wt. ...
|
|
WO/2021/220090A1 |
Provided is a curative part usable in a two-part curable composition. The curative part includes a liquid amine; a heterogeneous dispersant; and core-shell rubber particles having an elastomeric core and a (meth)acrylic shell. The core-s...
|
|
WO/2021/215106A1 |
The present invention provides a polyorganosilsesquioxane which forms a cured product having a high hardness by means of curing, and which is suppressed in the progress of a curing reaction when heated at around 80°C to 350°C. A poly...
|
|
WO/2021/215542A2 |
A material with a primer, including a material layer and one layer or plural layers of a primer layer laminated on the material layer, at least one layer of the primer layer being an in situ polymerization composition layer containing a ...
|
|
WO/2021/212314A1 |
Disclosed is a thermosetting resin composition, comprising an epoxy resin, a styrene maleic anhydride copolymer, a cyanate resin, a maleimide resin, tetrabromobisphenol A and a filler. The epoxy resin comprises a bromine-containing epoxy...
|
|
WO/2021/216435A1 |
Presently described are curable compounds and curable compositions. Thermosets including the curable compounds and curable compositions described herein are derived from bio-based components and have improved mechanical properties. The d...
|
|
WO/2021/207777A1 |
The invention relates to a curable composition for producing a vitrimer, comprising: a) a crosslinkable monomer, comprising at least one amino group -NR1R2, wherein R1 and R2 represent a glycidyl group, and optionally at least one furthe...
|
|
WO/2021/210625A1 |
A curable resin composition which comprises a block polymer including a polyimide unit and a polymer unit of ethylenically unsaturated monomers, the units having been connected to each other by a residue of a chain-transfer agent, and a ...
|
|
WO/2021/210219A1 |
Obtained is an epoxy resin composition, for a fiber-reinforced composite material, which can be shaped at low temperature and low pressure, has sufficient heat resistance and mechanical properties for practical purposes, and is capable o...
|
|
WO/2021/210587A1 |
A polyfunctional compound represented by formula (1). (In the formula, X represents a carbon atom or a C1-20 n-valent linking group, Ar represents an arylene group, R1 each independently represent a divalent group including a polymer blo...
|
|
WO/2021/210588A1 |
Provided is a curable resin composition with which it is possible to achieve excellent adhesion between an insulation layer and a conductor layer, even when the surface irregularities (surface roughness) are small (e.g., even when Ra is ...
|
|
WO/2021/210384A1 |
Provided is an epoxy resin composition that uses a curing accelerator that is an excellent curing accelerator for reactions between epoxy resins and curing agents and that does not produce free chlorine. The present invention is an epoxy...
|
|
WO/2021/200511A1 |
A compound represented by formula (1). (In the formula, R1 and R3 each independently represent a hydrogen atom or a methyl group, R2 represents a C1-10 alkyl group, a C1-10 alkoxy group, a halogen atom, a benzoyl group capable of having ...
|
|
WO/2021/197842A1 |
The present invention relates to an aqueous coating composition, preferably an aqueous sanding surfacer or primer-surfacer, containing an aqueous epoxy resin dispersion (A), an aqueous amine-functional resin dispersion (B) and an aromati...
|
|
WO/2021/201046A1 |
The present invention provides: a polyhydric hydroxy resin which enables the achievement of a cured product that is excellent in terms of heat resistance, low thermal expansion properties, moisture resistance and the like, and which is u...
|
|
WO/2021/196510A1 |
The present invention provides a high thermal conductivity electrical insulation packaging material and a preparation method therefor. Specifically, the packaging material provided by the present invention is a mixture composed of an imi...
|
