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Matches 1 - 50 out of 4,155

Document Document Title
WO/2018/099110A1
A silicon nitride chemical-mechanical polishing solution, comprising abrasive particles, a compound containing one or more carboxyl groups, and an anionic surfactant containing long alkyl chains. The silicon nitride chemical-mechanical p...  
WO/2018/099109A1
A chemical-mechanical polishing solution having high silicon nitride selectivity, comprising abrasive particles and a compound containing one or more carboxyl groups. The polishing solution has a high SiN polishing rate, a low Teos polis...  
WO/2018/099111A1
The present invention relates to a chemical-mechanical polishing solution having high silicon nitride selectivity, comprising water and abrasive particles and further comprising a heterocyclic compound containing one or more carboxyl gro...  
WO/2018/101583A1
A slurry composition for polishing an organic film of the present invention comprises an oxidant, an organic acid, a polishing accelerator comprising a repeating unit derived from maleic acid or maleic anhydride, and water, wherein the p...  
WO/2018/096991A1
Provided is a polishing composition containing a cellulose derivative, the polishing composition being effective in giving polished surfaces having few defects. This application provides a polishing composition comprising abrasive grains...  
WO/2018/097261A1
The present invention provides a method for polishing a glass substrate, which is capable of maintaining a polishing rate that is higher than ever before for a long period of time in a glass substrate polishing process wherein cerium oxi...  
WO/2018/088370A1
Provided are a polishing composition and a silicon wafer polishing method that are capable of providing a high degree of flatness. The polishing composition contains abrasive particles and a basic compound. These abrasive particles have ...  
WO/2018/088371A1
Provided are a polishing composition and a silicon wafer polishing method that are capable of providing a high degree of flatness. The polishing composition contains abrasive particles and a basic compound. The product of the abrasive pa...  
WO/2018/075409A2
The invention provides a chemical-mechanical polishing composition containing abrasive, a polyhydroxy aromatic carboxylic acid, an ionic polymer of formula (I) wherein X1 and X2, Z1 and Z2, R1, R2, R3, and R4, and n are as defined herein...  
WO/2018/071285A1
CMP compositions providing stable and robust polishing performance at elevated pad or wafer surface temperatures are disclosed, as well as methods for use thereof. The compositions of the disclosure include reaction rate optimizing (RRO)...  
WO/2018/067491A1
An acrylic polymer comprising from 3 to 17 wt% polymerized units of carboxylic acid monomer. The polymer is at least partially neutralized with an amino alcohol having a primary amino group.  
WO/2018/058397A1
A process for chemical-mechanical polishing a substrate containing tungsten includes the steps of providing a substrate; providing a polishing composition which contains: water, an oxidizing agent, guar gum, a dicarboxylic acid, a source...  
WO/2018/061656A1
The purpose of the present invention is to provide, in a method for producing a cationically modified silica which includes modifying a silica raw material using a silane coupling agent, a means for enabling suppression of the occurrence...  
WO/2018/058395A1
A process for chemical-mechanical polishing a substrate containing tungsten includes the steps of providing a substrate; providing a polishing composition which contains: water, an oxidizing agent, xanthan gum, a dicarboxylic acid, a sou...  
WO/2018/058396A1
A process for chemical mechanical polishing a substrate containing tungsten includes the steps of providing a substrate; providing a polishing composition which contains: water, an oxidizing agent, alginate, a dicarboxylic acid, a source...  
WO/2018/055985A1
[Problem] To provide a polishing composition with which it is possible to effectively improve the polishing rate of an object to be polished. [Solution] A polishing composition containing abrasive grains, a polishing accelerator having a...  
WO/2018/057674A1
A CMP slurry including a carrier, a particulate material within the carrier including an oxide, carbide, nitride, boride, diamond or any combination thereof, an oxidizer including at least one material selected from the group of peroxide...  
WO/2018/056122A1
Provided is a slurry containing abrasive particles, glycol, and water, wherein the average particle size of the abrasive particles is 120 nm or less, and the pH of the slurry is at least 4.0 and less than 8.0. Also provided is a polishin...  
WO/2018/048068A1
The present invention relates to surface-modified colloidal ceria abrasive particles, a preparation method therefor, and a polishing slurry composition containing the same. According to one embodiment of the present invention, the surfac...  
WO/2018/038885A1
An acidic slurry composition for use in chemical-mechanical polishing including an acid pH adjuster and a cationic polishing suppressant comprising a quaternized aromatic heterocycle. The quaternized aromatic heterocycle imparts a polish...  
WO/2018/026099A1
The present invention relates to a slurry composition for polishing a tungsten barrier layer. A slurry composition for polishing a tungsten barrier layer according to an embodiment of the present invention comprises abrasive grains and a...  
WO/2018/020931A1
Abrasive grains according to the present invention are abrasive grains in which the surfaces thereof are coated with an additive and that are formed of inorganic abrasive particles having a positive zeta potential at pH 8 or lower. Also,...  
WO/2018/012173A1
The present invention provides a polishing composition which is capable of polishing an object to be polished, with high polishing speed, and few scratches (defects). This polishing composition includes silica of which the maximum peak h...  
WO/2018/013847A1
The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive, (b) a cobalt accelerator, and (c) an oxidizing agent that oxidizes a metal, wherein the polishing composition has a pH of about 4 to about 10....  
WO/2018/012174A1
The present invention provides a polishing composition which is capable of polishing an object to be polished, with high polishing speed, and few scratches (defects). The present invention relates to a polishing composition which include...  
WO/2018/012176A1
The present invention provides a polishing composition which is capable of polishing an object to be polished, with high polishing speed, and few scratches (defects). This polishing composition includes silica of which the maximum peak t...  
WO/2018/012175A1
The present invention provides a process for producing a polishing composition with which a work can be polished at a high polishing rate with few scratches (defects). The present invention relates to a process for producing a polishing ...  
WO/2018/004142A1
A CMP slurry composition for a metal film of the present invention comprises abrasive particles, a solvent, an oxidant, metal ions, and a reductant.  
WO/2017/219499A1
A method for preparing an aluminium oxide polishing solution, comprising the following steps: 1) mixing a silane coupling agent, ethanol and water to form a hydrolysate; 2) adding the hydrolysate to an aluminium oxide powder under the co...  
WO/2017/223225A1
The invention provides a chemical-mechanical polishing composition comprising (a) wet-process ceria abrasive, (b) a surfactant comprising an amine-containing anchor group and ethylene oxide-propylene oxide stabilizing group, wherein the ...  
WO/2017/223308A1
A stable aqueous, semi-aqueous or non-aqueous suspension medium to suspend inert organic or inorganic particles in the suspension medium containing gel particles as a separating agent for the inert organic or inorganic particles, which g...  
WO/2017/214995A1
Provided are a polishing agent, a copper part and a polishing treatment method therefor. The polishing agent is used for pre-treating the surface of a copper part, and comprises, with a total of 100 parts by weight, the following ingredi...  
WO/2017/212874A1
The present invention addresses the problem of providing: a polishing liquid that, when used for CMP, is not likely to cause flaws in a polished object; and a chemical mechanical polishing method. This polishing liquid is for use in chem...  
WO/2017/214185A1
Described are slurry compositions useful in chemical-mechanical processing of a nickel layer of a substrate, wherein the slurry compositions contain abrasive particles that include silica particles that are cationically charged at a low pH.  
WO/2017/208667A1
The present invention addresses the issue of providing a polishing liquid whereby abrasive grains in the polishing liquid are unlikely to agglomerate and, even when used in CMP, defects are less likely to occur in a polished surface. The...  
WO/2017/204035A1
The invention provides a polishing solution that can obtain an excellent polishing rate when applied to CMP and is less likely to cause dishing of the surface to be polished, a method for producing a polishing solution, a polishing solut...  
WO/2017/200297A1
Disclosed is a slurry composition for chemical-mechanical polishing, the composition exhibiting a small change in pH over time in an acidic atmosphere, thereby being easily storable for a long time. The slurry composition for chemical-me...  
WO/2017/200211A1
The present invention relates to a slurry composition for polishing a high stepped region. The slurry composition for polishing a high stepped region according to an embodiment of the present invention comprises: a polishing liquid conta...  
WO/2017/195968A1
The present invention relates to: a CMP slurry composition for polishing copper, containing an oxidizing agent, a corrosion inhibitor, a chelating agent, a solvent, and a copolymer of (meth)acrylic acid and a (meth)acrylamide compound, w...  
WO/2017/186283A1
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) an ...  
WO/2017/183290A1
The present invention is a polishing material for synthetic quarts glass substrates which comprises abrasive grains and water, characterized in that the abrasive grains comprise ceria particles as base particles and, fixed to the surface...  
WO/2017/177993A1
The invention relates to the field of emulsions of natural waxes in water and alcohol and to their use in sustainable/natural cleaning, preservative and care agents.  
WO/2017/170179A1
Provided is a polishing composition which renders smoothness with higher accuracy possible. The polishing composition includes abrasive grains and a basic compound and further contains a water-soluble high-molecular-weight compound and a...  
WO/2017/170061A1
Provided is a polishing composition for polishing a material to be polished. This polishing composition contains diamond abrasive and non-diamond abrasive, and in terms of weight, the ratio (B/A) of the content of non-diamond abrasive (B...  
WO/2017/162462A1
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a p...  
WO/2017/161510A1
A spraying liquid vehicle wax composition comprises the following components: wax, solvent oil, silicone oil, abrasive particles, sodium alkyl benzene sulfonate, 3-phosphoglyceride, silicone grease and water. The composition has the adva...  
WO/2017/161509A1
Disclosed in the present invention is a composition for a brushing-free shoe polish. The composition comprises the following components: beeswax in parts by weight, resin in parts by weight, a leather softener in parts by weight, vegetab...  
WO/2017/161157A1
Chemical compositions or "cocktails" for injecting into shale oil formations to stimulate oil, condensate and/or gas recovery are disclosed, along with the corresponding processes for stimulating oil, condensate and/or gas recovery. Thes...  
WO/2017/150118A1
The present invention pertains to a polishing composition containing abrasive grains, a water-soluble polymer, an anionic surfactant, a basic compound, and water, the anionic surfactant having oxyalkylene units, and the average number of...  
WO/2017/147768A1
A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; an...  

Matches 1 - 50 out of 4,155