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Matches 1 - 50 out of 3,804

Document Document Title
WO/2017/030710A1
A slurry composition for use in chemical-mechanical polishing sapphire substrates and includes an alkaline pH adjuster and an accelerant.  
WO/2017/025536A1
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy and (iii) Ti N and /or TaN, wherein the CMP composition (Q) comprises (E) ...  
WO/2017/023677A1
This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5 - 25 percent by weight an alkaline compound; (b) 1 - 25 percent by weight an alcohol amine compound; (c) 0.1 - 20 percent by weig...  
WO2017011115A1
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and one of a...  
WO/2016/208301A1
Provided is a polishing composition in which the abrasive grains are less likely to precipitate and the abrasive grains that have precipitated and agglomerated redisperse easily. The polishing composition contains abrasive grains, a liqu...  
WO/2016/207808A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a non-cross linked functionalised lignin oligomer, wherein the lignin oligomer: (a) has a number average molecular weight (Mn) i...  
WO/2016/207811A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a non-crosslinked functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) has an average number of ligni...  
WO/2016/207809A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) comprises less than 1wt% sulphur content; (b) ...  
WO/2016/207810A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) has an average number of lignin monomers of fr...  
WO/2016/207812A1
A consumer goods product comprising a consumer goods product ingredient and a cross-linked co-polymer of a lignin oligomer and a vinyl monomer, wherein the lignin oligomer has: (a) comprises less than 1wt% sulphur content; (b) has a numb...  
WO/2016/207807A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a lignin oligomer, wherein the lignin oligomer: (a) comprises less than 1wt% sulphur content; (b) has a number average molecular...  
WO/2016/201191A1
Floor coating compositions and methods of forming a floor coating composition are provided. The floor coating composition includes an acrylic wax, water, and an indicator that includes a color at a first pH and that is colorless at a sec...  
WO/2016/200941A1
The present invention refers to a polishing composition designed for conditioning surfaces, such as gears, seals, rings, and others. The composition is an oil in water emulsion, wherein the improvement was achieved when using a synergist...  
WO/2016/194614A1
This invention enables a high polishing speed in the polishing of ceramics that are used in electronic devices and include an oxide crystal, or the like, by suppressing the occurrence of defects such as scratches. A polishing composition...  
WO/2016/191248A1
A polishing composition with improved stability at low temperatures comprising from 10 to 50% by weight of water, from 10 to 60 % by weight of hydrocarbons, from 0.5 to 5% by weight of one or more organic acids and including its salts wh...  
WO/2016/186214A1
The present invention provides a method for manufacturing a glass substrate, in which polishing speed can be improved in a polishing process of using cerium oxide as polishing abrasive grains to polish the surface of a glass substrate. T...  
WO/2016/181600A1
The present invention is a polishing agent for synthetic quartz glass substrates which comprises abrasive grains, a polishing accelerator, and water, characterized in that the abrasive grains are wet-process ceria particles and that the ...  
WO/2016/150176A1
Provided is a cobalt-containing doped silicon dioxide nano-composite abrasive grain sol, a preparation method thereof comprising: mixing, by weight percentage, 0.43 wt% of cobalt nitrate solution and 2.5 wt% of silicic acid solution acco...  
WO/2016/143323A1
Provided are a composition for grinding, which can achieve both excellent surface quality and high grinding speed, and a method for grinding a silicon substrate. The composition for grinding contains abrasive grains, a basic compound, an...  
WO/2016/143797A1
 This polishing agent for resin polishing contains: abrasive particles; a water-soluble polymer that has an ether bond; an organic solvent; and water. Therein, the abrasive particles have a positive charge within the polishing agent, a...  
WO/2016/141259A1
The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate, especially a substrate comprising a silicon oxide layer, with the chemical-mechanical polishing compositions....  
WO/2016/141260A1
The invention provides a chemical-mechanical polishing composition including wet-process ceria particles having a median particle size of about 25 nm to about 150 nm and a particle size distribution of about 300 nm or more, and an aqueou...  
WO/2016/140246A1
A CMP polishing liquid for polishing a ruthenium-based metal, wherein: the CMP polishing liquid contains abrasive grains, a metal oxidant, and water; the metal oxidant has an oxidation-reduction potential accompanied by exchange of hydro...  
WO/2016/136342A1
[Problem] To provide a polishing composition with which it is possible, in at least one of the acidic, neutral, and basic ranges, to sufficiently control the polishing rate for an object to be polished having a silicon-silicon bond. [Sol...  
WO/2016/136177A1
A composition for polishing, which is used for polishing of the surface of an object to be polished, said surface containing an oxide of a metal or a semimetal or a composite material of these oxides, and which contains at least water an...  
WO/2016/136314A1
A cerium-free polishing material is provided which has an excellent polishing speed, and which can cut production costs and has improved production efficiency; also provided is a production method for conveniently obtaining said polishin...  
WO/2016/136162A1
Provided is a polishing composition that, even when used for polishing an object to be polished containing a transition metal having a standard electrode potential between -0.45V and 0.33V inclusive, is less likely to etch or corrode the...  
WO/2016/136447A1
A polishing method is provided which yields a negatively charged substrate with excellent surface smoothness with good productivity while achieving high polishing speeds. Also provided is a method for achieving a negatively charged subst...  
WO/2016/132952A1
[Problem] To provide a polishing composition with which it is possible, in at least one of the acidic, neutral, and basic ranges, to sufficiently suppress the polishing rate for an object to be polished having a silicon-nitrogen bond, su...  
WO/2016/132951A1
[Problem] To provide a polishing composition with which it is possible, in at least one of the acidic, neutral, and basic ranges, to sufficiently control the polishing rate for an object to be polished having a silicon-oxygen bond, such ...  
WO/2016/129508A1
 Provided is a polishing composition with which simple silicon substances can be polished at higher speeds. The present invention is a polishing composition to be used for polishing objects to be polished that comprise a simple silic...  
WO/2016/129164A1
Provided is a glass article which has excellent surface smoothness. The glass article 1 comprises a polished main surface, the arithmetic average roughness (Ra) of the polished main surface being 0.2 nm or less.  
WO/2016/115096A1
Chemical Mechanical Planarization(CMP) polishing compositions comprising composite particles, such as ceria coated silica particles, offer low dishing, low defects, and high removal rate for polishing oxide films. Chemical Mechanical Pla...  
WO/2016/107406A1
The present invention relates to a chemically mechanical polishing liquid and an application thereof. The polishing liquid comprises grinding particles, an amino silane reagent, and water. The present invention is applicable to polishing...  
WO/2016/109786A1
The present disclosure relates to abrasive aggregates comprised of abrasive particles in a vitreous binder composition, and methods of making and using such abrasive aggregates, including in abrasive articles. The abrasive aggregates can...  
WO/2016/106766A1
Disclosed is a method. A silicon-containing organic compound is adopted. A significant synergistic effect exists between the silicon-containing compound and other complexing agents, so as to greatly increase the polishing rate of silicon...  
WO/2016/107414A1
The present invention aims to provide an application of a composition in polishing of a barrier layer. The composition is added into a chemical mechanical polishing (CMP) liquid, the CMP liquid comprises silica sol, and the composition i...  
WO/2016/106765A1
A method for preparing cerium oxide crystals, comprising: adding an alkaline precipitant to a cerium source aqueous solution to which an organic additive has been added, so as to obtain cerium hydroxide by precipitating; adding carbon di...  
WO/2016/107409A1
The polishing liquid of the present invention provides for polishing of silicon dioxide at very high speed. By means of the synergistic effect of a silicon-containing organic compound and an amphoteric surfactant, high grinding speeds ar...  
WO/2016/109780A1
Embodiments of the present disclosure are directed to methods of making high grade colored abrasive articles that are color stable at high temperatures, such as color stable at temperatures of at least about 185 degrees Celsius such that...  
WO/2016/107413A1
The present invention aims to providing a solution for poor stability of a polishing liquid prepared by amino silane modified grinding particles. The stability of the pH, nanometer particle size, and polishing speed of such a system in a...  
WO/2016/103576A1
Provided is a polishing composition that is inexpensive and can be used to impart a high-quality mirror finish to ceramic. The polishing composition contains abrasive grains made of carbide, and is used for polishing ceramic.  
WO/2016/102531A1
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles, (B) a ...  
WO/2016/101332A1
The present invention presents a chemical mechanical polishing (CMP) slurry, and the CMP slurry uses ceria as an abrasive and contains an organic polybasic acid and polymers. The CMP slurry disclosed in the present invention still has a ...  
WO/2016/105474A1
A method of forming a shaped abrasive particle including forming a mixture comprising a ceramic material into a sheet and sectioning at least a portion of the sheet using a mechanical object and forming at least one shaped abrasive parti...  
WO/2016/102204A1
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a t...  
WO/2016/102279A1
Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or co-balt alloy comprising substrates Abstract Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a su...  
WO/2016/097915A1
A chemical mechanical polishing (CMP) composition (Q) comprising: (A) inorganic particles, (B) a compound of general formula (I) (C) an aqueous medium wherein the composition (Q) has a pH of from 2 to 6.  
WO/2016/089660A1
Provided herein are abrasive compositions that use surfactants containing block copolymers of both propylene oxide and ethylene oxide moieties. Abrasive compositions derived from these copolymers were capable of providing both superior l...  
WO/2016/081433A1
The present disclosure provides a composition for treating leather and similar materials. The composition comprises from about 40% (w/w) to about 60% (w/w) of an oil obtained from natural sources; from about 1% (w/w) to about 15% (w/w) o...  

Matches 1 - 50 out of 3,804