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Matches 1 - 50 out of 3,923

Document Document Title
WO/2017/138308A1
This polishing slurry contains abrasive grains formed of a metal oxide, a permanganate salt and an inorganic compound other than the permanganate salt. With respect to the inorganic compound, the redox potential of a solution that is obt...  
WO/2017/135427A1
A floor-polishing agent containing at least (A) a polyurethane resin, (B) an acrylic resin, and (C) a crosslinking agent, wherein said (A) polyurethane resin contains a carbonate group, and the total concentration of a urea group and a u...  
WO/2017/126268A1
Provided is a polishing composition which enables the formation of a surface having smoothness and reduced defects. The polishing composition contains a water-soluble polymer that meets the following requirements (A) and (B): (A) the ads...  
WO/2017/120402A1
Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation ca...  
WO/2017/120396A1
Disclosed is a method of chemically-mechanically polishing a substrate. The method comprises, consists of, or consists essentially of (a) contacting a substrate containing a low-k dielectric composition, which includes less than about 80...  
WO/2017/119342A1
The purpose of the present invention is to provide a polishing material which has excellent polishing rate and is not susceptible to decrease of the polishing rate for a relatively long period of time. The present invention is a polishin...  
WO/2017/117404A1
Described are compositions useful in methods for chemical-mechanical processing a surface of a substrate, especially a substrate that contains dielectric material, wherein the composition contains cyclodextrin and alkylamine.  
WO/2017/114309A1
Disclosed in the present invention are a chemical mechanical polishing slurry and an application thereof, the polishing slurry comprising: (a) grinding particles, (b) aminosilane coupling agent, (c) azole compound, (d) complexing agent, ...  
WO/2017/114312A1
Provided are a method for preparing cerium oxide powder and an application thereof. The method comprising: adding carbon dioxide to a cerium source solution by means of bubbling, and preparing cerium carbonate by precipitation; and calci...  
WO/2017/116773A1
The invention relates to a process for preparing potassium thiosulfate, potassium sulfite or potassium bisulfite comprising the following steps: Step (1a): providing a potassium hydroxide or potassium carbonate solution for neutralizing ...  
WO/2017/112906A1
An abrasive article can includes a body having an abrasive portion. The abrasive portion can include a filler composition including pyrite, in particular, pyrite having a sulfur content of at least at least 43 wt% for a total weight of t...  
WO/2017/102826A1
The present invention concerns a method for polishing a phosphate glass or fluorophosphate glass substrate comprising polishing the surface of said substrate using at least a formulation having a pH comprised between 7 and 14 comprising ...  
WO/2017/100518A1
A process for producing an aqueous polymeric dispersion may include coextruding a copolymer of an α-olefin and an α, β- unsaturated carboxylic acid to form a combined polymer, and a wax. The process may include emulsifying the combine...  
WO/2017/085904A1
The present invention provides a polishing composition containing abrasive grains, characterized in that: the surfaces of the abrasive grains have been modified by two or more organic compounds; the two or more organic compounds each hav...  
WO/2017/074800A1
Described are chemical-mechanical polishing compositions (e.g., slurries) and methods of using the slurries for chemical-mechanical polishing (or planarizing) a surface of a substrate that contains tungsten, the compositions containing c...  
WO/2017/074801A1
Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.  
WO/2017/070074A1
The invention provides a chemical-mechanical polishing composition that contains (a) abrasive particles, (b) an azole compound having an octanol-water logP of about 1 to about 2, (c) a cobalt corrosion inhibitor, wherein the cobalt corro...  
WO/2017/061109A1
The purpose of the present invention is to provide is an abrasive agent for a magnetic disk, the agent having a fast polishing speed with respect to an object to be polished. Provided is an abrasive agent for a magnetic disk comprising 2...  
WO/2017/057155A1
[Problem] The objective of the present invention is to provide a polishing composition with which it is possible to polish an article to be polished at higher speeds. [Solution] Provided is a polishing composition used for polishing an a...  
WO/2017/057156A1
[Problem] The present invention provides a means that is capable of achieving sufficient planarization of the surface of an object of polishing, said object containing two or more different materials. [Solution] The present invention is ...  
WO/2017/057906A1
The present invention relates to a CMP slurry composition, for polishing an organic film, comprising: cerium salts comprising ultrapure water, abrasives and cerium (IV) ions; and an oxidizing agent, wherein the oxidizing agent has an oxi...  
WO/2017/057478A1
[Problem] To provide a polishing composition with which an object to be polished that includes oxygen atoms and silicon atoms can be polished at a high polishing speed, and with which the scratching of the surface of the object to be pol...  
WO/2017/051770A1
Provided is an abrasive material composition with which it is possible to not only achieve a high polishing rate without requiring the use of alumina particles but also obtain satisfactory surface smoothness and edge surface shape. The a...  
WO/2017/047307A1
Provided is a polishing composition in which the ratio of the rate of polishing polysilicon or amorphous silicon to the rate of polishing silicon nitride is high, the rate of polishing polysilicon or amorphous silicon is high, and the ra...  
WO/2017/044340A1
The invention provides a chemical mechanical polishing composition comprising, consisting essentially of, or consisting of (a) about 0.01 wt.% to about 1 wt.% of wet process ceria, (b) about 10 ppm to about 200 ppm of a cationic polymer ...  
WO/2017/040571A1
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.  
WO/2017/030710A1
A slurry composition for use in chemical-mechanical polishing sapphire substrates and includes an alkaline pH adjuster and an accelerant.  
WO/2017/025536A1
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy and (iii) Ti N and /or TaN, wherein the CMP composition (Q) comprises (E) ...  
WO/2017/023677A1
This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5 - 25 percent by weight an alkaline compound; (b) 1 - 25 percent by weight an alcohol amine compound; (c) 0.1 - 20 percent by weig...  
WO/2017/011115A1
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and one of a...  
WO/2016/208301A1
Provided is a polishing composition in which the abrasive grains are less likely to precipitate and the abrasive grains that have precipitated and agglomerated redisperse easily. The polishing composition contains abrasive grains, a liqu...  
WO/2016/207808A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a non-cross linked functionalised lignin oligomer, wherein the lignin oligomer: (a) has a number average molecular weight (Mn) i...  
WO/2016/207811A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a non-crosslinked functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) has an average number of ligni...  
WO/2016/207809A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) comprises less than 1wt% sulphur content; (b) ...  
WO/2016/207810A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) has an average number of lignin monomers of fr...  
WO/2016/207812A1
A consumer goods product comprising a consumer goods product ingredient and a cross-linked co-polymer of a lignin oligomer and a vinyl monomer, wherein the lignin oligomer has: (a) comprises less than 1wt% sulphur content; (b) has a numb...  
WO/2016/207807A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a lignin oligomer, wherein the lignin oligomer: (a) comprises less than 1wt% sulphur content; (b) has a number average molecular...  
WO/2016/201191A1
Floor coating compositions and methods of forming a floor coating composition are provided. The floor coating composition includes an acrylic wax, water, and an indicator that includes a color at a first pH and that is colorless at a sec...  
WO/2016/200941A1
The present invention refers to a polishing composition designed for conditioning surfaces, such as gears, seals, rings, and others. The composition is an oil in water emulsion, wherein the improvement was achieved when using a synergist...  
WO/2016/194614A1
This invention enables a high polishing speed in the polishing of ceramics that are used in electronic devices and include an oxide crystal, or the like, by suppressing the occurrence of defects such as scratches. A polishing composition...  
WO/2016/191248A1
A polishing composition with improved stability at low temperatures comprising from 10 to 50% by weight of water, from 10 to 60 % by weight of hydrocarbons, from 0.5 to 5% by weight of one or more organic acids and including its salts wh...  
WO/2016/186214A1
The present invention provides a method for manufacturing a glass substrate, in which polishing speed can be improved in a polishing process of using cerium oxide as polishing abrasive grains to polish the surface of a glass substrate. T...  
WO/2016/181600A1
The present invention is a polishing agent for synthetic quartz glass substrates which comprises abrasive grains, a polishing accelerator, and water, characterized in that the abrasive grains are wet-process ceria particles and that the ...  
WO/2016/150176A1
Provided is a cobalt-containing doped silicon dioxide nano-composite abrasive grain sol, a preparation method thereof comprising: mixing, by weight percentage, 0.43 wt% of cobalt nitrate solution and 2.5 wt% of silicic acid solution acco...  
WO/2016/143323A1
Provided are a composition for grinding, which can achieve both excellent surface quality and high grinding speed, and a method for grinding a silicon substrate. The composition for grinding contains abrasive grains, a basic compound, an...  
WO/2016/143797A1
 This polishing agent for resin polishing contains: abrasive particles; a water-soluble polymer that has an ether bond; an organic solvent; and water. Therein, the abrasive particles have a positive charge within the polishing agent, a...  
WO/2016/141259A1
The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate, especially a substrate comprising a silicon oxide layer, with the chemical-mechanical polishing compositions....  
WO/2016/141260A1
The invention provides a chemical-mechanical polishing composition including wet-process ceria particles having a median particle size of about 25 nm to about 150 nm and a particle size distribution of about 300 nm or more, and an aqueou...  
WO/2016/140246A1
A CMP polishing liquid for polishing a ruthenium-based metal, wherein: the CMP polishing liquid contains abrasive grains, a metal oxidant, and water; the metal oxidant has an oxidation-reduction potential accompanied by exchange of hydro...  
WO/2016/136342A1
[Problem] To provide a polishing composition with which it is possible, in at least one of the acidic, neutral, and basic ranges, to sufficiently control the polishing rate for an object to be polished having a silicon-silicon bond. [Sol...  

Matches 1 - 50 out of 3,923