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Matches 1 - 50 out of 4,442

Document Document Title
WO/2019/164449A1
Disclosed is a method of reducing surface unevenness of a semiconductor wafer (100). In a preferred embodiment, the method comprises: removing a portion of a deposited layer and a protective layer thereon using a first slurry to provide ...  
WO/2019/148213A1
Disclosed are methods for building colloidal solids by precipitation from a liquid bridge using a needle through which a colloidal particle suspension is dispensed onto a substrate in a temperature-controlled environment. The substrate c...  
WO/2019/145282A1
The present invention relates to a lubricant for reducing the friction of a sliding surface of a winter sports apparatus with respect to snow, water and/or ice, wherein the lubricant contains at least one lubricant component based on an ...  
WO/2019/145588A1
The invention relates to the use of H2SO4 as electrolyte in processes for smoothing and polishing metals by ion transport via free solids, specifically metal parts, for example in jewellery, based on ion transport with electrically condu...  
WO/2019/144314A1
Disclosed is a method for preparing a nanometer silicon sol polishing solution, the method comprising the following steps: mixing a silicon sol having a particle size of 100-120 nm and a solid content of 43-45%, with a mixed crystal tita...  
WO/2019/139828A1
The invention provides a method of chemically-mechanically polishing a substrate comprising providing a substrate comprising a tungsten layer on a surface of the substrate and a silicon oxide layer on a surface of the substrate, providin...  
WO/2019/136197A1
The invention provides a chemical-mechanical polishing composition comprising a) surface-modified colloidal silica particles, comprising a negatively-charged group on the surface of the particles, wherein the surface-modified colloidal s...  
WO/2019/131761A1
This abrasive composition for abrading a resin and copper or a copper alloy, comprises alumina abrasive grains, glycine, an anionic surfactant, and water.  
WO/2019/129106A1
Provided is a chemical-mechanical polishing solution, comprising a silicon dioxide abrasive particle and an accelerator. The accelerator is selected from pyridine, piperidine, pyrrolidine, and pyrrole compounds containing one or more car...  
WO/2019/129103A1
Disclosed is a chemical mechanical polishing solution. The chemical mechanical polishing solution comprises silica abrasive particles, a corrosion inhibitor, a complexing agent, an oxidizing agent, and at least one polyacrylic acid anion...  
WO/2019/129102A1
Provided is a chemical-mechanical polishing solution, comprising silicon dioxide, at least one accelerator, and an azole compound or a derivative thereof. The chemical-mechanical polishing solution significantly increases the polishing s...  
WO/2019/129107A1
Disclosed is a chemical mechanical polishing solution. The polishing solution comprises abrasive particles, a water-soluble polymer, and a nonionic surfactant; the nonionic surfactant is polyvinylpyrrolidone. The polishing solution of th...  
WO/2019/131885A1
Provided is a slurry for polishing, which is used for polishing of an interlayer insulating film, and which contains silica abrasive grains and organic ammonium cations that have a molecular weight of 155 or less.  
WO/2019/129105A1
Disclosed is a chemical-mechanical polishing liquid, comprising silicon dioxide abrasive particles, a corrosion inhibitor, a complexing agent, an oxidant and a sulfonate anionic surfactant. By using the polishing liquid disclosed in the ...  
WO/2019/119816A1
A CMP polishing solution for polishing a GaAs wafer and a preparation method therefor. The CMP polishing solution comprises the following components in parts by weight: 0.1-50 parts of abrasive, 0.001-0.4 part of surfactant, 0.001-0.6 pa...  
WO/2019/099161A3
The invention provides a chemical mechanical polishing composition comprising (a) wet process silica, (b) a combination of (i) an alcohol of formula (I) and (ii) an alcohol of formula (II), (c) hydrogen peroxide, (d) a mineral acid, and ...  
WO/2019/124741A1
The present invention relates to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a nitride film polis...  
WO/2019/124740A1
The present invention relates to a polishing slurry composition for an STI process and, more particularly, to a polishing slurry composition for an STI process, the composition comprising: a polishing solution including polishing particl...  
WO/2019/126156A1
A composition for planarizing a semiconductor device surface includes a catalyst, at least one solvent, and at least one polysiloxane resin including polysilsesquioxane blocks and polydisiloxane blocks. The polydisiloxane blocks include ...  
WO/2019/101555A1
The presently claimed subject matter is directed to a chemical mechanical polishing (CMP) com- position comprising inorganic particles, at least one organic compound comprising an amino group and/or at least one acid group (Y), potassium...  
WO/2019/099655A1
A composition can comprise a carrier including a liquid and an abrasive particulate contained in the carrier, the abrasive particulate having, on average, at least 10wt% cerium oxide in the abrasive particulate and a cerium 3+ ratio (Ce ...  
WO/2019/099184A1
Water-in-oil (W/O) emulsion compositions having freeze-thaw stability are provided which include water, at least one hydrocarbon solvent, at least one nonionic emulsifier, and at least one freeze-thaw stabilizer which either prevents bre...  
WO/2019/093620A1
Provided are an organic film CMP slurry composition comprising ceria, a cerium-containing ceria activating agent, and an inorganic film surface protecting agent, and an organic film polishing method using the same.  
WO/2019/087818A1
Provided is a polishing composition which contains a water-soluble polymer compound and which is suitable for reducing LPD. The polishing composition according to the present invention contains abrasive grains, a water-soluble polymer co...  
WO/2019/083847A1
A composition including a carrier comprising a liquid, an abrasive particulate contained in the carrier, an accelerant contained in the carrier, the accelerant including at least one free anion selected from the group of iodide (I -), br...  
WO/2019/055160A3
The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, b) a removal rate inhibitor selected from (I) a surfactant comprising a polyoxyalkylene functional group and a sulfonate functional gro...  
WO/2019/070470A1
Polishing compositions that can selectively and preferentially polish certain dielectric films over other dielectric films are provided herein. These polishing compositions include either cationic or anionic abrasives based on the target...  
WO/2019/070793A1
The invention provides a chemical mechanical polishing composition comprising (a) an abrasive selected from the group consisting of alumina, ceria, titania, zirconia, and combinations thereof, wherein the abrasive is surface coated with ...  
WO/2019/066014A1
Provided is a polishing composition which exhibits excellent polishing performance with respect to the surfaces of materials such as alloys, resins, metals, semimetals, and oxides of metals or semimetals, and which is reduced in scatteri...  
WO/2019/065994A1
Provided is a polishing composition which is capable of achieving a good balance between high polishing rate and good surface quality. The present invention provides a polishing composition for polishing a polishing object material. This...  
WO/2019/067009A1
A multi-abrasive slurry, method of chemical mechanical polishing, and polishing system are disclosed. The method includes polishing an integrated circuit structure with a slurry in a first polishing stage subject to at least one variable...  
WO/2019/055749A1
A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, abrasive particles dispersed in the liquid carrier, an iron containing accelerator, and a cationic polym...  
WO/2019/055160A2
The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, b) a removal rate inhibitor selected from (I) a surfactant comprising a polyoxyalkylene functional group and a sulfonate functional gro...  
WO/2019/049932A1
The present invention involves manufacturing a starting material for a cerium-based abrasive agent by means of a step for dry milling a mixed rare earth oxide having a rare earth element content of 80% by mass or more in terms of oxides,...  
WO/2019/045151A1
The present invention relates to a cerium oxide powder surface-treated with an organic material, wherein the peak area of O-C is larger than the peak area of O-Ce in the X-ray photoelectron spectroscopy (XPS) measurement. The present inv...  
WO/2019/040370A1
Coatings for skis and snowboards are provided. The coatings may be lubricious coatings including one or more fluorinated compounds, adhesion agents, shape memory polymers, free-radical initiators, and/or carrying solvents. Methods of app...  
WO/2019/023221A1
Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such ...  
WO/2019/017407A1
Provided is a method for polishing a substrate, the method being capable of efficiently achieving a surface having high flatness and few defects. This method for polishing a substrate comprises a plurality of pre-polishing steps in which...  
WO/2019/011254A1
Provided is a chemical-mechanical polishing liquid, comprising cerium oxide abrasive particles, a polyquaternary ammonium salt and a pH regulator. The polyquaternary ammonium salt therein can control the polishing rate of silicon oxide, ...  
WO/2019/011253A1
Provided is a chemical-mechanical polishing slurry, comprising sol-type cerium oxide and benzoic acid compounds. The chemical-mechanical polishing slurry can control the generation of dishing while increasing the polishing rate.  
WO/2019/011251A1
Provided is a chemical-mechanical polishing liquid, said chemical-mechanical polishing liquid comprising a cerium oxide abrasive, oligosaccharide and a pH regulator. Further provided is use of the chemical-mechanical polishing liquid pre...  
WO/2019/011252A1
A chemical-mechanical polishing liquid, including cerium oxide abrasive particles, a polyquaternary ammonium salt and a pH-adjusting agent. The polyquaternary ammonium salt can control silicon oxide polishing speed, achieving a high sili...  
WO/2019/014213A1
A method of CMP includes providing a slurry solution including ≥1 per-compound oxidizer in a concentration between 0.01 M and 2 M with a pH from 1 to 5 or 8 to 11, and ≥1 buffering agent which provides a buffering ratio ≥1.5 that c...  
WO/2019/006683A1
A polishing agent, a stainless steel component, and a polishing treatment method therefor. The polishing agent, is used for surface pretreatment of stainless steel components, and based on 500 parts by weight, comprises the following com...  
WO/2019/006601A1
A polishing agent, a copper part and a polishing process therefor. The polishing agent is used for surface pretreatment of a copper part and comprises the following components in parts by weight: 30-100 parts of sulfuric acid, 50-200 gla...  
WO/2019/006686A1
A polishing agent, a stainless steel component, and a surface polishing treatment method therefor. The polishing agent is used for surface pretreatment of stainless steel components, and based on 500 parts by weight, comprises the follow...  
WO/2019/006605A1
A polishing agent, a stainless-steel part and a polishing process therefor. The polishing agent is used for surface pretreatment of a stainless steel part and comprises the following components in parts by weight per 200 parts by weight ...  
WO/2019/006685A1
A polishing agent, a stainless steel component, and a polishing treatment method therefor. The polishing agent is used for surface pretreatment of stainless steel components, and based on 500 parts by weight, comprises the following comp...  
WO/2019/006675A1
A polishing agent, an aluminum alloy part and a polishing process therefor. The polishing agent is used for surface pretreatment of an aluminum alloy part and comprises the following components in parts by weight per 100 parts by weight ...  
WO/2019/006600A1
A polishing agent, a copper part and a polishing process therefor. The polishing agent is used for surface pretreatment of a copper part and comprises the following components in parts by weight per 200 parts by weight of the polishing a...  

Matches 1 - 50 out of 4,442