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Matches 1 - 50 out of 4,047

Document Document Title
WO/2017/212874A1
The present invention addresses the problem of providing: a polishing liquid that, when used for CMP, is not likely to cause flaws in a polished object; and a chemical mechanical polishing method. This polishing liquid is for use in chem...  
WO/2017/214185A1
Described are slurry compositions useful in chemical-mechanical processing of a nickel layer of a substrate, wherein the slurry compositions contain abrasive particles that include silica particles that are cationically charged at a low pH.  
WO/2017/208667A1
The present invention addresses the issue of providing a polishing liquid whereby abrasive grains in the polishing liquid are unlikely to agglomerate and, even when used in CMP, defects are less likely to occur in a polished surface. The...  
WO/2017/204035A1
The invention provides a polishing solution that can obtain an excellent polishing rate when applied to CMP and is less likely to cause dishing of the surface to be polished, a method for producing a polishing solution, a polishing solut...  
WO/2017/200297A1
Disclosed is a slurry composition for chemical-mechanical polishing, the composition exhibiting a small change in pH over time in an acidic atmosphere, thereby being easily storable for a long time. The slurry composition for chemical-me...  
WO/2017/200211A1
The present invention relates to a slurry composition for polishing a high stepped region. The slurry composition for polishing a high stepped region according to an embodiment of the present invention comprises: a polishing liquid conta...  
WO/2017/195968A1
The present invention relates to: a CMP slurry composition for polishing copper, containing an oxidizing agent, a corrosion inhibitor, a chelating agent, a solvent, and a copolymer of (meth)acrylic acid and a (meth)acrylamide compound, w...  
WO/2017/186283A1
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) an ...  
WO/2017/183290A1
The present invention is a polishing material for synthetic quarts glass substrates which comprises abrasive grains and water, characterized in that the abrasive grains comprise ceria particles as base particles and, fixed to the surface...  
WO/2017/177993A1
The invention relates to the field of emulsions of natural waxes in water and alcohol and to their use in sustainable/natural cleaning, preservative and care agents.  
WO/2017/170179A1
Provided is a polishing composition which renders smoothness with higher accuracy possible. The polishing composition includes abrasive grains and a basic compound and further contains a water-soluble high-molecular-weight compound and a...  
WO/2017/170061A1
Provided is a polishing composition for polishing a material to be polished. This polishing composition contains diamond abrasive and non-diamond abrasive, and in terms of weight, the ratio (B/A) of the content of non-diamond abrasive (B...  
WO/2017/162462A1
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a p...  
WO/2017/161510A1
A spraying liquid vehicle wax composition comprises the following components: wax, solvent oil, silicone oil, abrasive particles, sodium alkyl benzene sulfonate, 3-phosphoglyceride, silicone grease and water. The composition has the adva...  
WO/2017/161509A1
Disclosed in the present invention is a composition for a brushing-free shoe polish. The composition comprises the following components: beeswax in parts by weight, resin in parts by weight, a leather softener in parts by weight, vegetab...  
WO/2017/161157A1
Chemical compositions or "cocktails" for injecting into shale oil formations to stimulate oil, condensate and/or gas recovery are disclosed, along with the corresponding processes for stimulating oil, condensate and/or gas recovery. Thes...  
WO/2017/150118A1
The present invention pertains to a polishing composition containing abrasive grains, a water-soluble polymer, an anionic surfactant, a basic compound, and water, the anionic surfactant having oxyalkylene units, and the average number of...  
WO/2017/147768A1
A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; an...  
WO/2017/152069A3
A composition for a multi-purpose floor finish is disclosed that includes at least one polymer, at least one plasticizer, and at least one hydrophobic glycol solvent. Further, the composition for a multi-purpose floor finish comprises a ...  
WO/2017/150114A1
The present invention proposes a polishing composition which has excellent wafer-protecting ability (resistance to alkali etching) and which can be expected to attain a reduction in haze while maintaining a low particle level. The presen...  
WO/2017/147767A1
A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising : providing the substrate; providing a polishing composition, containing, as initial components : water; an oxidizing agent; ...  
WO/2017/147891A1
A method of polishing a substrate comprises the steps of: providing the substrate which contains titanium nitride and titanium; providing a chemical mechanical polishing composition which contains: water, an oxidizing agent, a linear pol...  
WO/2017/142805A1
A polishing system includes a substrate to be polished and a polishing pad. The polishing pad includes a base layer and a wear resistant layer. The system further includes a polishing solution disposed between the polishing pad and the s...  
WO/2017/140952A1
Provided herein is a composition for improving performance of waxless skis, in particular skin skis, more particularly of skin strips, on snow, the composition com¬ prising (a) C1-6-alcohol(s); and (b) lubricant(s) selected from a group...  
WO/2017/138308A1
This polishing slurry contains abrasive grains formed of a metal oxide, a permanganate salt and an inorganic compound other than the permanganate salt. With respect to the inorganic compound, the redox potential of a solution that is obt...  
WO/2017/135427A1
A floor-polishing agent containing at least (A) a polyurethane resin, (B) an acrylic resin, and (C) a crosslinking agent, wherein said (A) polyurethane resin contains a carbonate group, and the total concentration of a urea group and a u...  
WO/2017/126268A1
Provided is a polishing composition which enables the formation of a surface having smoothness and reduced defects. The polishing composition contains a water-soluble polymer that meets the following requirements (A) and (B): (A) the ads...  
WO/2017/120402A1
Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation ca...  
WO/2017/120396A1
Disclosed is a method of chemically-mechanically polishing a substrate. The method comprises, consists of, or consists essentially of (a) contacting a substrate containing a low-k dielectric composition, which includes less than about 80...  
WO/2017/119342A1
The purpose of the present invention is to provide a polishing material which has excellent polishing rate and is not susceptible to decrease of the polishing rate for a relatively long period of time. The present invention is a polishin...  
WO/2017/117404A1
Described are compositions useful in methods for chemical-mechanical processing a surface of a substrate, especially a substrate that contains dielectric material, wherein the composition contains cyclodextrin and alkylamine.  
WO/2017/114309A1
Disclosed in the present invention are a chemical mechanical polishing slurry and an application thereof, the polishing slurry comprising: (a) grinding particles, (b) aminosilane coupling agent, (c) azole compound, (d) complexing agent, ...  
WO/2017/114312A1
Provided are a method for preparing cerium oxide powder and an application thereof. The method comprising: adding carbon dioxide to a cerium source solution by means of bubbling, and preparing cerium carbonate by precipitation; and calci...  
WO/2017/116773A1
The invention relates to a process for preparing potassium thiosulfate, potassium sulfite or potassium bisulfite comprising the following steps: Step (1a): providing a potassium hydroxide or potassium carbonate solution for neutralizing ...  
WO/2017/112906A1
An abrasive article can includes a body having an abrasive portion. The abrasive portion can include a filler composition including pyrite, in particular, pyrite having a sulfur content of at least at least 43 wt% for a total weight of t...  
WO/2017/102826A1
The present invention concerns a method for polishing a phosphate glass or fluorophosphate glass substrate comprising polishing the surface of said substrate using at least a formulation having a pH comprised between 7 and 14 comprising ...  
WO/2017/100518A1
A process for producing an aqueous polymeric dispersion may include coextruding a copolymer of an α-olefin and an α, β- unsaturated carboxylic acid to form a combined polymer, and a wax. The process may include emulsifying the combine...  
WO/2017/085904A1
The present invention provides a polishing composition containing abrasive grains, characterized in that: the surfaces of the abrasive grains have been modified by two or more organic compounds; the two or more organic compounds each hav...  
WO/2017/074800A1
Described are chemical-mechanical polishing compositions (e.g., slurries) and methods of using the slurries for chemical-mechanical polishing (or planarizing) a surface of a substrate that contains tungsten, the compositions containing c...  
WO/2017/074801A1
Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.  
WO/2017/070074A1
The invention provides a chemical-mechanical polishing composition that contains (a) abrasive particles, (b) an azole compound having an octanol-water logP of about 1 to about 2, (c) a cobalt corrosion inhibitor, wherein the cobalt corro...  
WO/2017/061109A1
The purpose of the present invention is to provide is an abrasive agent for a magnetic disk, the agent having a fast polishing speed with respect to an object to be polished. Provided is an abrasive agent for a magnetic disk comprising 2...  
WO/2017/057155A1
[Problem] The objective of the present invention is to provide a polishing composition with which it is possible to polish an article to be polished at higher speeds. [Solution] Provided is a polishing composition used for polishing an a...  
WO/2017/057156A1
[Problem] The present invention provides a means that is capable of achieving sufficient planarization of the surface of an object of polishing, said object containing two or more different materials. [Solution] The present invention is ...  
WO/2017/057906A1
The present invention relates to a CMP slurry composition, for polishing an organic film, comprising: cerium salts comprising ultrapure water, abrasives and cerium (IV) ions; and an oxidizing agent, wherein the oxidizing agent has an oxi...  
WO/2017/057478A1
[Problem] To provide a polishing composition with which an object to be polished that includes oxygen atoms and silicon atoms can be polished at a high polishing speed, and with which the scratching of the surface of the object to be pol...  
WO/2017/051770A1
Provided is an abrasive material composition with which it is possible to not only achieve a high polishing rate without requiring the use of alumina particles but also obtain satisfactory surface smoothness and edge surface shape. The a...  
WO/2017/047307A1
Provided is a polishing composition in which the ratio of the rate of polishing polysilicon or amorphous silicon to the rate of polishing silicon nitride is high, the rate of polishing polysilicon or amorphous silicon is high, and the ra...  
WO/2017/044340A1
The invention provides a chemical mechanical polishing composition comprising, consisting essentially of, or consisting of (a) about 0.01 wt.% to about 1 wt.% of wet process ceria, (b) about 10 ppm to about 200 ppm of a cationic polymer ...  
WO/2017/040571A1
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.  

Matches 1 - 50 out of 4,047