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Matches 1 - 50 out of 4,001

Document Document Title
WO/2017/170179A1
Provided is a polishing composition which renders smoothness with higher accuracy possible. The polishing composition includes abrasive grains and a basic compound and further contains a water-soluble high-molecular-weight compound and a...  
WO/2017/170061A1
Provided is a polishing composition for polishing a material to be polished. This polishing composition contains diamond abrasive and non-diamond abrasive, and in terms of weight, the ratio (B/A) of the content of non-diamond abrasive (B...  
WO/2017/162462A1
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a p...  
WO/2017/161510A1
A spraying liquid vehicle wax composition comprises the following components: wax, solvent oil, silicone oil, abrasive particles, sodium alkyl benzene sulfonate, 3-phosphoglyceride, silicone grease and water. The composition has the adva...  
WO/2017/161509A1
Disclosed in the present invention is a composition for a brushing-free shoe polish. The composition comprises the following components: beeswax in parts by weight, resin in parts by weight, a leather softener in parts by weight, vegetab...  
WO/2017/161157A1
Chemical compositions or "cocktails" for injecting into shale oil formations to stimulate oil, condensate and/or gas recovery are disclosed, along with the corresponding processes for stimulating oil, condensate and/or gas recovery. Thes...  
WO/2017/150118A1
The present invention pertains to a polishing composition containing abrasive grains, a water-soluble polymer, an anionic surfactant, a basic compound, and water, the anionic surfactant having oxyalkylene units, and the average number of...  
WO/2017/147768A1
A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; an...  
WO/2017/150114A1
The present invention proposes a polishing composition which has excellent wafer-protecting ability (resistance to alkali etching) and which can be expected to attain a reduction in haze while maintaining a low particle level. The presen...  
WO/2017/147767A1
A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising : providing the substrate; providing a polishing composition, containing, as initial components : water; an oxidizing agent; ...  
WO/2017/147891A1
A method of polishing a substrate comprises the steps of: providing the substrate which contains titanium nitride and titanium; providing a chemical mechanical polishing composition which contains: water, an oxidizing agent, a linear pol...  
WO/2017/142805A1
A polishing system includes a substrate to be polished and a polishing pad. The polishing pad includes a base layer and a wear resistant layer. The system further includes a polishing solution disposed between the polishing pad and the s...  
WO/2017/140952A1
Provided herein is a composition for improving performance of waxless skis, in particular skin skis, more particularly of skin strips, on snow, the composition com¬ prising (a) C1-6-alcohol(s); and (b) lubricant(s) selected from a group...  
WO/2017/138308A1
This polishing slurry contains abrasive grains formed of a metal oxide, a permanganate salt and an inorganic compound other than the permanganate salt. With respect to the inorganic compound, the redox potential of a solution that is obt...  
WO/2017/135427A1
A floor-polishing agent containing at least (A) a polyurethane resin, (B) an acrylic resin, and (C) a crosslinking agent, wherein said (A) polyurethane resin contains a carbonate group, and the total concentration of a urea group and a u...  
WO/2017/126268A1
Provided is a polishing composition which enables the formation of a surface having smoothness and reduced defects. The polishing composition contains a water-soluble polymer that meets the following requirements (A) and (B): (A) the ads...  
WO/2017/120402A1
Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation ca...  
WO/2017/120396A1
Disclosed is a method of chemically-mechanically polishing a substrate. The method comprises, consists of, or consists essentially of (a) contacting a substrate containing a low-k dielectric composition, which includes less than about 80...  
WO/2017/119342A1
The purpose of the present invention is to provide a polishing material which has excellent polishing rate and is not susceptible to decrease of the polishing rate for a relatively long period of time. The present invention is a polishin...  
WO/2017/117404A1
Described are compositions useful in methods for chemical-mechanical processing a surface of a substrate, especially a substrate that contains dielectric material, wherein the composition contains cyclodextrin and alkylamine.  
WO/2017/114309A1
Disclosed in the present invention are a chemical mechanical polishing slurry and an application thereof, the polishing slurry comprising: (a) grinding particles, (b) aminosilane coupling agent, (c) azole compound, (d) complexing agent, ...  
WO/2017/114312A1
Provided are a method for preparing cerium oxide powder and an application thereof. The method comprising: adding carbon dioxide to a cerium source solution by means of bubbling, and preparing cerium carbonate by precipitation; and calci...  
WO/2017/116773A1
The invention relates to a process for preparing potassium thiosulfate, potassium sulfite or potassium bisulfite comprising the following steps: Step (1a): providing a potassium hydroxide or potassium carbonate solution for neutralizing ...  
WO/2017/112906A1
An abrasive article can includes a body having an abrasive portion. The abrasive portion can include a filler composition including pyrite, in particular, pyrite having a sulfur content of at least at least 43 wt% for a total weight of t...  
WO/2017/102826A1
The present invention concerns a method for polishing a phosphate glass or fluorophosphate glass substrate comprising polishing the surface of said substrate using at least a formulation having a pH comprised between 7 and 14 comprising ...  
WO/2017/100518A1
A process for producing an aqueous polymeric dispersion may include coextruding a copolymer of an α-olefin and an α, β- unsaturated carboxylic acid to form a combined polymer, and a wax. The process may include emulsifying the combine...  
WO/2017/085904A1
The present invention provides a polishing composition containing abrasive grains, characterized in that: the surfaces of the abrasive grains have been modified by two or more organic compounds; the two or more organic compounds each hav...  
WO/2017/074800A1
Described are chemical-mechanical polishing compositions (e.g., slurries) and methods of using the slurries for chemical-mechanical polishing (or planarizing) a surface of a substrate that contains tungsten, the compositions containing c...  
WO/2017/074801A1
Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.  
WO/2017/070074A1
The invention provides a chemical-mechanical polishing composition that contains (a) abrasive particles, (b) an azole compound having an octanol-water logP of about 1 to about 2, (c) a cobalt corrosion inhibitor, wherein the cobalt corro...  
WO/2017/061109A1
The purpose of the present invention is to provide is an abrasive agent for a magnetic disk, the agent having a fast polishing speed with respect to an object to be polished. Provided is an abrasive agent for a magnetic disk comprising 2...  
WO/2017/057155A1
[Problem] The objective of the present invention is to provide a polishing composition with which it is possible to polish an article to be polished at higher speeds. [Solution] Provided is a polishing composition used for polishing an a...  
WO/2017/057156A1
[Problem] The present invention provides a means that is capable of achieving sufficient planarization of the surface of an object of polishing, said object containing two or more different materials. [Solution] The present invention is ...  
WO/2017/057906A1
The present invention relates to a CMP slurry composition, for polishing an organic film, comprising: cerium salts comprising ultrapure water, abrasives and cerium (IV) ions; and an oxidizing agent, wherein the oxidizing agent has an oxi...  
WO/2017/057478A1
[Problem] To provide a polishing composition with which an object to be polished that includes oxygen atoms and silicon atoms can be polished at a high polishing speed, and with which the scratching of the surface of the object to be pol...  
WO/2017/051770A1
Provided is an abrasive material composition with which it is possible to not only achieve a high polishing rate without requiring the use of alumina particles but also obtain satisfactory surface smoothness and edge surface shape. The a...  
WO/2017/047307A1
Provided is a polishing composition in which the ratio of the rate of polishing polysilicon or amorphous silicon to the rate of polishing silicon nitride is high, the rate of polishing polysilicon or amorphous silicon is high, and the ra...  
WO/2017/044340A1
The invention provides a chemical mechanical polishing composition comprising, consisting essentially of, or consisting of (a) about 0.01 wt.% to about 1 wt.% of wet process ceria, (b) about 10 ppm to about 200 ppm of a cationic polymer ...  
WO/2017/040571A1
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.  
WO/2017/030710A1
A slurry composition for use in chemical-mechanical polishing sapphire substrates and includes an alkaline pH adjuster and an accelerant.  
WO/2017/025536A1
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy and (iii) Ti N and /or TaN, wherein the CMP composition (Q) comprises (E) ...  
WO/2017/023677A1
This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5 - 25 percent by weight an alkaline compound; (b) 1 - 25 percent by weight an alcohol amine compound; (c) 0.1 - 20 percent by weig...  
WO2017011115A1
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and one of a...  
WO/2016/208301A1
Provided is a polishing composition in which the abrasive grains are less likely to precipitate and the abrasive grains that have precipitated and agglomerated redisperse easily. The polishing composition contains abrasive grains, a liqu...  
WO/2016/207808A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a non-cross linked functionalised lignin oligomer, wherein the lignin oligomer: (a) has a number average molecular weight (Mn) i...  
WO/2016/207811A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a non-crosslinked functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) has an average number of ligni...  
WO/2016/207809A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) comprises less than 1wt% sulphur content; (b) ...  
WO/2016/207810A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) has an average number of lignin monomers of fr...  
WO/2016/207812A1
A consumer goods product comprising a consumer goods product ingredient and a cross-linked co-polymer of a lignin oligomer and a vinyl monomer, wherein the lignin oligomer has: (a) comprises less than 1wt% sulphur content; (b) has a numb...  
WO/2016/207807A1
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a lignin oligomer, wherein the lignin oligomer: (a) comprises less than 1wt% sulphur content; (b) has a number average molecular...  

Matches 1 - 50 out of 4,001