Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 4,691

Document Document Title
WO/2020/180061A1
The invention of the present application relates to a slurry composition for CMP, and a polishing method using same and, more specifically, provides a slurry composition for CMP, and a polishing method using same, which are capable of mi...  
WO/2020/172273A1
Coatings, coating systems and coating methods for skis and snowboards are provided. The coatings may be lubricious coatings including one or more hydrophobic compounds, adhesion agents, shape memory polymers, free-radical initiators, and...  
WO/2020/166438A1
Provided is a polishing composition capable of suppressing swelling in a peripheral part of a laser mark without lowering the polishing rate thereof. The polishing composition contains water, abrasive grains, a basic compound, a benzyltr...  
WO/2020/160762A1
The invention relates to a glide agent for increasing the gliding characteristics of a sports device, in particular a winter sports device, comprising an aqueous solution containing - an aqueous silicone emulsion, - an emulsion of a poly...  
WO/2020/156959A1
The present invention relates to the use of apple wax as an additive in a composition for treating a surface, wherein the surface is selected from a group consisting of a wooden surface, a ceramic surface, a plastic surface, a leather su...  
WO/2020/160286A1
A multi-modal diamond abrasive package or slurry is disclosed for polishing hard substrates. The multi-modal diamond abrasive package or slurry generally includes a plurality of diamond abrasives. Each one of the diamond abrasives of the...  
WO/2019/190730A3
A slurry for polishing surfaces or substrates that at least partially comprise ruthenium and copper, wherein the slurry includes an alkali hydroxide, oxygenated halogen compound, and a halogen alkyl benzotriazole. The slurry may further ...  
WO/2020/145121A1
The present invention addresses the problem of providing: a method for regenerating a polishing agent, which can be employed for the polishing of a chemically strengthened glass, and whereby it becomes possible to remove a K2O-containing...  
WO/2020/146161A1
The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising colloidal silica, (b) a compound of formula (I), (c) a compound of formula (II), (d) hydrogen peroxide, and (e) water, wherein the p...  
WO/2020/142354A1
A chemical mechanical polishing composition includes a water based liquid carrier, cationic abrasive particles dispersed in the liquid carrier, a first amino acid compound having an isoelectric point of less than 7 and a second amino aci...  
WO/2020/141804A1
The present invention provides a chemical-mechanical polishing particle having high polishing quality with a high polishing rate and few defects or scratches by modifying the surface of a polishing particle, and a polishing slurry compos...  
WO/2020/138717A1
The present invention relates to a CMP slurry composition for polishing polycrystalline silicon and a polishing method using same. A CMP slurry composition for polishing polycrystalline silicon according to an embodiment of the present i...  
WO/2020/135168A1
Disclosed is a chemico-mechanical polishing solution, comprising silica abrasion particles, a nitrogen-containing heterocyclic compound comprising one or more carboxyl groups, and an ethoxylated butoxylated alkyl alcohol. Also disclosed ...  
WO/2020/138737A1
The present invention relates to a one-component polishing slurry composition and a polishing method using same and, more specifically, to a one-component polishing slurry composition and a polishing method using same, the one-component ...  
WO/2020/130332A1
The present invention relates to a polishing slurry composition. A polishing slurry composition according to one embodiment of the present invention comprises: a nonionic polymer having at least one amide bond; a selectivity control agen...  
WO/2020/131155A1
This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydr...  
WO/2020/130251A1
The present invention relates to a polishing slurry composition. A polishing slurry composition according to an embodiment of the present invention comprises a polishing solution containing polishing particles; and an additive solution c...  
WO/2020/131153A1
This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydr...  
WO/2020/130256A1
The present invention relates to a polishing slurry composition for an STI process and, more specifically, to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including ...  
WO/2020/120522A1
The presently claimed invention relates to a chemical-mechanical polishing (CMP) composition and chemical-mechanical polishing (CMP)methods. The presently claimed invention particularly relates to a composition and process for chemical-m...  
WO/2020/120641A1
The presently claimed invention relates to a chemical-mechanical polishing (CMP) composition and chemical-mechanical polishing (CMP) methods. The presently claimed invention particularly relates to a composition and process for chemical-...  
WO/2020/123332A1
The invention provides a chemical-mechanical polishing composition comprising(a) an abrasive having a Vickers hardness of 16 GPa or more, and (b) a liquid carrier, wherein the polishing composition is substantially free of an oxidizing a...  
WO/2020/122191A1
Provided are: a polishing composition which can be used more suitably in a use application in which a synthetic resin or the like is polished; and a polishing method for polishing an object of interest with a polishing composition. A pol...  
WO/2020/120520A1
The presently claimed invention relates to a chemical-mechanical polishing (CMP) composition and chemical-mechanical polishing (CMP) methods. The presently claimed invention particularly relates to a composition and process for chemical-...  
WO/2020/117441A1
A chemical mechanical polishing composition for polishing a substrate having copper, barrier, and dielectric layers includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole...  
WO/2020/117438A1
A chemical mechanical polishing composition for polishing a substrate having a cobalt layer includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole compound, wherein the p...  
WO/2020/117440A1
The invention provides a chemical mechanical polishing composition for polishing a silicon nitride containing substrate. The composition includes an aqueous carrier; cationic silica particles dispersed in the aqueous carrier, the cationi...  
WO/2020/117439A1
A chemical mechanical polishing composition for polishing a substrate includes a liquid carrier and cationic metal oxide abrasive particles dispersed in the liquid carrier. The cationic metal oxide abrasive particles have a surface modif...  
WO/2020/101134A1
The present invention relates to a polishing slurry composition and a method for producing same. The polishing slurry composition according to one embodiment of the present invention comprises: polishing particles dispersed so as to have...  
WO/2020/100985A1
In one embodiment, there is provided a polishing liquid composition capable of reducing scratching of a substrate surface after polishing while ensuring polishing speed. The present disclosure, in one embodiment, pertains to a polishin...  
WO/2020/100848A1
The objective of the invention is to provide a multi-core ferrule polishing material suitable for polishing a multi-core ferrule. The multi-core ferrule polishing material of the present invention for solving the above problem contains...  
WO/2020/091242A1
The present invention relates to a slurry composition for CMP comprising: polishing particles; one or more additives selected from the group consisting of a heterocyclic compound, a nitride, a chelating agent, a copper polishing rate enh...  
WO/2020/087721A1
The present application provides a chemical-mechanical polishing solution for silicon carbide having increased pH stability. The polishing solution comprises: an oxidant, a high hardness abrasive and a pH stabilizer, the pH stabilizer be...  
WO/2020/081870A1
An article includes a package including a packaging material defining an enclosed volume, wherein a desiccant and a bonded abrasive article are contained within the enclosed volume. In an embodiment, the desiccant comprises calcium ions ...  
WO/2020/075654A1
The present invention addresses the problem of providing a silica-based particle dispersion which contains a silica-based particle group and with which a high polishing rate and high surface precision can be achieved with respect to a si...  
WO/2020/066671A1
Provided are: a polishing pad useful for removing undulations in a curved resin-coated surface at a high polishing rate; and a polishing method using the polishing pad. A polishing pad (10) according to an aspect of the present invention...  
WO/2020/066998A1
This polishing liquid is used for polishing of a siliceous substrate that has a surface roughness Ra of from 0.01 μm to 0.2 μm (inclusive). This polishing liquid contains ceria abrasive grains, silica abrasive grains and water. The ave...  
WO/2020/067057A1
The present invention provides: a polishing composition which enables the achievement of high polishing rate and high surface quality with respect to polishing of a gallium oxide substrate; and a polishing method and a production method ...  
WO/2020/054823A1
A polishing pad is provided that can polish a curved surface to be polished on an object to be polished and remove waviness on the curved surface to be polished by way of a polishing surface following curved surfaces having various degre...  
WO/2020/037140A1
An abrasive article can include a body including a bond material comprising an inorganic material, abrasive particles and a filler comprising a nitride. The filler comprising a nitride can compensate shrinkage of the body during sinterin...  
WO/2020/033889A1
A composition having a plurality of abrasive particles including alumina, the plurality of abrasive particles have mesoporosity with an average meso branching index of at least 55 junctions/microns2 and a median particle size (D50) of at...  
WO/2020/017894A1
Provided are a chemical-mechanical polishing composition, a chemical-mechanical polishing slurry, and a method for polishing a substrate, which are capable of implementing a polishing rate equivalent to or higher than that of a conventio...  
WO/2020/008860A1
A liquid wax to be applied to runway surfaces in icy or snowy conditions, the wax exhibiting superior runway properties; and a method for manufacturing said liquid wax for runway surfaces, wherein paraffin is dispersed in and mixed with ...  
WO/2020/009054A1
The present invention provides a polishing means which is capable of improving the flatness of a substrate without significantly reducing the polishing rate. The present invention specifically provides a polishing composition which conta...  
WO/2019/225194A1
Provided is a lubricant capable of improving the property of sliding on ice and snow. Also provided is a fluorocarbon for use in the lubricant for use on ice and snow, characterized in that the lubricant includes a paraffin wax and the f...  
WO/2019/220376A1
A scouring article include a three-dimensional non-woven web of fibers bonded to one another to form a lofty, non-woven substrate. An abrasive coating is coated on the substrate. The abrasive coating includes a binder; a first plurality ...  
WO/2019/216205A1
Provided is, as one embodiment, a polishing liquid composition for a glass hard disk substrate that can prevent deterioration of surface roughness of a substrate surface after washing while maintaining the polishing rate. One embodiment ...  
WO/2019/204673A1
A composition is provided comprising a high viscosity amino functional silicone fluid, a silicone glycol copolymer, an aqueous-based intumescent flame retardant, and an aqueous-based concentrated cationic fluoropolymer system that cures ...  
WO/2019/199073A1
Polishing compositions according to various embodiments of the present disclosure comprise a fluorine-containing compound, a pH adjuster, an additive, and water, wherein the content of the fluorine-containing compound may be 0.01-20 wt% ...  
WO/2019/198622A1
[Problem] To provide a polishing composition which can polish a substrate on which is formed a silica coating or the like at high speed by increasing the effects of mechanical friction using abrasive grains that produce no defects, which...  

Matches 1 - 50 out of 4,691