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WO/2022/004238A1 |
A photocurable composition which contains a (meth)acryloyloxy group-containing polyurethane (A), an ethylenically unsaturated group-containing monomer (B), an antistatic agent (C) and a photopolymerization initiator (D), wherein: the (me...
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WO/2021/261169A1 |
The present invention aims to provide: an adhesive treatment agent for rubber and fiber, that has no deterioration in adhesiveness when impregnated in rubber for long periods at high temperatures and has suppressed deterioration when rep...
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WO/2021/256149A1 |
Provided is an adhesive composition for an organic fiber cord, said adhesive composition containing a graft copolymer and a surfactant, wherein: the graft copolymer has a chloroprene polymer chain and a graft chain that is bonded to the ...
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WO/2021/253612A1 |
Provided are an adhesive film and an electronic device comprising same. The adhesive film comprises at least one modified polyolefin resin layer, wherein the resins for forming the modified polyolefin resin layer comprise 1%-100% of a mo...
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WO/2021/256416A1 |
The purpose of the present invention is to provide an adhesive composition that is durable against a liquid electrolyte and that has improved hot adhesion characteristics. This adhesive composition is characterized by containing an acid-...
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WO/2021/256180A1 |
The purpose of the present invention is to provide a urethane adhesive composition that has a high content of an isocyanate group in a main agent, rapidly exhibits excellent adhesive strength even when using a dehydrating agent, and can ...
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WO/2021/256270A1 |
Provided are a two-liquid curing adhesive agent which can be aged at room temperature and has good adhesion with various base materials, a laminate in which the adhesion between the base material and the adhesive agent is excellent even ...
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WO/2021/256360A1 |
This adhesive contains a thermoplastic resin binder (A), modified polyolefin resin particles (B) and an organic solvent. This adhesive has high water repellency, while exhibiting high bondability with respect to metals, resins and the li...
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WO/2021/255164A2 |
The present invention relates to an additive based on diamide, functionalized polymer and wax, and to the use thereof as a rheological agent, in particular as a thixotropic agent, in a binder composition, especially a coating composition...
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WO/2021/256406A1 |
[Problem] To provide an adhesive set, an adhesion method, and powder, whereby adhesive curing time can be shortened. [Solution] An adhesive set 1 having: an adhesive 10 that is provided to an adhesion section 50 for a first target object...
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WO/2021/251424A1 |
The present invention addresses the problem of providing an encapsulation method using a cover film that has few issues in terms of odor, and has good quick-drying and encapsulation properties. An encapsulation method according to the ...
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WO/2021/251099A1 |
This easily disintegrable adhesive material contains a thermosetting resin and thermally expandable particles. The thermosetting resin contains an epoxy resin and a curing component that contains one or both of a curing agent and a curin...
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WO/2021/251435A1 |
The purpose of the present invention is to provide an adhesive sheet capable of forming an adhesive layer that has a low dielectric constant, that has excellent step conformability while maintaining adhesive strength and adhesion reliabi...
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WO/2021/251422A1 |
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A) and an adhesive film (50) that is ...
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WO/2021/248724A1 |
An underfill resin having stable adhesiveness under high temperature and preparation method therefor, comprising 20~60 parts by mass of epoxy resin, 5~30 parts by mass of curing agent, 0.1~5 parts by mass of solid or liquid latent curing...
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WO/2021/251437A1 |
The purpose of the present invention is to provide an adhesive composition which has a low dielectric constant and exhibits excellent level-difference followability and transparency while maintaining adhesive force and adhesive reliabili...
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WO/2021/251221A1 |
[Problem] To provide an adhesive composition which achieves good adhesion between a polyolefin resin base material and a material of a different kind, while exhibiting chipping resistance, and which enables bonding at low temperatures. [...
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WO/2021/251465A1 |
This aqueous adhesive contains a (meth)acrylic copolymer (A) obtained by polymerization in the presence of an emulsifier, an alkali metal compound (B), and a tackifying resin (C), each in specific amounts. The (meth)acrylic copolymer (A)...
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WO/2021/251420A1 |
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A) and an adhesive film (50) that is ...
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WO/2021/245531A1 |
The present invention relates to a method for the production of an adhesive component wherein said method comprises the following steps: providing a suspension comprising starch granules, adding a suspension comprising microfibrillated c...
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WO/2021/247532A1 |
Provided are flux-compatible epoxy-anhydride compositions useful as low-gap underfill adhesives. The flux-compatible epoxy-anhydride compositions include an epoxy component and an anhydride composition comprising a monofunctional anhydri...
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WO/2021/246716A1 |
The present invention provides a composition for forming an easy-adhesion layer, a hard coating film formed by using same, and an image display device provided with the hard coating film, the composition for forming an easy-adhesion laye...
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WO/2021/246419A1 |
The present invention pertains to an adhesive composition containing: (a) modified cellulose fibers having a cellulose type-I crystal structure, and having a mean fiber length of 1000 nm or less and a mean fiber diameter of 1-300 nm; and...
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WO/2021/246640A1 |
The present invention relates to a method for preparing an aqueous adhesive composition, and an aqueous adhesive composition prepared thereby. According to the present invention, provided are: an aqueous adhesive composition having excel...
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WO/2021/246360A1 |
The present invention provides: a two-pack type curable adhesive which has excellent adhesive power, while being free from the occurrence of coating unevenness during high-speed coating and leaving less residual solvent; a multilayer bod...
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WO/2021/246482A1 |
Provided are a method for producing a bonded body capable of obtaining exceptional adhesive strength and connection reliability, a bonded body, and a hot melt adhesive sheet containing electroconductive particles. A method for producing ...
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WO/2021/246484A1 |
Provided are: a production method that is for a smart card and that can impart excellent connection reliability and bending resistance to the smart card; a smart card; and a conductive particle-containing hot-melt adhesive sheet. Accordi...
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WO/2021/246483A1 |
Provided are a method for producing an assembly capable of obtaining exceptional adhesive strength and connection reliability, an assembly, and an electroconductive particle-containing hot melt adhesive sheet. A method for producing an a...
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WO/2021/243798A1 |
A rubber adhesive. A preparation method therefor comprises the following steps: step S100, preparing a first mixture by using a graphene filler, an inorganic filler, a fiber filler, an organic filler, and a main rubber ingredient; step S...
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WO/2021/246715A1 |
The present invention provides: a composition for forming a highly adhesive layer, comprising an aromatic (meth)acrylate, a photoinitiator and a solvent; a hard coating film formed using same; and an image display device comprising the h...
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WO/2021/243817A1 |
The present invention belongs to the technical field of polyurethane articles, and in particular relates to a heat-conducting halogen-free flame-retardant polyurethane elastomer and a preparation method therefor. The polyurethane elastom...
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WO/2021/243235A1 |
According to various examples of the present disclosure, an engineered wood precursor mixture includes a plurality of wood substrates and a binder reaction mixture present in a range of from 3 parts to 25 parts per 100 parts of the dry w...
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WO/2021/241517A1 |
The purpose of the present invention is to provide: a joined body which is configured so that deformation caused by heating during joining is suppressed, removal of the joined body is facilitated, protein adsorption is suppressed, and lo...
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WO/2021/241074A1 |
Provided is an adhesive tape for an optical component, the adhesive tape including a release liner, an optical-component-protecting adhesive strip, and a carrier strip in that order, wherein: when the release liner is peeled off from the...
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WO/2021/238116A1 |
The present invention relates to the technical field of solar cell packaging adhesive films, and specifically relates to an anti-PID POE adhesive film specifically for photovoltaic double-glass assembly packaging and a preparation method...
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WO/2021/240882A1 |
Provided is a polarizing plate with a retardation layer and an adhesive layer, said polarizing plate having excellent durability in a high-temperature, high-humidity environment, and also exhibiting significantly suppressed decoloration ...
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WO/2021/241359A1 |
The present invention provides: an adhesive sheet which sufficiently and stably adheres to the back surface of a lead frame and the back surface of a sealing resin, and is not separated therefrom before a separation step even if subjecte...
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WO/2021/241548A1 |
One purpose of the present invention is to provide a curable resin composition having excellent applicability by spin coating and giving cured objects which are excellent in terms of adhesiveness and long-term heat resistance. Another pu...
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WO/2021/239094A1 |
The present application relates to the field of anti-slip products, and provides an anti-slip adhesive film, a preparation method therefor, and an application thereof. The anti-slip adhesive film comprises a hot-pressed adhesive film lay...
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WO/2021/240126A1 |
The present invention relates to a composition, particularly a hot melt adhesive composition, that is able to change colour when exposed to different temperature conditions.
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WO/2021/235406A1 |
Provided is a temporary fixing composition containing (A) to (C). (A) A (meth) acrylate containing (A-1) and (A-2). (A-1) A monofunctional (meth) acrylate whereof a side chain is an alkyl group having 18 or more carbons, and whereof the ...
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WO/2021/232819A1 |
Disclosed are a single-component silane-modified polyether sealant for prefabricated buildings and a preparation method therefor. The sealant comprises the following components in parts by weight: 20-40 parts of a silane-modified polyeth...
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WO/2021/235771A1 |
Provided are an adhesive film, an optical member comprising same, and an optical display device comprising same, the adhesive film being formed of a composition comprising a hydroxyl group-containing (meth)acrylic copolymer and particles...
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WO/2021/236893A1 |
Disclosed herein are compounds, compositions, and methods for modulating the monocarboxylic acid transporter 4 (MCT4) with the compounds and compositions disclosed herein. Also described are methods of treating diseases or conditions tha...
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WO/2021/230371A1 |
A photo/moisture-curable resin composition comprising a radically polymerizable compound (A), a moisture curable resin (B) and a photopolymerization initiator (C), the photo/moisture-curable resin composition having a gel swelling ratio ...
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WO/2021/230094A1 |
Provided is a moisture-curable hot-melt adhesive capable of combining satisfactory initial bonding strength with a sufficiently long working time. The moisture-curable hot-melt adhesive includes an alkoxysilyl-group-containing urethane p...
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WO/2021/230095A1 |
Provided is a moisture-curable hot-melt adhesive capable of combining a satisfactory initial bonding strength with a sufficiently long working time. The moisture-curable hot-melt adhesive includes an alkoxysilyl-group-containing urethane...
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WO/2021/230313A1 |
The purpose of the present invention is to provide a double-sided adhesive film which has a generally equal elongation in the XY (longitudinal and transverse) directions, more preferably in the thickness direction, while being prevented ...
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WO/2021/229944A1 |
The present invention is a photocurable silicone composition characterized by containing: (A) an organopolysiloxane that has in the molecule thereof at least one specific structure including a (meth)acryl group; (B) an organohydrogenpoly...
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WO/2021/230212A1 |
This conductive adhesive contains an adhesive composition and conductive particles; and the compressive hardness of the conductive particles at 20% compression is 10.0 Gpa or more at 25°C, while being 3.5 Gpa or less at 150°C.
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