| Document |
Document Title |
|
WO/2022/030942A1 |
A conductive foam tape for attaching a display panel sequentially comprises: a first adhesive layer, which is a conductive adhesive layer; a metal deposition layer; a foam layer; and a second adhesive layer, and comprises a thermoplastic...
|
|
WO/2022/031409A1 |
A method is provided for bonding substrates having dissimilar coefficients of thermal expansion, using a thermoset adhesive. The method involves a pre-cure step using radio-frequency energy, followed by a heat-curing step.
|
|
WO/2022/030565A1 |
The present invention relates to an electrically peelable adhesive sheet which is sequentially provided, in the following order, with: a conductive base material that comprises a supporting base material and a conductive layer; a coating...
|
|
WO/2022/027769A1 |
An azobenzene derivative, a preparation method therefor, an azophenyl light-controlled reversible adhesive, and a method for using same. The azobenzene derivative has a structure represented by P1 and P2. The preparation method therefor ...
|
|
WO/2022/030198A1 |
The present invention provides a method for dividing a bonded body, said method enabling separation of an adhesive in a bonded body for display devices even in cases where the adhesive is firmly adhered to a member. The present invention...
|
|
WO/2022/032289A1 |
A dual-cure adhesive composition that exhibits very low visible light reflectance when in a cured condition. The adhesive is curable by electromagnetic radiation and temperature at or above room temperature. Due to the very low visible l...
|
|
WO/2022/025203A1 |
[Problem] To provide: a viscosity adjusting agent which ameliorates the deterioration in handling properties and coating properties associated with the activation of a viscosity adjusting agent when used in a curable composition manufact...
|
|
WO/2022/025123A1 |
A resin composition comprises (A) a bismaleimide resin formed by reacting aromatic tetracarboxylic acid (a1), a dimer diamine (a2), and maleic anhydride (a3); and (B) an inorganic filler that has been surface-treated with a silane compou...
|
|
WO/2022/024668A1 |
Provided is a method for using an aqueous liquid such as water to remove, with little load on the adherend, by using a remover tape, an adhesive that has remained on the surface of a member or article. Provided is a method for removing, ...
|
|
WO/2022/024757A1 |
Provided is an electroconductive adhesive which is excellent in connection stability between adherends that are electroconductive members, which maintains the connection stability even when attached at high temperatures, and in which swe...
|
|
WO/2022/023830A1 |
An electrically conductive adhesive film includes an adhesive layer having opposing first and second major surfaces spaced apart a distance T in a thickness direction of the adhesive layer, where T ≥ 20 microns, and a plurality of elec...
|
|
WO/2022/025118A1 |
The present invention addresses the problem of developing a chloroprene polymer latex adhesive composition which has excellent adhesiveness to a polyolefin and also has excellent heat creep resistance to an object to which the compositio...
|
|
WO/2022/024838A1 |
The present disclosure provides a thermosetting composition that contains an epoxy resin and a thiol compound, enables temporary adhesion, and exhibits favorable storage stability. The thermosetting composition according to the present d...
|
|
WO/2022/024579A1 |
The present invention provides a polarizing film with a pressure-sensitive-adhesive layer, comprising a pressure-sensitive-adhesive layer which is durable in a high-temperature environment and in which reworkability after preheating is m...
|
|
WO/2022/025234A1 |
The present invention addresses the problem of obtaining an adhesive that has excellent adhesion strength (storage elasticity) after curing, that has an excellent elongation rate after curing, and that does not readily peel due to heat h...
|
|
WO/2022/021770A1 |
A multifunctional packaging adhesive film and a preparation method therefor. The multifunctional packaging adhesive film contains, by mass percentage, 90-99% of a polymer and 1-10% of an auxiliary agent, wherein the auxiliary agent conta...
|
|
WO/2022/025207A1 |
An adhesive film for circuit connection contains electroconductive particles, and includes, in the film thickness direction, a region A containing a cationically polymerizable compound, a thermal cationic polymerization initiator, and an...
|
|
WO/2022/022500A1 |
The present invention relates to a self-adhesive waterproof coiled material of a super-strong cross laminated film, comprising sequentially from top to bottom: an isolation protection layer, a non-asphalt-based self-adhesive layer, a str...
|
|
WO/2022/024734A1 |
Provided is a composition which contains a highly industrially versatile alkenyl group-containing organopolysiloxane and an organopolysiloxane having a hydrolysable silyl group at both ends of the molecular chain as base polymers, in com...
|
|
WO/2022/024510A1 |
The present invention provides: a composition for an adhesive, the composition containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D), the phenoxy resin (C) having an elastic modu...
|
|
WO/2022/019095A1 |
This thermosetting resin composition contains: an epoxy resin that is solid at 25°C; an epoxy resin that is non-solid at 25°C; fine particulate rubber that is dispersed in the non-solid epoxy resin; a setting agent; an inorganic filler...
|
|
WO/2022/019166A1 |
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A), and an adhesive film (50) that is...
|
|
WO/2022/019160A1 |
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A), and an adhesive film (50) that is...
|
|
WO/2022/019075A1 |
This thermally conductive adhesive sheet is formed by molding, into a sheet shape, a resin composition comprising (A) conductive particles, (B) a thermosetting resin, (C) a block copolymer, and (D) a binder resin, wherein the (C) block c...
|
|
WO/2022/019285A1 |
Provided is a shock absorbing material having adhesiveness and light-blocking properties. A shock absorbing material 1 in which an insulating inorganic black pigment 3 is contained in a silicone composition 2 having adhesiveness and stre...
|
|
WO/2022/019790A1 |
Easy to use and store, an environmentally friendly binding agent for cellulose-containing materials, without animal products, particularly suitable for use in the production of wood composites, and a composite material product obtained w...
|
|
WO/2022/015674A2 |
Inks, paints, adhesives, and paint strippers may be formulated to include one or more branched surfactants, from one or more surfactant classes, such as derivatives of amino acids that have surface-active properties.
|
|
WO/2022/014374A1 |
The present invention addresses the problem of providing an encapsulation method which uses a cover film that exhibits high safety and high encapsulation performance. An encapsulation method according to the present invention is carrie...
|
|
WO/2022/014313A1 |
An aspect of the present invention relates to an adhesive agent composition and an adhesive sheet. The adhesive agent composition contains: a (meth)acrylic polymer (A) which is a polymer of a monomer component that includes, in specific ...
|
|
WO/2022/014531A1 |
An adhesive composition which contains (a) an acid-modified polyolefin, (b) a phenolic resin that has a polycyclic structure and (c) an epoxy resin, and which additionally contains at least one of (d) an inorganic filler and (e) a flame ...
|
|
WO/2022/011814A1 |
Provided in the present invention are a double-shell self-repairing microcapsule, and a preparation method therefor and use thereof. The double-shell microcapsule comprises a core material, a first wall material layer wrapping the core m...
|
|
WO/2022/014646A1 |
Provided is an amineimide compound having excellent permeability, excellent curability, and storage stability. An amineimide compound represented by formula (1), (2), or (3). (In formulae (1)-(3), R1s each independently represent a hydro...
|
|
WO/2022/014552A1 |
The main purpose of the present disclosure is to provide a composition having excellent dimensional stability, adhesive strength, and deep curability. The present disclosure achieves the above purpose by providing a composition containin...
|
|
WO/2022/014626A1 |
The present invention provides a conductive adhesive composition which is able to achieve a good bonding strength, while achieving a good thickness between adherends in cases where the blending amount of a conductive powder is relatively...
|
|
WO/2022/014625A1 |
A conductive adhesive composition which contains a conductive powder and a curable component, and which is able to achieve good bonding strength. This conductive adhesive composition contains (A) a conductive powder and (B) a curable com...
|
|
WO/2022/014204A1 |
An aspect of the present invention provides a protection sheet that protects a transparent sheet. The protection sheet is provided with a sheet-shaped base material and an adhesive layer that affixes the base material to the transparent ...
|
|
WO/2022/009882A1 |
This polyisocyanate composition contains an isocyanate derivative. The isocyanate derivative is a product of a reaction between xylylene diisocyanate and a polythiol having two or more mercapto groups. A molecular terminal of the derivat...
|
|
WO/2022/009513A1 |
Provided is an adhesive material for easy disassembly which combines satisfactory adhesion strength with suitability for easy disassembly. The adhesive material for easy disassembly comprises an epoxy resin and a polyaddition-type curi...
|
|
WO/2022/009570A1 |
Disclosed is an integrated dicing die-bonding film. Said integrated dicing die-bonding film comprises: dicing tape that has a substrate and an adhesive layer provided upon the substrate; and a die-bonding film that is disposed upon the a...
|
|
WO/2022/009571A1 |
Disclosed is an integrated dicing die-bonding film. Said integrated dicing die-bonding film comprises: dicing tape that has a substrate and an adhesive layer provided upon the substrate; and a die-bonding film that is disposed upon the a...
|
|
WO/2022/009054A1 |
To provide a water sealing adhesive film for decoration that can reduce or prevent the infiltration of water into an interface between an adhesive layer and an adherend even in an environment where the adhesive film can be contacted with...
|
|
WO/2022/009913A1 |
The present invention provides a hot melt adhesive composition which has transparency and is suppressed, even after curing in a high temperature high humidity environment, in increase of adhesion, adhesive residue on an adherend and cont...
|
|
WO/2022/007455A1 |
A modified hydroxyethyl methyl cellulose for reinforced ceramic tile glue, prepared from the following mass percentages of raw materials: 54%-94% of hydroxyethyl methyl cellulose, 5%-40% of starch ether, 0.5%-3% of dispersant, and 0.5%-3...
|
|
WO/2022/007454A1 |
A modified hydroxypropyl methyl cellulose for an enhanced ceramic tile adhesive, which is made from the following raw materials in percentages by mass: 54% to 94% of a hydroxypropyl methyl cellulose, 5% to 40% of a starch ether, 0.5% to ...
|
|
WO/2022/004605A1 |
A high-frequency dielectric heating adhesive sheet (1A) having an adhesive layer (10), wherein the adhesive layer (10) contains a thermoplastic resin (A) having a reactive site (Y), a dielectric filler (B) that generates heat due to appl...
|
|
WO/2022/004606A1 |
Provided is an adhesive agent (adhesive sheet 1A) for high-frequency induction heating, the adhesive agent (adhesive sheet 1A) for high-frequency induction heating containing at least a thermoplastic resin (A) and a dielectric filler (B)...
|
|
WO/2022/000762A1 |
The present invention relates to a high-temperature and high-humidity hydrolysis-resistant aqueous injectable shoe adhesive and applications thereof. The raw material formula of the shoe adhesive comprises an aqueous polymer dispersion, ...
|
|
WO/2022/004604A1 |
A high-frequency dielectric heating adhesive sheet (1A) having an adhesive layer (10) containing at least a thermoplastic resin (A) and a dielectric material that generates heat due to the application of a high-frequency electric field, ...
|
|
WO/2022/004800A1 |
Provided is a label which exhibits excellent barrier properties and transparency and which suppresses fouling of and adhesive residue on a container, as caused by residual monomers in an adhesive layer. This label is used in order to s...
|
|
WO/2022/005139A1 |
The present invention relates to an adhesive composition containing a urethane oligomer, a dilution monomer, and a photoinitiator, wherein the weight ratio of heteroatoms in the dilution monomer is adjusted, and the permittivity and diss...
|
