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JP2023154283A |
To provide an adhesive composition and an adhesive film for circuit connection which can provide a circuit connection structure that makes connection resistance between opposing electrodes less likely to increase even under high-temperat...
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JP2023543691A |
(a) a water-based acrylic polymer emulsion component having a Tg greater than -20°C; (b) at least one nanocellulose component comprising fibers and/or crystals having a length/width ratio of 10 to 1,000; c) optionally at least one isocy...
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JP7363864B2 |
The invention provide a conductive adhesive sheet and a portable electronic device. The conductive adhesive sheet has a total thickness of 50 [mu]m or less which has a conductive substrate and one or two or more conductive adhesive agent...
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JP7364107B2 |
To provide a conductive laminate and a conductive laminated tape which can achieve both conductivity and various characteristics of insulating properties on the surface and blackness while being small in the total thickness and thin.A co...
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JP2023152723A |
To provide a bond for a metal plate which can suppress adhesive residue when being peeled from a metal plate and the like, and is excellent in adhesion force and solder reflow resistance, a print circuit board reinforcement member having...
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JP2023153409A |
To provide an easily disassemblable adhesive material which has both excellent adhesive strength and easy disassemblability.An easily disassemblable adhesive material contains a thermosetting resin and thermoexpansible particles. The the...
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JP7361447B2 |
To provide a conductive adhesive tape that achieves both excellent conductivity and excellent adhesiveness and a conductive resin composition which can be used in the production of it.The problem is solved by a conductive resin compositi...
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JP2023149878A |
To prevent reduction of initial conduction characteristics and to suppress occurrence of shorts even when using conductive particles of an average particle diameter of less than 3 μm for application to high-density mounting concerning a...
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JP2023543151A |
A composition for use in manufacturing an in-mold electronic (IME) component, the composition comprising a binder comprising a crosslinking agent comprising melamine formaldehyde, a thermoplastic resin comprising hydroxyl groups, and a s...
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JP2023146209A |
To prevent initial conduction reliability from being reduced and also suppress occurrence of short-circuiting even in a case where conductive particles of which the average particle diameter is smaller than 3 μm are used for an applicat...
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JP2023147186A |
To provide a conductive composition, a conductive sheet, a metal reinforcing plate, a wiring board with a metal reinforcing plate, and an electronic device, wherein the conductive composition effectively controls resin flow, has high adh...
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JP2023144908A |
To provide an adhesive sheet that has excellent adhesion and transparency and also excellent antistatic performance.An adhesive sheet is composed of an adhesive composition [I] that includes a (meth)acrylic polymer with hydroxy groups (A...
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JP7359252B2 |
An electrically conductive resin composition according to an embodiment of the present invention contains Ag particles (A), a base resin (B) and a radical initiator (C). The 10-hour half-life decomposition temperature of the radical init...
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JP7358670B1 |
An object of the present invention is to provide a connecting body that can suppress deterioration of interlayer adhesion over time. [Solution] A connection body having a first metal base material, a conductive adhesive layer, and a seco...
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JP2023138947A |
To provide a conductive material that allows solder to be efficiently disposed on an electrode, and can effectively improve conduction reliability between vertical electrodes to be connected.A conductive material has a thermosetting comp...
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JP2023139030A |
To provide an adhesive film having excellent adhesion performance excellent in balance of adhesion force, and having contamination resistance, in low peeling speed and high peeling speed, and excellent antistatic performance without caus...
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JP7354252B2 |
Provided are a bonding film that has sufficient connection heat resistance and high reliability, enables satisfactory bonding to a substrate irrespective of the type of an electrode of a semiconductor element, and makes a bonding step si...
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JP7351437B2 |
A conductive resin composition according to the present invention includes (A) silver-containing particles, and (B) a trifunctional or higher aliphatic epoxy compound, wherein the content of (A) the silver-containing particles is at leas...
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JP7350653B2 |
The sinter-bonding composition according to the present invention contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 µm or less and the proportion of the p...
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JP7347576B2 |
One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that ...
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JP2023539866A |
The present invention provides a resin component comprising: a) 1) a first epoxy resin; and 2) a second epoxy resin and/or a functionalized polybutadiene resin and/or a functionalized butadiene-acrylonitrile copolymer; b) curing for epox...
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JP7347618B2 |
A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release f...
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JP7344812B2 |
To provide a double-sided adhesive sheet that can be repeatedly used many times for bonding, processing, and peeling a work-piece such as a film-like substrate and a semiconductor member to a conveyance tool, can suppress static build-up...
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JP7340433B2 |
To provide an active energy ray-curable adhesive composition that has excellent adhesion to glass while preventing the occurrence of residual adhesive even when peeled off after left standing in a high-temperature and high-humidity envir...
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JP7339989B2 |
Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a conn...
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JP7336812B2 |
Disclosed is a method for manufacturing an anisotropic conductive adhesive film. The method comprises the steps of: preparing a mold including an adhesive film having barrier particles attached to one surface thereof, the barrier particl...
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JP2023121608A |
To provide an anisotropic conductive film that excels in conduction resistance and mechanical connection reliability, a connection structure and a method for producing a connection structure.An anisotropic conductive film includes a modi...
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JP7335559B2 |
An adhesive composition containing (A) a modified polyolefin resin and (B) an epoxy compound, wherein the modified polyolefin resin (A) is a polyolefin resin graft modified with a modifying agent that contains an α,β-unsaturated carbox...
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JP7335687B2 |
To provide conductive particles capable of making the connection resistance low, even when the pressure bonding is performed under low pressure in the case of electrically connecting between electrodes.A conductive particle according to ...
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JP2023118776A |
To provide an adhesive composition which has excellent storage stability and can be cured at a relatively low temperature in a short time.There is provided an adhesive composition which comprises an onium salt represented by the followin...
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JP2023117713A |
To provide an adhesive film that can prevent a micro piece from being bent and a method for manufacturing adhesive film.An adhesive film 1 is provided with a release film 2, and an adhesive layer 3 laminated on one surface 2a side of the...
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JP7331693B2 |
Disclosed is an electroconductive adhesive composition comprising (A) electroconductive particles, (B) a thermosetting resin, (C) a flux activator, and (D) a curing catalyst. The electroconductive particles include a metal having a melti...
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JP2023536077A |
b) at least one ionic component as a catalyst for epoxy homopolymerization; c) conductive particles; and d) barium sulfate (BaSO).4), magnesium hydroxide (Mg(OH)2), aluminum hydroxide (Al(OH)3), zinc oxide (ZnO), zinc hydroxide (Zn(OH)2)...
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JP2023536026A |
The present invention discloses a thermally conductive structural adhesive for new energy power batteries and a method for producing the same. This adhesive comprises an A composition containing 3.3 to 14% of at least one of a block-poly...
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JP7332129B2 |
The present invention addresses the problem of providing a conductive composition and a conductive adhesive agent that have high fluidity and conductivity. The present invention provides a conductive composition containing (A) conductive...
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JP7329598B2 |
A conductive paste which contains a silver powder, a fatty acid and a diluent.
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JP7328856B2 |
To provide conductive particles that can improve the accuracy of arrangement of conductive particles in conductive connection.A conductive particle has a conductive part. On the external surface of the conductive part, there is a heat re...
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JP7327700B1 |
Kind Code: A1 The present disclosure provides a roll-shaped conductive bonding sheet and a metal reinforcing plate that do not cause blocking during unwinding, have excellent film thickness security, have good peelability of a protective...
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JP2023534753A |
Shielding films and circuit boards. The shielding film includes a first film layer (11), a contrast structure layer (12) and an electromagnetic shielding layer (13), the first film layer (11) being on the first side of the electromagneti...
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JP7321979B2 |
To provide a conductive adhesive composition used for electrically connecting a flexible wiring board and an electronic component, and capable of forming a cured product having excellent adhesive strength and electrical conductivity even...
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JP2023108493A |
To provide a foamable adhesive sheet having good adhesiveness and insertability after foaming and curing.There is provided a foamable adhesive sheet disposed between a first member and a second member which has a first adhesive layer 1 c...
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JP7317415B2 |
Disclosed is a manufacturing method for an anisotropic conductive adhesive film. In the present method, by using a mold including an adhesive film having barrier particles attached to the surface thereof, the barrier particles having a d...
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JP7314841B2 |
To provide a conductive laminate and a conductive laminated tape which can achieve both conductivity and various characteristics of insulating properties on the surface and blackness while being small in the total thickness and thin.A co...
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JP2023101179A |
To provide a roll of an adhesive tape that can prevent the blocking phenomenon and allows smooth drawing of an adhesive tape.A roll 1 of an adhesive tape comprises a core 2 extending in an axis direction L, around which an adhesive tape ...
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JP7311671B2 |
To provide an adhesive film and a surface protective film having excellent balance of adhesive force at a low peeling speed and at a high peeling speed, stain resistance, excellent adhesive capabilities and excellent antistatic performan...
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JP7309522B2 |
Provided is a polarization film laminate, etc., with which it is possible to comprehensively solve the problems of polyenization, decoloration, and heating reddening. A polarization film laminate comprising a polarization film that inc...
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JP7308028B2 |
To provide means for balancing connectibility and insulation quality with high level, in an anisotropic conductive film.In an anisotropic conductive film, an intermediate layer, i.e., a hardening layer of an uncured intermediate layer, h...
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JP7306594B1 |
Kind Code: A1 A conductive film, a wound body, a connection structure, and a method for manufacturing a connection structure are provided, in which an adhesive film can be attached to adhesive surfaces of various shapes and the adhesive ...
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JP7305957B2 |
A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release f...
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JP2023094423A |
To provide an adhesive composition usable also for connection that requires higher adhesion strength due to substrate difference such as FOG or COG mounting, and excellent in dispersibility of conductive particles and connection reliabil...
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