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JP2024028455A |
An object of the present invention is to provide a conductive laminate and a conductive adhesive tape which have good alcohol resistance and surface insulation on the outermost surface, and which also have excellent productivity. [Soluti...
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JP2024508615A |
The present application provides a corrosion resistant, high voltage, electrochemically debonded adhesive composition for forming an adhesive layer. It has high adhesion to the substrate to which it is attached, a reduced corrosion effec...
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JP2024025090A |
The present invention provides an adhesive film for circuit connection that can suppress localization of conductive particles and reduce connection resistance even when heat and external force are applied. [Solution] A circuit connection...
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JP2024022787A |
The present invention provides a conductive paste that can improve storage stability, improve screen printability, and efficiently arrange solder particles on electrodes. A conductive paste according to the present invention includes a t...
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JP2024022346A |
An object of the present invention is to provide a conductive paste for slit nozzles with improved leveling properties. [Solution] 1. A conductive paste for slit nozzles containing silver-containing particles and a (meth)acrylic monomer,...
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JP2024022309A |
An object of the present invention is to provide a conductive paste for a slit nozzle that is prevented from flowing more than necessary after being discharged. [Solution] A conductive paste for a slit nozzle containing silver-containing...
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JP7431720B2 |
A purpose of the present invention is to provide an adhesive composition for fixing movable components which has excellent adhesiveness to both metals and non-metals, can be cured at low temperatures, and can prevent the movable componen...
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JP7430892B2 |
An epoxy resin composition which exhibits excellent storage stability while having a low initial viscosity and favorable low temperature curability and an electro-conductive adhesive containing the same. An epoxy resin composition includ...
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JP7428494B2 |
The objective of the present invention is to provide an adhesive sheet difficult to generate peeling at an interface between an adhesive layer and an object to be attached in a bending part, and capable of suppressing light leakage due t...
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JP7427235B2 |
The present invention has an object of obtaining an electrically peelable adhesive product that is strong in adhesibility when used, is excellent in peelability even though a low voltage is applied, and does not leave much adhesive depos...
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JP2024014940A |
[Problem] The surface resistivity of the adhesive layer is 9.0×10+10Provided are an adhesive composition, an adhesive film, a polarizing plate with an adhesive layer, and a liquid crystal panel that have extremely excellent antistatic p...
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JP2024011926A |
An object of the present invention is to provide a conductive paste that can provide a semiconductor device with improved mounting reliability variations. [Solution] In a conductive paste containing a monomer (A), a polymer (B), conducti...
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JP2024011945A |
[Problem] To provide a conductive paste with improved balance between mounting reliability and thermal conductivity. [Solution] In a conductive paste containing a (meth)acrylic monomer (A), a (meth)acrylic polymer (B), and conductive par...
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JP7421132B2 |
A cationically polymerizable anisotropic conductive film using an alicyclic epoxy compound, which has more excellent storage life than ever before, while ensuring curing temperature and connection reliability that are the same as before....
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JP7420310B2 |
A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release f...
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JP7420467B2 |
A method of conductively bonding a test probe tip having an electrically conductive element to a device under test (DUT) having an electrical connection point, the method comprising: positioning the electrically conductive element of the...
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JP7420062B2 |
To provide a conductive laminate and a conductive pressure-sensitive adhesive tape which exhibit good alcohol resistance and surface insulating properties on an outermost surface and are excellent in productivity.The present invention pr...
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JP7418731B2 |
The method for bonding metallic members according to an aspect of the present invention is a method for bonding metallic members to each other which comprises: a step in which a silver ink composition adherent to a surface of a first met...
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JP7415283B2 |
The present invention aims to provide a resin composition which can form a cured product having a high adhesive property and a high thermal conductivity. A resin composition containing an epoxy compound (A), an amine curing agent (B) and...
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JP7413024B2 |
Provided are: an electrically conductive adhesive which exhibits excellent adhesive properties and storage stability and which is obtained using an ultraviolet radiation-curable resin; and a joined structure and electronic component obta...
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JP7412082B2 |
Provided is a novel adhesive sheet suitably used for simultaneous batch inspection of a plurality of electrically-conductive small pieces. This adhesive sheet comprises an adhesive agent layer. The adhesive agent layer has a surface resi...
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JP2024000392A |
[assignment] To provide a bonding paste that has high bonding strength at bonded locations and suppresses a decrease in bonding strength due to cooling and heating cycles. Another object of the present invention is to provide a bonding p...
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JP2024000393A |
[assignment] To provide a metal particle-containing composition capable of providing a bonding paste that has high bonding strength at bonded locations and suppresses a decrease in bonding strength due to cooling and heating cycles. Anot...
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JP2024500082A |
(A) conductive filler, (B) polydiorganosiloxane polymer, (C) polyorganohydrogensiloxane, (D) hydrosilylation reaction catalyst, (E) polymer additive, and optionally (F) hydrosilylation reaction inhibition. The silicone composition contai...
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JP7400184B2 |
To provide a heat conductive adhesive which is excellent in adhesion and heat conductivity and has large elongation ratio of a cured product, in particular, is suitable for a method for manufacturing a semiconductor module.A heat conduct...
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JP7401361B2 |
To provide a thermoelectric conversion module which enhances followability to a heat source surface including a curved shape and can further improve thermoelectric performance.A thermoelectric conversion module includes a first substrate...
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JP7395979B2 |
To provide a conductive paste that can be used as a die attach paste with excellent physical and electrical connection reliability, while suppressing bleed-out of a diluent and preventing dripping and bleeding.The conductive paste for el...
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JP2023172562A |
To provide an adhesive composition and a circuit connection material which can achieve both storage stability and peeling resistance under a high temperature and high humidity condition, and a connection body which prevent peeling on an ...
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JP7390237B2 |
To provide an anisotropic conductive resin composition excellent in optical transparency.An anisotropic conductive resin composition comprises (A) a silicone-modified epoxy resin, (B) a curative, (C) conductive particles, and (D) a fluor...
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JP7386773B2 |
To provide a novel and improved anisotropic conductive adhesive which can be prepared by a simpler step and has high reliability, a connection structure, an anisotropic conducting connection method and a method for producing the connecti...
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JP7385588B2 |
Disclosed herein is an electrically conductive adhesive composition, which including milled carbon fibers dispersed in a thermosetting resin and a curative agent. Also, disclosed herein are articles comprising at least two components adh...
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JP7385721B2 |
An adhesive composition includes 0.1 to 1 part by weight of nano panicles, 50 to 95 parts by weight of acrylate resin, and 5 to 50 parts by weight of a monomer or oligomer of acrylate or acrylic acid containing multi-functional groups, a...
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JP2023165280A |
To provide a film-like adhesive excellent in temporary attachability to a silicon substrate.A film-like adhesive has a laminated structure in which a first insulating adhesive layer, a conductive adhesive layer containing conductive part...
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JP2023547750A |
The present application provides an adhesive compound, a conductive adhesive, and a secondary battery containing the same. The adhesive compound according to the present application has the structure of formula (I), but R1,R2are each ind...
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JP7375249B1 |
An object of the present invention is to provide a conductive adhesive composition that can achieve good electrical properties including connection resistance without impairing conductivity even when the amount of silver powder blended i...
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JP7373208B2 |
A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of uretha...
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JP7372824B2 |
The invention relates to a polarizing film with an adhesive layer, which comprises a polarizing film and an adhesive layer. The polarizing film comprises a polarizing element, a transparent protective film on only one surface of the pola...
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JP7370985B2 |
A metal particle-containing composition of the present invention contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) co...
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JP7369756B2 |
To ensure the conductivity between an electronic component and a circuit board, and prevent a short circuit between the electrode terminals of the electronic component even when the wiring pitch of the circuit board or the electrode term...
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JP7368765B2 |
An anisotropic conductive film that can be produced in high productivity and can reduce a short circuit occurrence ratio has a first conductive particle layer in which conductive particles are dispersed at a predetermined depth in a film...
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JP2023155272A |
To meet a continuing need for improved stretchable electrical conductors and flexible electrically conductive adhesives (ECAs).This invention provides a polymer thick film electrically conductive paste composition comprising: conductive ...
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JP2023154283A |
To provide an adhesive composition and an adhesive film for circuit connection which can provide a circuit connection structure that makes connection resistance between opposing electrodes less likely to increase even under high-temperat...
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JP2023543691A |
(a) a water-based acrylic polymer emulsion component having a Tg greater than -20°C; (b) at least one nanocellulose component comprising fibers and/or crystals having a length/width ratio of 10 to 1,000; c) optionally at least one isocy...
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JP7363864B2 |
The invention provide a conductive adhesive sheet and a portable electronic device. The conductive adhesive sheet has a total thickness of 50 [mu]m or less which has a conductive substrate and one or two or more conductive adhesive agent...
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JP7364107B2 |
To provide a conductive laminate and a conductive laminated tape which can achieve both conductivity and various characteristics of insulating properties on the surface and blackness while being small in the total thickness and thin.A co...
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JP2023152723A |
To provide a bond for a metal plate which can suppress adhesive residue when being peeled from a metal plate and the like, and is excellent in adhesion force and solder reflow resistance, a print circuit board reinforcement member having...
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JP2023153409A |
To provide an easily disassemblable adhesive material which has both excellent adhesive strength and easy disassemblability.An easily disassemblable adhesive material contains a thermosetting resin and thermoexpansible particles. The the...
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JP7361447B2 |
To provide a conductive adhesive tape that achieves both excellent conductivity and excellent adhesiveness and a conductive resin composition which can be used in the production of it.The problem is solved by a conductive resin compositi...
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JP2023149878A |
To prevent reduction of initial conduction characteristics and to suppress occurrence of shorts even when using conductive particles of an average particle diameter of less than 3 μm for application to high-density mounting concerning a...
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JP2023543151A |
A composition for use in manufacturing an in-mold electronic (IME) component, the composition comprising a binder comprising a crosslinking agent comprising melamine formaldehyde, a thermoplastic resin comprising hydroxyl groups, and a s...
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