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WO/1999/037716A1 |
The invention relates to an aqueous floor adhesive, containing a mixture of 10 to 50 wt. % of a polymer A) with a gel content of less than 40 wt. % and a mean molar weight M¿n? of the soluble constituents of less than 30,000 and 50 to 9...
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WO/1999/024520A1 |
The present invention provides a microwave curable adhesive comprising a polymer composition (e.g., a thermoplastic or thermoset polymer) and first and second microwave susceptible components. The first and second microwave susceptible c...
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WO/1999/021930A1 |
Aqueous adhesive preparations, especially for labeling bottles, should have a high adhesion value and be odorless when removed again. To this end, aqueous preparations are utilized which contain 1 to 70 wt. % of a copolymer from acid gro...
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WO/1999/018166A1 |
A pressure-sensitive adhesive comprising a blend of at least two components, wherein the first component is at least one pressure-sensitive adhesive and the second component is at least one thermoplastic material, wherein the components ...
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WO/1999/006496A2 |
The invention relates to an electrically and thermally conductive adhesive composition for cementing together at least one metallized (e.g. aluminized or silvered) surface of a positive temperature coefficient (PTC) element (11) to at le...
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WO/1999/001519A1 |
An adhesive for semiconductor components, comprising as a substrate polymer at least one cyclic thermoplastic polymer having a number average molecular weight of 1,000 to 500,000 and selected from the group consisting of cyclic olefin po...
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WO/1998/054267A1 |
Heat-resistant adhesives each containing, for example, an amido bond, an imido bond, an ester bond or an ether bond, being insoluble in encapsulant-constituting resins at an encapsulant-molding temperature, and having a shear adhesive st...
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WO/1998/051756A1 |
A two-part adhesive, characterized by being essentially composed of an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and being separated into agent (A) containing one or two components selecte...
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WO/1998/039395A1 |
A thermosetting adhesive paste exhibiting a high thermal conductivity suitable for die attach applications.
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WO/1998/028020A1 |
The present invention relates to a combination of a substrate with topical adhesives for attachment to the skin. In particular the present invention relates to a combination of a substrate with a topical adhesive which can be employed fo...
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WO/1998/028021A1 |
The present invention relates to topical adhesives for attachment to the skin. In particular the present invention relates to such topical adhesives which can be employed for attachment to the skin of articles such as protective articles...
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WO/1998/028024A1 |
The present invention relates to topical adhesives for attachment to the skin. In particular the present invention relates to such topical adhesives which can be employed for attachment to the skin of protective articles, clothing, prost...
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WO/1998/028016A1 |
The present invention relates to topical adhesives for attachment to the skin. In particular the present invention relates to such topical adhesives which can be employed for attachment to the skin of protective articles, clothing, prost...
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WO/1998/027177A1 |
A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises (a) a thermally reworkable cross-linked resin produced by reacting at least one dieno...
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WO/1998/027178A1 |
A novel thermally reworkable anisotropic conductive adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises (a) a thermally reworkable cross-linked resin produced by reacting at lea...
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WO/1998/026665A1 |
A composition comprising: (a) a metal complex of a cyclic thiohydroxamic acid such as the 2:1 zinc complex of 3-hydroxy-4-methylthiazol-2(3H)-thione and (b) a salt of the metal such as zinc chloride, acetate or oxide. The presence of com...
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WO/1998/024860A1 |
A thermally conductive pressure-sensitive adhesive which is excellent in thermal conductivity and adhesive properties, has a high adhesive strength especially at high temperatures (high holding power under high-temperature shear), underg...
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WO/1998/023700A1 |
An adhesive sheet (2) is interposed between an electronic part (1) and a heat-radiating member (3). The sheet (2) comprises a thermally conductive substrate (21) and, disposed respectively on both sides thereof, layers (22 and 23) of a t...
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WO/1998/018879A1 |
A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the ...
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WO/1998/012040A1 |
A method of repairing a composite material product by adhering a repair patch to the composite material product with an adhesive or epoxy resin that includes magnetic particles. Thus, the adhesive or epoxy resin can be cured by electroma...
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WO/1998/010029A1 |
A heat-resistant anti-static pressure-sensitive adhesive tape comprising a substrate having coated thereon an acrylic microparticulate adhesive having an average diameter of at least 1 micrometer, wherein the microparticles have a surfac...
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WO/1998/008362A1 |
A composition for use in the production of metal traces and other metal components of printed circuit boards, wiring boards and the like comprises the following components: (a) a metal powder, (b) a solder powder, (c) a polymer or a mono...
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WO/1998/006007A1 |
The present invention provides a number of interrelated methods for the production of random and ordered arrays of particles and recesses, as well as films containing such arrays and recesses. The present invention also relates to the ra...
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WO/1997/048779A1 |
Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a surfactant. The surfactant has a hydrophile-lipoph...
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WO/1997/046631A1 |
A temperature-responsive adhesive article comprises (a) a temperature-responsive carrier capable of changing its shape at a first transition temperature; and (b) a thermomorphic pressure-sensitive adhesive on at least a portion of at lea...
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WO/1997/043352A1 |
A screen-printable adhesive composition capable of being applied to a substrate at room temperature comprising at least one alkyl acrylate; at least one reinforcing comonomer, a polyepoxide resin, and a polyepoxide resin curing agent; wh...
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WO/1997/042638A1 |
A process is disclosed for gluing together in an electroconductive and voltage-poor manner sensitive parts, possibly with different coefficients of thermal expansion, which need to be accurately positioned. The glue is applied, the setti...
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WO/1997/038676A1 |
Improved matrices for tissue repair comprising a biocompatible, bioerodable polymer which has a water solubility of about 0.01 to about 500 mg/mL at about 25 �C and adhesive strength of about 600 to about 150,000 Pa; and pressure sensi...
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WO/1997/033945A1 |
Methods for preparing viscoelastic compositions (for exemple, adhesives such as hot melt adhesives) in which a pre-viscoelastic composition (for exemple, a pre-adhesive composition) is combined with a packaging material and then polymeri...
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WO/1997/031549A1 |
A flame retardant fastener (10) adapted for releasable engagement to a second fastener. A backing layer (22) of the fastener is constructed of a flame retardant polymeric material having an exposed bonding surface and a support surface. ...
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WO/1997/027258A1 |
The invention concerns a porous shaped part which comprises at least one of the following water-soluble or water-dispersible substances as binder: carboxylated and/or alkoxylated starch, cellulose ether and fully synthetic vinyl polymers...
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WO/1997/024149A1 |
A polar, lipophilic pressure-sensitive adhesive composition comprising a hydrophilic polymer matrix and a plasticizing solution for said matrix comprising a water-soluble, polar organic compound and a compatible surfactant or mixture of ...
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WO/1997/021229A2 |
To create electrically conducting adhesive compounds and electrically conducting structures, an epoxy-based reaction resin mixture is proposed which can be hardened by a selected initiator system, UV radiation or heat. The single-compone...
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WO/1997/012503A1 |
The present invention provides a microelectronic assembly wherein a semi-crystalline copolymer adhesive composition (20), preferably provided in the form of a film, is used to electrically interconnect a first circuit pattern (14) on a f...
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WO/1997/003143A1 |
A screen printable adhesive composition comprising 25 to 100 parts by weight of at least one alkyl acrylate monomer and 0 to 75 parts by weight of at least one reinforcing comonomer, wherein said composition is substantially solvent free...
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WO/1997/003144A1 |
Pressure sensitive adhesives and heat activatable adhesives that are the reaction product of an acrylic acid ester of a monohydric alcohol whose homopolymer has a Tg less than 0 �C; a non-polar ethylenically unsaturated monomer whose h...
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WO/1996/037567A1 |
A high precision joining process for at least two parts uses a photosensitive resist as adhesive. In a first step, a layer of photosensitive resist with a defined thickness is applied on at least one of the parts. The thus obtained compo...
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WO/1996/031572A1 |
A composite adhesive for optical and opto-electronic applications contains the following: (a) transparent polymers and/or polymerisable oligomers and/or monomers suitable for use as adhesive; (b) nanoscale inorganic particles; (c) if req...
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WO/1996/029749A1 |
In accordance with this invention, a novel stick-on peel-off fastener (201), comprising one or more conductive sticky elements (204, 205), sandwiched between one or more terminals (256, 257) of a first object such as an electrical device...
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WO/1996/023837A2 |
An improved method and composition is provided for the preparation of electrically conductive bondlines for composite structures while retaining the desirable physical strength properties for an effective composite bondline. The bondline...
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WO/1996/016134A1 |
Pressure sensitive adhesives, and tackified pressure sensitive adhesives, and viscoelastic materials that are the polymerization product of an acrylic acid ester of a monohydric alcohol whose homopolymer has a Tg less than 0 �C; a non-...
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WO/1996/004347A1 |
A reaction adhesive becomes porous after hardening. This allows both small and larger gaps to be sealed between the bonded substrates, as the liquid adhesive has a low to medium viscosity and the hardened glue shows a marked volume incre...
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WO/1996/000969A1 |
The invention relates to an anisotropically conducting adhesive with particles dispersed in a thermoplastic base material. The particles (20) are finely divided below a percolation threshold and can be deliberately enriched to form aniso...
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WO/1995/031514A1 |
Composite pressure sensitive hydrophilic adhesive, permeable for water vapor and losing its adhesiveness in contact with liquid water, particularly suitable for temporary glueing medical means to the body surface, comprising a gelled mix...
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WO/1995/030720A1 |
A heat-resistant anti-static pressure-sensitive adhesive tape comprising a substrate having coated thereon a microparticulate adhesive having an average diameter of at least 1 micrometer, wherein the microparticles have a surface bearing...
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WO/1995/026385A1 |
Light transparent, visible bubble-free, curable adhesive compositions, their method of manufacture and their use in producing optically brilliant three-dimensional signs for both interior and exterior use are disclosed. The compositions ...
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WO/1995/023416A1 |
The invention concerns an anisotropically conducting adhesive with conducting particles dispersed in a base material. According to the invention, the particles (14) have spacer means (16) on their surfaces.
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WO/1995/020820A1 |
The invention provides a composition (3) comprising: (i) a ferrofluid comprising a colloidal suspension (4) of ferromagnetic particles in a non-magnetic carrier liquid, and (ii) a plurality of electrically-conductive particles (5) having...
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WO/1995/017312A1 |
A wall-covering sheet substrate web comprising in sequence a pressure sensitive adhesive layer, substrate layer, decorative surface layer and a release surface. The web is self-wound into a roll by consecutive winding, the adhesive layer...
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WO/1995/016998A1 |
An anisotropic, electrically conductive adhesive film comprises an insulating adhesive, electrically conductive particles dispersed in the electrically insulating adhesive, and transparent, spherical glass particles dispersed in the insu...
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