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JP2022524699A |
This specification describes an ammonia compound indicator containing an adhesive and a chemochromic compound disposed therein. In addition, a method for producing the above-mentioned elements and a method for indicating the presence of ...
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JP2022063329A |
To provide an adhesive composition excellent in low-temperature curability and storage stability.The adhesive composition according to the present invention contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) ...
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JP2022062720A |
To provide an anisotropic conductive film in which the dispersibility and particle capture property of conductive particles are excellent and conduction reliability is maintained even between terminals having a narrow pitch.An anisotropi...
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JP2022061564A |
To visualize stress applied to an adhesive in an adhesive strength test of adhesive.A method for testing adhesive strength of adhesive includes the steps of: preparing an adhesive 1 containing a stress luminescent body; bonding a test pi...
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JP7057056B2 |
A pressure-sensitive adhesive composition is disclosed making it possible that even when a polarizing film and a transparent conductive layer are laminated over each other to interpose a pressure-sensitive adhesive layer there between, t...
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JP2022061623A |
To provide an adhesive film for circuit connection, which can form a circuit connection structure having excellent connection resistance when applied to COP mounting, and has excellent adhesive strength to a plastic substrate.An adhesive...
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JP7053926B2 |
A pressure-sensitive adhesive layer attached polarizing film provided with a pressure-sensitive adhesive layer and a polarizing film is disclosed wherein the pressure-sensitive adhesive layer attached polarizing film is provided with the...
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JP2022055056A |
To provide a conductive adhesive capable of forming an adhesive layer that has low resistance, high adhesive strength, and low elasticity.A conductive adhesive contains silver powder and curable silicone resin. The silver powder contains...
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JP7049386B2 |
The present invention provides a pressure-sensitive adhesive layer attached polarizing film far realizing an in-cell type liquid crystal panel in which it is possible to prevent clouding attributable to the pressure-sensitive adhesive la...
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JP7049385B2 |
The present invention provides a pressure-sensitive adhesive layer attached polarizing film far realizing an in-cell type liquid crystal panel in which it is possible to prevent clouding attributable to the pressure-sensitive adhesive la...
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JP2022051002A |
To provide an adhesive composition for circuit connection which can maintain sufficiently low connection resistance and sufficient adhesive strength under high temperature and high humidity environment (for example, 85°C and 85%RH) even...
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JP7045006B2 |
To provide a temperature-sensitive resin which has excellent heat resistance and can be easily peeled by being cooled even after having been exposed to high temperature environment, and to provide a temperature-sensitive pressure-sensiti...
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JP2022050299A |
To provide: a cleavage molecular layer in which adhesion and peeling can be controlled through stimuli other than heat by using a change in bonding in a molecular layer; and a compound which constitutes the same.Provided is a compound in...
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JP2022048788A |
To provide a circuit connection adhesive tape that is difficult to cause a back surface transfer even when formed into a reel body by winding on a winding core and can sufficiently secure conduction between opposite electrodes and a reel...
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JP2022048791A |
To provide a circuit connection adhesive film capable of sufficiently securing conduction between opposite electrodes of circuit members, and further capable of obtaining a circuit connection structure excellent in peel resistance under ...
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JP2022048793A |
To provide an adhesive material reel which can sufficiently suppress occurrence of blocking and meanwhile obtain a circuit connection structure having excellent connection reliability between circuit members that face each other even if ...
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JP7041669B2 |
[Object] Provided are: a thermal bonding sheet suitable for actually providing sinter bonding between bonding targets while reducing misalignment of the bonding targets, and a dicing tape with such a thermal bonding sheet. [Solution] Thi...
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JP2022047539A |
To provide a laminate in which cracking is hard to occur even when repeatedly bent.The laminate comprises at least one structure obtained by laminating optical members via an adhesive layer. An adhesive layer in at least one of the struc...
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JP7039883B2 |
An anisotropic conductive film has a structure in which high hardness conductive particles having a 20% compression elastic modulus of 8000 to 28000 N/mm2 and low hardness conductive particles having a lower 20% compression elastic modul...
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JP2022046019A |
To provide a conductive adhesive composition excellent in conductivity, and also excellent in adhesive property and coating property.A conductive adhesive composition is a conductive adhesive composition containing an epoxy resin, a hard...
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JP7039984B2 |
To provide an adhesive composition for circuit connection having excellent adhesive strength.The present invention provides an adhesive composition for circuit connection containing polyrotaxane having a polymerizable functional group, w...
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JP7038749B2 |
The present disclosure is directed to a thermoresponsive adhesive material. The material comprises a linear, phase-separated polymer having fluorinated polymer units and hydrophobic polymer units. The fluorinated polymer units and the hy...
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JP7035370B2 |
An anisotropic conductive film or other filler-containing film 10A of the present invention includes a filler dispersed-layer 3 including a resin layer 2, a first filler layer with a filler 1A dispersed in a single layer in the resin lay...
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JP2022042097A |
To provide a conductive adhesive which more reliably maintains conductivity after curing.A conductive adhesive 1 comprises a conductive filler 12 and a substrate 11 containing a cyanoacrylate as a main component of an adhesive function a...
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JP2022039384A |
To prevent peeling at an interface between a circuit member and a circuit connection, which occurs in the case where a circuit connection structure is used in high-temperature and high-humidity conditions, while improving the rate of cat...
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JP2022039198A |
To provide a paste for joining which has low viscosity, and with which a joined body excellent in coating adaptability, in viscosity stability over time, and in initial and after thermal cycle test joining strength can be formed.A paste ...
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JP7032398B2 |
The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhe...
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JP7027390B2 |
To ensure the conductivity between an electronic component and a circuit board, and prevent a short circuit between the electrode terminals of the electronic component even when the wiring pitch of the circuit board or the electrode term...
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JP7027618B2 |
The present invention provides an electromagnetic wave shielding film which has excellent transparency and a low electrical connection resistance value even if a large amount of conductive particles are blended into a conductive adhesive...
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JP7026663B2 |
To provide an adhesive sheet for a display, which can prevent generation of static electricity, has excellent adhesive force to a display device and shows a low reduction rate of the adhesive force even after left to stand under high tem...
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JP2022032849A |
To provide a photoelectric conversion element having a hardening material which can exert an excellent adhesive property, and provide a photoelectric conversion element module.A photoelectric conversion element comprises a hardening mate...
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JP7025529B2 |
The purpose of the present invention is to provide an electroconductive adhesive composition having excellent thermal conductivity and migration resistance. The present invention relates to an electroconductive adhesive composition conta...
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JP7024771B2 |
An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first conne...
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JP2022515327A |
The present invention relates to a potentially reactive conductive polyurethane-based adhesive film.
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JP7020305B2 |
To provide an adhesive sheet that keeps the amount of use of conductive particles at a minimum necessary level, and can be effectively used to an adhesion face.One aspect of the present invention is an adhesive sheet 1 that has a long ba...
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JP7020029B2 |
To provide a conductive adhesive film which suppresses flow of a resin in connection compared to a conventional anisotropic conductive adhesive film for circuit connection, and can connect an electrode with low pressure and large area wi...
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JP7003540B2 |
To provide a composition which gives a cured product excellent electrical characteristics and heat resistance.A composition contains a substituted or unsubstituted allyl group-containing maleimide compound and a polyphenylene ether. The ...
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JP7017158B2 |
An anisotropic conductive film that can be produced in high productivity and can reduce a short circuit occurrence ratio has a first conductive particle layer in which conductive particles are dispersed at a predetermined depth in a film...
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JP6993536B2 |
The pressure-sensitive adhesive tape of the present invention is a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer comprising a photo-cured acrylic resin, a metal having a lower potential than that of iron...
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JP6995932B2 |
The present invention provides a conductive adhesive sheet which exhibits good provisional bondability even in cases where the surface smoothness is low. A conductive adhesive sheet which has a peak top temperature of storage elastic mod...
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JP7014236B2 |
The objective of the present invention is to provide a radical-curable adhesive, which is an adhesive composition capable of maintaining sufficient adhesion reliability even under conditions at a lower temperature for a shorter period of...
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JP7013649B2 |
To provide an adhesive composition that turns into a cured product with excellent physical properties (particularly, elastic moduli) even when cured at low temperature and in a short time.An adhesive composition contains a thiol compound...
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JP7013638B2 |
To provide an adhesive composition which is excellent in storage stability and can be cured at a relatively low temperature in a short time.The adhesive composition contains an onium salt represented by general formula (1) and a cationic...
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JP2022020338A |
To provide an adhesive film for circuit connection exhibiting an excellent resistance value by suppressing exfoliation of an electrode part generated when using a circuit connection structure in a high temperature high humidity environme...
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JP7012392B2 |
Provided is a photoresponsive polymer comprising repeating units based on an alkyl glyceryl itaconate which are represented by formula (A). (In formula (A), n is an integer of 4-17.)
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JP7006029B2 |
To provide an adhesive composition for circuit connection that makes it possible to obtain a structure showing low connection resistance and high connection reliability.An adhesive composition for circuit connection contains (A) solder p...
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JP7000857B2 |
This adhesive composition comprises a silane compound having a structure represented by general formula (I). (In the formula, X represents an organic group, R1 and R2 each independently represent an alkyl group, m represents an integer f...
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JP6996121B2 |
To provide a conductive adhesive sheet that has a small adhesion area and, even when stuck to a convexoconcave portion, has excellent adhesiveness, conductivity, and reworkability, and prevents the conductivity from deteriorating with ti...
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JP2022007948A |
To provide a thermosetting sheet which can comparatively suppress peeling of a semiconductor element and has comparatively high heat radiation property after curing, and a dicing die-bonding film.In a dicing die-bonding film 20 having a ...
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JP6989784B2 |
Disclosed is a granular adhesive comprising adhesive particles, wherein the adhesive particles include a core containing an adhesive composition, a shell covering the core, and an enclosed gas, and the shell includes solid particles.
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