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JP7242704B2 |
The present invention relates to an electrically conductive composition comprising a) a resin selected from the group consisting of epoxy (meth)acrylate, (poly)ester (meth)acrylate, urethane (meth)acrylate, silicone (meth)acrylate, poly(...
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JP7241526B2 |
To provide a base material particle for a conductive particle for use in forming a conductive particle excellent in dispersibility in water, capable of preventing agglomeration of the base material particle for a conductive particle duri...
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JP2023038214A |
To provide an anisotropic conductive adhesive, a method for manufacturing an anisotropic conductive adhesive, and a connection structure which enable dispersion of conductive particles by a simple method, and can suppress short circuit b...
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JP7235611B2 |
To provide a conductive material capable of effectively preventing generation of crack or warpage at a connection part when a connection structure is obtained by electrically connecting electrodes, and effectively enhancing adhesive forc...
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JP7234032B2 |
To provide an adhesive film production method, an adhesive film and a connected body production method which realize high adhesive strength.The adhesive film production method comprises: forming a first resin layer in which first rubber ...
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JP2023028930A |
To provide a polarization film with an adhesive layer having a separator which has conductive performance, and achieves both light peelability of a separator and re-workability of an adhesive layer.A polarization film with an adhesive la...
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JP2023029350A |
To provide an adhesive film excellent in reliability.An adhesive film includes a first adhesive layer containing a first conductive particle which is a dendrite-like conductive particle, and a second adhesive layer containing a second co...
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JP7228867B2 |
To provide a seal member card and a system for reducing electromagnetic wave noise generated by connecting a card device to an apparatus.A seal member 30 pasted to a card device such as a micro SD card connected to a drive recorder, has ...
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JP2023026584A |
To provide an adhesive composition having balanced adhesive force in a low peeling speed, and a high peeling speed, and capable of achieving both antistatic performance and stain resistance, an adhesive film, a surface protective film, a...
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JP7226621B1 |
Kind Code: A1 A conductive composition, a conductive sheet, a metal reinforcing plate, and a wiring with a metal reinforcing plate, which are excellent in suppressing resin flow, have high adhesiveness and conductivity, and can achieve b...
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JP7226636B2 |
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JP7225505B2 |
Provided is a conductive adhesive composition that is capable of being worked at no more than 120°C and has both isotropic conductivity and excellent adhesion properties. The conductive adhesive composition contains 50–300 parts by ma...
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JP7222904B2 |
There is provided a paste composition using copper fine particles that are capable of exhibiting conductivity after low-temperature sintering, which themselves are less oxidized, and that can be produced with a high yield ratio. A paste ...
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JP2023022054A |
To provide a conductive paste which is improved in adhesion to a supporting member and therefore capable of firmly bonding a semiconductor element with the supporting member.A conductive paste includes silver powder, a fatty acid and a d...
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JP2023019594A |
To provide a novel solventless two-liquid type conductive adhesive which has room temperature curability, excellent handling ability, excellent rapid curability, high bond strength, and excellent conductivity.Provided is a two-liquid typ...
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JP7219405B2 |
There is provided a conductive adhesive which can suppress erosion of polycarbonate and form a cured product exhibiting excellent conductivity at a low temperature. There is also provided a conductive adhesive which can form a cured prod...
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JP7216702B2 |
The present invention relates to a dispersion comprising i) particles A) of polymer comprising repeating units having the general structure -CH 2 -CHR 1 -COOR 2 - wherein R 1 represent H or an alkyl group...
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JP7214912B2 |
A hardener comprising a pyridinium salt, wherein the pyridinium salt has a benzyl group at the 1-position and has an electron-attracting group at the 2-position, the benzyl group having an electron-donating group; an adhesive composition...
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JP7212831B2 |
Disclosed is an electroconductive adhesive composition that is used for electrically connecting a circuit board and a semiconductor light-emitting element mounted on the circuit board, the electroconductive adhesive composition comprisin...
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JP7212591B2 |
Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an ...
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JP7212593B2 |
Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparti...
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JP7210845B2 |
This adhesive film housing set 1A is provided with an adhesive film 10 for circuit connections and a housing member 30A housing said adhesive film 10. The adhesive film 10 is provided with a first adhesive layer 12 and a second adhesive ...
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JP7210846B2 |
This adhesive film 1 for circuit connections is provided with a first adhesive layer 2 containing conductive particles 4, and a second adhesive layer 3 laminated on said first adhesive layer 2, wherein the ratio of the DSC calorific valu...
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JP2023007485A |
To provide a conductive paste which suppresses separation/precipitation of a component in a paste during storage, and bleed-out of a diluent when the paste is arranged, and is suitably usable as a die attach paste excellent in physical a...
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JP7198063B2 |
To provide a structure with an antistatic adhesive PEEK resin tape, capable of attaining excellent conductivity, rust resistance, solvent resistance, and chemical resistance.In a structure with an antistatic adhesive PEEK resin tape, an ...
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JP7196200B2 |
A conductive adhesive, a raw material composition, an electronic element, and a preparation method and application. The raw material composition comprises the following components: a polymer elastomer resin, conductive particles, and hot...
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JP2022185716A |
To provide an adhesive composition having a high adhesive strength and a long storage life.An adhesive composition contains a binder composition containing a cationic polymerizable component and a film-forming component, a cationic polym...
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JP2022185407A |
To provide a manufacturing method of a connection structure and a manufacturing method of an image display device which can sufficiently secure the conduction between electrodes opposite to each other when connecting circuit members to e...
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JP2022182451A |
To provide a composition for temporary fixation excellent in heat resistance, laser beam absorbency and adhesion.A composition for temporary fixation is to be used for forming a temporary fixation film that separates a temporarily fixed ...
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JP7180981B2 |
To provide conductive particles capable of effectively enhancing insulation reliability when electrically connecting between electrodes.Conductive particles relating to the present invention include: a conductive particle body with insul...
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JP2022173198A |
To provide a method for sorting a conductive particle having sufficiently high general applicability to a circuit electrode included in a circuit member to be connected.The present disclosure relates to a conductive particle sorting meth...
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JP7174910B2 |
Provided is a metal powder sintering paste having a high resistance to thermal stress. The present invention provides a metal powder sintering paste containing silver particles having a median diameter of 0.3 pm to 5 pm as a main compone...
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JP7172288B2 |
To provide a conductive hot-melt adhesive composition which can strongly bond adherends in a state of exhibiting high conductivity.A conductive hot-melt adhesive composition contains a thermoplastic resin and a conductive filler, and has...
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JP7173186B2 |
A method for manufacturing a shield tape having excellent following of an affixing part even when curling has occurred in a laminate comprising a metal foil and an insulating resin film, it being possible to prevent separation using this...
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JP7173258B2 |
This adhesive composition contains (a) a thermoplastic resin, (b) a silane compound having a urethane bond and an alkoxysilyl group in one molecule, (c) a radical-polymerizable compound, and (d) a radical-polymerization initiator, and, a...
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JP7172990B2 |
The present invention provides an adhesive composition containing: an anionic polymerizable or cationic polymerizable epoxy resin or oxetane resin; a first silane compound having a functional group that reacts with the epoxy resin or oxe...
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JP7173250B2 |
To provide an adhesive composition which is excellent in storage stability and can be cured at a relatively low temperature in a short time.The adhesive composition contains an onium salt represented by general formula (1) and a cationic...
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JP7168940B2 |
The present invention relates to a self-fusing type conductive connection material, a bonding module including the same and a manufacturing method thereof and, more specifically, to a self-fusing type conductive connection material for m...
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JP2022169994A |
To provide a thermally conductive sheet which has low thermal resistance and high reworkability.There is provided a thermally conductive sheet which has at least two thermal conductive layers containing an acrylic adhesive and a thermall...
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JP7168861B2 |
This granular adhesive comprises a core and a shell that covers the core. The core contains an adhesive composition; and the shell contains solid particles. The solid particles include particles (X) that have an aspect ratio of 1.3 or mo...
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JP2022544725A |
The present technology provides curable silicone-based compositions comprising hybrid silicone polymers, catalysts, and fillers. The present technology comprises polymer A comprising organic molecules or siloxane molecules containing alk...
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JP2022158554A |
To provide an adhesive film for circuit connection that has excellent adhesion to a plastic substrate before curing and also has excellent adhesion to the plastic substrate after curing.An adhesive film for circuit connection is provided...
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JP2022159276A |
To provide: a conductive film transfer sheet capable of easily transferring a conductive film with high conductivity, while receiving no limitation by a material or a shape of a base material being a transfer target body, and a manufactu...
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JP2022155932A |
To provide a conductive adhesive composition comprising a conductive powder and a curable component which can achieve good conductivity and good adhesiveness.There is provided a conductive adhesive composition which comprises (A) a condu...
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JP2022156407A |
To provide a thermosetting sheet capable of suppressing peeling from an adherend relatively well after heat curing and a dicing die bond film including the same.A dicing die bond film 20 includes a substrate layer 1, a dicing tape 10 wit...
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JP7152569B2 |
To provide an AG treated surface protective film for polarizers that has balanced adhesive force in low peeling rate and high peeling rate, has good adhesion to a polarizer despite although small adhesive force, and is excellent in durab...
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JP7149699B2 |
Provided is a thermally conductive PSA sheet that comprises a PSA layer comprising a thermally conductive filler. The PSA sheet has a thermal resistance less than 6.0 cm 2 ¢K/W, and also has an adhesive strength N1 at 30 minutes of st...
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JP7148949B2 |
To inhibit and suppress reduction of adhesive by a heat shrinkage of a thermosetting resin by heat curing.The thermosetting conductive adhesive has weight of conducive metal particles of 80 wt% to 95 wt% based on all weight, weight of th...
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JP7148799B2 |
In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25° C. and low temperature curability in an atmosphere at 60 to 140°...
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JP2022145338A |
To provide a transparent conductive joint structure having high transparency and conductivity.A transparent conductive joint structure includes a first transparent member 2 having a first connection electrode 2a, a second transparent mem...
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