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JP2010198991A |
To prevent stiction by adjusting the electrical resistivity of an insulating film without using an additional circuit.The method of manufacturing an electrostatically driven MEMS element includes: a step of using a conductive material to...
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JP4540443B2 |
An electrostatic micro relay, in which the contact gap between moving and fixed contacts may be increased and the reliability and high-performance regarding contacting and separating the moving contact with and from the fixed contact may...
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JP2010192443A |
To provide a micro Electro-mechanical systems (MEMS) thermal switch.The switch includes a FET having a source and drain in a substrate and a beam isolated from the substrate. The beam is positioned over the source and the drain and space...
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JP4528815B2 |
A semiconductor device controls an electrostatic actuator having first and second electrodes. A voltage generation unit generates different types of voltages applied to the first and second electrodes. A control unit controls voltages ge...
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JP4528771B2 |
A method of manufacturing a micromechanical element wherein the method comprises the steps of providing a layer of base material, applying at least one at least partly sacrificial layer of an etchable material, patterning the at least pa...
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JP4523969B2 |
According to one embodiment a microelectromechanical (MEMS) switch is disclosed. The MEMS switch includes a substrate, a bottom electrode mounted on the substrate, a top electrode mounted on the bottom electrode, an actuation electrode m...
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JP4519921B2 |
A microsystem, including a magnetic microactuator, with a mobile element supported by a substrate and controlled by magnetic effect between a first position and a second position for switching at least one electric circuit. A permanent m...
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JP4516960B2 |
A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated into a CMOS semiconductor fabrication li...
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JP4512304B2 |
A MEM relay includes an actuator, a shorting bar disposed on the actuator, a contact substrate, and a plurality of liquid metal contacts are disposed on the contact substrate such that the plurality of liquid metal contacts are placed in...
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JP4506529B2 |
An electrostatic micro switch (1,42, 52, 62a, 62b) comprises a fixed electrode (12) which is provided in a fixed substrate (10); a movable substrate (20) which includes a movable electrode (23), the movable electrode (23) being arranged ...
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JP4505683B2 |
Carbon Nanotube Films, Layers, Fabrics, Ribbons, Elements and Articles are disclosed. To make various articles, certain embodiments provide a substrate. Preformed nanotubes are applied to a surface of the substrate to create a non-woven ...
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JP4500201B2 |
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JP2010147026A |
To provide a micro-electromechanical system switch. The switch includes a substrate with a support surface. An electrical contact surface having a driving surface with a cut-out and an extending portion is provided. The extending portion...
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JP4494130B2 |
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JP4489651B2 |
It is an objective to achieve a MEMS switch which can be mounted with a CMOS circuit and has a contact point with high reliability, both mechanically and electrically. An insulator having a compatibility with a CMOS process is formed at ...
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JP2010135634A |
To provide a method for manufacturing a semiconductor device having movable portions with high reliability, and the semiconductor device. Upper driving electrodes 23 connected to supports 21 and an upper capacitance electrode 25 are exte...
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JP4481309B2 |
A deformable suspension bridge is attached to a substrate by two legs arranged in such a manner as to transversally subdivide the bridge into a medial segment arranged between the legs and into two outwardly projecting peripheral segment...
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JP2010129371A |
To provide a low-power consumption switch and ESD protection element.The switch includes: a first and a second electrodes 11 and 12 provided on a substrate 10; an anchor 14 provided on the first electrode 11; a movable structure 15 suppo...
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JP2010123353A |
To provide a MEMS (micro electro mechanical system) switch capable of preventing an actuation failure based on a so-called sticking phenomenon.The MEMS switch includes: at least two sets of parallel movable electrodes constituted with a ...
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JP4470606B2 |
The present invention provides a high frequency device in which stabilization of a DC bias voltage applied to an electrostatic drive type vibrator is attempted and a power supply device which can supply a stable DC bias voltage. Also, th...
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JP4465219B2 |
A MEMS (Micro Electro Mechanical System) electrostatic device operated with lower and more predictable operating voltages is provided. An electrostatic actuator, an electrostatic attenuator of electromagnetic radiation, and a method for ...
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JP4464607B2 |
A microelectromechanical system (NEMS) analog isolator may be created in which an actuator such as an electrostatic motor drives a beam against an opposing force set, for example, by another electrostatic motor. Motion of the beam may be...
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JP4464397B2 |
A bistable MEMS microswitch produced on a substrate and capable of electrically connecting ends of at least two conductive tracks, including a beam suspended above the surface of the substrate. The beam is embedded at its two ends and is...
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JP2010097833A |
To improve a geometrical shape of a via and a bus for an array of a microelectromechanical device.A circuit configuration for the microelectromechanical device contains a via 44A, acting as an electrical connection that penetrates a subs...
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JP4445399B2 |
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JP4447940B2 |
A method is provided for making a micro-switching element. The switching element includes a substrate, two supporting members fixed to the substrate, and a movable beam bridging between the supporting members. The beam includes a membran...
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JP4443438B2 |
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JP2010067587A |
To suppress signal decay, and to improve productivity.A variable capacitive element 1 is formed by using a silicon substrate 4 sandwiched by first and second substrates 2, 3. A support part 5, a movable part 6, a support beam 7, and an i...
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JP4434592B2 |
To provide a thin device equipped with a semiconductor element and a micro machine. A board 20 where the micro machine (MEMS:micro electromechanical system) 1 is formed, and a semiconductor layer 3 where the semiconductor element is prov...
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JP4431030B2 |
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JP2010044420A |
To provide a suitable backplane for an electro-optic display.The backplane for the electro-optic display includes a pixel electrode (104), a voltage supply line (C) arranged to supply a voltage to the pixel electrode (104), and a microme...
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JP2010044964A |
To reduce a parasitic capacitance between a wiring layer and a semiconductor board without forming a hollow structure in a wiring region outside a protection cap.A thick insulation layer 17a arranged between signal lines 15a, 15b and a t...
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JP4418465B2 |
A multi-stable electromechanical switch having an open state and a closed state, the electromechanical switch comprising: a moveable member, at least one pair of receiving terminals biased to a bias position corresponding to the open sta...
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JP4417861B2 |
A microswitching element includes a base substrate, a fixing portion attached to the base substrate, and a movable portion including a fixed end fixed to the fixing portion. The movable portion is surrounded by the fixing portion via a s...
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JP2010034048A |
To provide an MEMS and an MEMS array capable of functioning under severe environments, reliable, and high in cost effectiveness, wherein the MEMS array is manufacturable using technology conforming to existing integrated circuit manufact...
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JP4414263B2 |
A micro-switching device includes a base substrate and a cantilever fixed to the base substrate via a spacer or anchor portion. The cantilever has an inner surface facing the substrate and an outer surface opposite to the inner surface. ...
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JP2010503179A |
An apparatus includes a mechanical switch. The mechanical switch includes a bilayer with first and second stable curved states. A transformation of the bilayer from the first state to the second state closes the switch.
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JP4405427B2 |
There is disclosed a switching element including a first input/output electrode, a movable portion which repeats contact/non-contact with respect to the first input/output electrode, a second input/output electrode connected with the mov...
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JP2010500711A |
The proposed invention application describes a novel configuration of an extremely small self-locking switching component, based on micro-electromechanical systems (MEMS) technology. Conventional MEMS switches need a continual control si...
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JP2009285797A |
To provide a micro electric machine system (MEMS) apparatus enhancing a capacitance ratio or insulation characteristics, and also enhancing an accuracy of an airtightness test, by reducing a parasitic capacitance of wiring.The micro elec...
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JP4377740B2 |
A piezoelectric-driven MEMS device can be fabricated reliably and consistently. The piezoelectric-driven MEMS device includes: a movable flat beam having a piezoelectric film disposed above a substrate with a recessed portion such that t...
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JP4377828B2 |
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JP2009277617A |
To reduce loss in a wiring structure of a fine electronic mechanical switch, and prevent the increase of loss and generation of action failure at a contact electrode.A wiring support part 107 and a wiring 108 supported by the wiring supp...
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JP4369974B2 |
Embodiments of the invention describe a contact switch, which may include a bottom electrode structure including a bottom actuation electrode and a top electrode structure including a top actuation electrode and one or more stoppers able...
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JP4372689B2 |
A conductor (7) which is provided between two zones is capable of moving freely through the intermediate space (25) based on the voltage applied between the capacitive plates (3,9). The conductor closes the electric circuit by butting ag...
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JP4366310B2 |
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JP4364565B2 |
The present switch including the present actuator has a supporting column on a substrate, and a cap plate provided on the supporting column. The supporting column pivotally supports the cap plate. At ends of the cap plate, a plurality of...
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JP4359920B2 |
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JP4359923B2 |
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JP4363438B2 |
Micro-electromechanical switch comprising a layered structure, comprising an actuator electrode (11) corresponding to a first conductive layer, at least one contact electrode (21, 22) corresponding to a second conductive layer, and a dis...
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