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WO/2023/204199A1 |
This electronic component, terminal structure for an electronic component, and electronic device prevent the occurrence of environmental impact by not using solder, reduce assembly costs, and make it possible to lighten the load on an el...
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WO/2023/204914A1 |
A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.
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WO/2023/201827A1 |
A display device (10), comprising a middle frame assembly (100), a sliding assembly (200), elastic members (300) and a display screen (500), wherein the middle frame assembly (100) comprises at least two rotatably connected middle frame ...
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WO/2023/204798A1 |
Examples of heat exchanger are described herein. In some examples, a heat exchanger may include a flow channel. In some examples, the heat exchanger may include a lattice structure disposed in the flow channel. In some examples, the heat...
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WO/2023/203800A1 |
An electronic device (1) comprises a housing(2), a fan (3) that is accommodated in the housing, a heat-generating component that is accommodated in the housing, and a heat transfer member (5) that is in thermal contact with the heat-gene...
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WO/2023/202867A1 |
The invention relates to a method for producing an inverter (1), wherein at least one filter assembly (10) and one assembly for intermediate circuit capacitors (11) are installed in an inverter housing (2) on busbars, wherein the individ...
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WO/2023/199481A1 |
This control apparatus (1000) comprises a main circuit board (40), a first heating element (40a), a second heating element (40b), a structure (ST), a first heat dissipation sheet (41), and a second heat dissipation sheet (23). The first ...
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WO/2023/199262A1 |
An EMI filtering circuit (1) for battery chargers of EV or HEV comprising: a plurality of filters (2a, 2b) for electromagnetic disturbances connected in cascade to each other and provided with at least one coil (2a) comprising one ferrom...
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WO/2023/200152A1 |
Disclosed is an automotive converter capable of efficiently absorbing heat from heating elements by maintaining a minimum distance therefrom. An automotive converter for converting a voltage, according to an aspect, comprises: a housing;...
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WO/2023/199194A1 |
Active two-phase cooling systems incorporate a cooling medium that changes phase as it absorbs heat dissipated by a heat source and a pump or a compressor that urges the cooling medium through a cooling loop. Operation of some heat sourc...
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WO/2023/199607A1 |
Provided is an electronic device that increases the degree of freedom in layout for electronic components on a circuit board and is capable of suppressing noise leakage. A heat pipe (50, 150) passes through an opening (32, 132) formed in...
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WO/2023/197304A1 |
A box structure (101), comprising: a base (12), a cross beam (11) arranged opposite to the base (12), and two oppositely arranged side plates (13), wherein two ends of one side plate (13) are respectively connected to one end of the base...
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WO/2023/197733A1 |
Disclosed in the embodiments of the present application is an electronic product. A temperature control apparatus is provided on a heating element of the electronic product, the temperature control apparatus is filled with a heat transfe...
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WO/2023/198371A1 |
The invention relates to a module comprising a thermal regulation device for thermally regulating computer hardware having a temperature that needs to be regulated, which module is characterised in that the thermal regulation device comp...
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WO/2023/199796A1 |
Provided is an electronic device that enables a reduction in dust or the like that adheres to a ventilation region of a heat-generating component or a heat-dissipating component. An electronic device (10) has: a power supply unit (40); a...
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WO/2023/198236A1 |
The invention relates to a heat sink for at least one microchip, comprising a thermally conductive heat sink which has a channel structure for a cooling fluid, which channel structure has a supply and a return, characterised in that the ...
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WO/2023/199608A1 |
Provided is an electronic apparatus that can suppress leakage of noise from an opening of a circuit board shield. An IC chip (24c) is disposed in an opening (41) of a circuit board shield (40), and a plurality of fixing portions (122) fo...
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WO/2023/197380A1 |
A composite functional film (10), a manufacturing method therefor, and a display device. The composite functional film (10) comprises: a heat dissipation layer (11), comprising a first portion (111) and a second portion (112), the second...
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WO/2023/197578A1 |
Disclosed in the present application are a two-phase radiating fin and a heat sink. The two-phase radiating fin comprises a radiating toothed flat plate (100), a circumferential loop channel (110) and a flow dividing channel (120), where...
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WO/2023/199388A1 |
Provided is an electronic device that minimizes the adhesion of dust and substances within air to a component mounted on a circuit board of a cooling fan. A cooling fan (50) has a circuit board (55) arranged along the axis (C1) of a moto...
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WO/2023/199894A1 |
A cooler has a coolant path. This cooler comprises: a cooling plate part having a plurality of partition walls which extend in the longitudinal direction thereof and partition a coolant path in a width direction perpendicular to the long...
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WO/2023/197852A1 |
Embodiments of the present application provide a computing node, a server system, and a data center. The server system comprises a cooling medium distribution device, a first pipeline, a second pipeline, at least one spray nozzle, and at...
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WO/2023/194012A1 |
The present invention relates to a bus bar (100), the bus bar (100) forming a receptacle (102) for a cooling cell (104) and the cooling cell (104) being arranged in the receptacle (102), the receptacle (102) being designed to thermally c...
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WO/2023/194010A1 |
The invention relates to a bus bar (100), wherein the bus bar (100) forms a recess (102) for a cooling cell (104) and the cooling cell (104) is arranged in the recess (102), wherein the recess (102) is designed to thermally couple the co...
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WO/2023/193302A1 |
Provided in the present application is a loudspeaker module, comprising a housing, a single loudspeaker mounted in an accommodation chamber of the housing, and a heat dissipation support. The heat dissipation support comprises a body par...
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WO/2023/194000A1 |
The invention relates to a stationary inductive charging device (1), comprising a coil (2) for generating an alternating electromagnetic field, power electronics (3) for supplying power to the coil (2) and for energising the coil (2), an...
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WO/2023/194155A1 |
The present invention relates to an induction charging unit (1) for an energy transmission system, comprising a cooling device (3) which defines a component-mounting area (2) and is designed for dissipating thermal energy, comprising at ...
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WO/2023/193847A1 |
Retrofittable multifunctional display module designed to be retrofitted in doors, walls or cabinets, and the method for controlling the temperature thereof, characterized in that the temperature sensors (7) are used to sense the internal...
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WO/2023/194322A1 |
The invention relates to a method for operating a high-power component, in particular a power supply 100, capable of providing a power greater than 500 W, the method having the following steps: determining the amount of heat generated by...
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WO/2023/194004A1 |
The present invention relates to a stationary inductive charging device (1), - having a coil (2) and a power electronics (3) for energy supply and for driving the coil (2), - having a refrigerant plate (4) which is connected at its plate...
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WO/2023/193852A1 |
The invention relates to an electronics assembly having a printed circuit board (1) with at least one electronics component (3) in a housing having at least one metal, thin-walled housing wall (2), heat dissipation means for the electron...
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WO/2023/196520A1 |
A system includes an electric generator, a power electronics system, a first heat exchanger, and a second heat exchanger. The electric generator includes a turbine wheel, a rotor, and a stator. The turbine wheel is configured to receive ...
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WO/2023/195062A1 |
A bushing part according to the present disclosure comprises an elastic bushing, and a holder. The holder has a quadrangular frame-shaped holder body portion, a flange portion hooked to a peripheral edge of a through-hole from a first si...
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WO/2023/194611A1 |
The present invention concerns a modular information system, comprising at least one base unit and a set of extension units, wherein each of said base unit and extension units comprises a housing with an essentially beam-like shape with ...
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WO/2023/193305A1 |
Provided in the present application is a loudspeaker module, which comprises: a housing; a loudspeaker unit, which is mounted in an accommodating cavity of the housing; a heat dissipation support; and a heat dissipation tube, which is mo...
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WO/2023/192141A1 |
Various aspects include devices, systems, and methods for cooling electronic equipment immersed in an immersion coolant tank with a fluid delivery wand. The fluid delivery wand may include a coolant conduit and an aperture cover. The coo...
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WO/2023/190726A1 |
Provided is a heat-conducting sheet having a reduced contact thermal resistance. This heat-conducting sheet 1 comprises a cured product of a heat-conducting composition containing a binder resin 2, a fibrous filler 3, and a heat-conduc...
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WO/2023/190289A1 |
This in-vehicle device comprises a first electronic device and a second electronic device electrically connected to the first electronic device, wherein the first electronic device and the second electronic device are in a positional rel...
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WO/2023/185400A1 |
Provided in the present application are a mounting assembly used for a guide rail, and an electrical product. The mounting assembly comprises: fixed members, sliding blocks, elastic members and limiting portions. When the elastic members...
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WO/2023/191231A1 |
The present invention relates to a heat dissipation sheet having high thermal conductivity and high tensile strength, and a production method for same, and more specifically relates to a heat dissipation sheet having high thermal conduct...
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WO/2023/185384A1 |
A single-phase immersion liquid cooling system, a liquid cooling method, and a storage medium. The liquid cooling system comprises: a liquid supply main pipe and a liquid return main pipe; at least one liquid cooling cabinet each compris...
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WO/2023/185838A1 |
Disclosed in the present application is an electronic device, comprising a first support part, a second support part, and a guide structure, the guide structure being respectively connected to the first support part and the second suppor...
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WO/2023/185576A1 |
Disclosed in the present invention is an electrical cabinet, comprising a first cabinet and a second cabinet. The first cabinet comprises a first air conditioner, and the first air conditioner is used for performing temperature regulatio...
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WO/2023/190755A1 |
This cooling structure comprises an outer wrapping material provided with an inflow port and an outflow port for a refrigerant, and an inner core material disposed inside the outer wrapping material, wherein: the inner core material has ...
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WO/2023/188289A1 |
The present invention comprises: a circuit board (7); a housing (2) which accommodates the circuit board (7); a plurality of heat-dissipating fans (21a) which are provided on the housing (2); an air duct (4) which is attached to the hous...
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WO/2023/190586A1 |
A thermally-conductive sheet including a binder and a thermally-conductive filler dispersed in the binder, and being sandwiched and used between a heat-generating body and a heat-radiating body, wherein the reflectance of the surfaces of...
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WO/2023/189739A1 |
[Problem] To provide: an information processing device having a heat dissipation structure which exhibits high heat dissipation capability and which is suited for miniaturizing the information processing device; and a circuit module. [So...
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WO/2023/184019A1 |
A radio frequency device, for example, a VHF (very-high-frequency) or UHF (ultra-high- frequency) filter, combiner or a microwave band device filter, having a temperature compensation structure, used for telecommunication applications, i...
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WO/2023/188501A1 |
The present disclosure provides a cooling device that cools a plurality of semiconductor components that are mounted on a surface of a substrate and are arrayed in a first direction, the cooling device comprising: a base attached to the ...
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WO/2023/190756A1 |
Provided is a thermally conductive sheet in which a total thermal resistance value is reduced. A thermally conductive sheet 1 is formed from a cured product of a thermally conductive composition including an anisotropic heat conducting...
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