Title:
DRYING TREATMENT METHOD, AND DRYING TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2005090860
Kind Code:
A
Abstract:
To provide a drying treatment method, and a drying treatment device suppressing damage of a semiconductor wafer due to heat, and quickly obtaining a favorable dried surface.
In the drying treatment method for drying the semiconductor wafer by irradiating with an electromagnetic wave the semiconductor wafer which has been subjected for cleaning treatment, after mixing water contents adhered to a surface of the semiconductor wafer with IPA in an atmosphere filled with inert gas, the semiconductor is irradiated with the electromagnetic wave of the wafer while blowing the inert gas onto the surface of the semiconductor wafer, and turning the semiconductor wafer.
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Inventors:
MAKI ISAO
Application Number:
JP2003324566A
Publication Date:
April 07, 2005
Filing Date:
September 17, 2003
Export Citation:
Assignee:
SONY CORP
International Classes:
F26B3/347; F26B5/08; F26B11/18; F26B21/14; H01L21/304; (IPC1-7): F26B3/347; F26B5/08; F26B11/18; F26B21/14; H01L21/304
Attorney, Agent or Firm:
Ariyoshi Noriharu
Shuichiro Ariyoshi
Shuichiro Ariyoshi