Title:
半導体反応器用の排気調整システム
Document Type and Number:
Japanese Patent JP2007522649
Kind Code:
A
Abstract:
The invention relates generally to an exhaust system and, in particular, to an exhaust conditioning system including overpressure and/or backflow protection and a combined trap/muffler for semiconductor etch and deposition processes. Advantages include automatic continuous operation, substantially zero lost wafers from unscheduled vacuum pump shut down, reduced particulate defects and improved yield.
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Inventors:
Schumaker, John Sea.
Application Number:
JP2006547376A
Publication Date:
August 09, 2007
Filing Date:
December 23, 2004
Export Citation:
Assignee:
Schumaker, John Sea.
International Classes:
H01L21/3065; B01D39/10; B01D46/44; C23C16/44; H01L21/205; H01L21/306
Attorney, Agent or Firm:
Katsuhiro Ito
Akiko Ono
Akiko Ono