Title:
【発明の名称】大径シリコン単結晶インゴット用スライス切断刃
Document Type and Number:
Japanese Patent JPH07300
Kind Code:
B2
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Inventors:
Masaki Morikawa
Shiro Kuromitsu
Tadaharu Tanaka
Shiro Kuromitsu
Tadaharu Tanaka
Application Number:
JP20512585A
Publication Date:
January 11, 1995
Filing Date:
September 17, 1985
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO.,LTD.
International Classes:
B28D5/04; B24B27/06; B28D1/22; C22C1/10; C22C19/00; C22C26/00; C22C29/06; C22C29/08; C22C29/10; C22C29/12; C22C29/16; C22C32/00; C22C38/00; C22C45/02; C22C45/04; H01L21/304; (IPC1-7): B28D1/22
Domestic Patent References:
| JP59158216A | ||||
| JP6017028A |
Attorney, Agent or Firm:
Kazuo Tomita
Next Patent: BUFFER DEVICE FOR AUTOMATICALLY CLEANED BATHTUB