PACKAGING RESIN, ELECTRONIC PART AND LASER-MARKING OF ELECTRONIC PART

Title:

PACKAGING RESIN, ELECTRONIC PART AND LASER-MARKING OF ELECTRONIC PART

Document Type and Number:

Japanese Patent JPH02107670

Kind Code:

A

Abstract:

PURPOSE:To obtain a packaging resin for electronic element and capable of developing clear white pattern by the laser marking of the package with laser beam by adding aluminum hydroxide powder to a liquid resin. CONSTITUTION:The objective packaging resin is produced by adding 5-10wt.% of aluminum hydroxide powder to 100wt.% of a liquid resin (e.g. acrylic resin) and stirring the mixture. An electronic element is coated with the obtained packaging resin e.g. by dipping and the package is masked with a patterned template and irradiated with laser beam. The dehydrative decomposition reaction of the aluminum hydroxide takes place by the heat of the laser beam to deposit Al2O3 particles on the patterned part. Accordingly, the patterned part is finely roughened to increase the irregular reflectivity of the part and obtain an electronic part having clear printed pattern.

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Inventors:

OSHIRO MUNEYUKI

Application Number:

JP26093288A

Publication Date:

April 19, 1990

Filing Date:

October 17, 1988

Export Citation:

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Assignee:

MURATA MANUFACTURING CO

International Classes:

B41F17/36; C08K3/22; C08L101/00; C09D201/00; H01C1/04; H01C7/04; H01C7/10; H01C17/02; H01G2/24; H01G4/12; H01G13/00; H01L23/00; (IPC1-7): B41F17/36; C08K3/22; C08L101/00; C09D201/00; H01C1/04; H01C7/04; H01C7/10; H01C17/02; H01G1/04; H01G4/12; H01G13/00; H01L23/00

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