Title:
POLISHING SYSTEM
Document Type and Number:
Japanese Patent JP2021070080
Kind Code:
A
Abstract:
To extend lives of mechanisms such as a high pressure pump and a pressure control valve, and a seal resin rubber of a piping system.SOLUTION: A polishing system 1 polishes workpiece made of super alloy with an outer peripheral surface 2a (polishing surface) of a rotary grindstone 2 while rotating the rotary grindstone 2 of a polishing machine 3. The polishing system 1 includes cleaning liquid spray means 4 for spraying a cleaning liquid to the outer peripheral surface 2a through a nozzle 4a from a direction orthogonal to the outer peripheral surface 2a with a high pressure, and washing away polishing powder during polishing. The cleaning liquid sprayed through the nozzle 4a is only a new cleaning liquid that is not used, and is stored in a clean tank 11.SELECTED DRAWING: Figure 1
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Inventors:
MORIAI CHIKARA
Application Number:
JP2019197228A
Publication Date:
May 06, 2021
Filing Date:
October 30, 2019
Export Citation:
Assignee:
TOKUPI SEISAKUSHO KK
International Classes:
B24B53/007; B24B55/02; B24B55/03; B24D3/00; B24D5/00
Domestic Patent References:
| JP3158872U | 2010-04-22 | |||
| JP2005262426A | 2005-09-29 | |||
| JPH1190767A | 1999-04-06 | |||
| JP2017144517A | 2017-08-24 | |||
| JP2004096023A | 2004-03-25 | |||
| JP2009279710A | 2009-12-03 |
Foreign References:
| WO2019131846A1 | 2019-07-04 | |||
| US3321871A | 1967-05-30 |
Attorney, Agent or Firm:
Minoru Torinosu
Shinichi Nakajima
Torisu Keita
Shinichi Nakajima
Torisu Keita