SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

Title:

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

Document Type and Number:

Japanese Patent JP2021126739

Kind Code:

A

Abstract:

To perform chamfering of a polishing pad using a dresser that can be manufactured easily.SOLUTION: A substrate processing method includes: a carrying step S100 of carrying a polishing pad having a polishing surface for polishing a substrate; a dress step S110 of toothing the polishing pad carried in the carrying step S100, using a dresser having a dress surface; and a polishing step S118 of polishing the substrate using the polishing pad toothed in the dress step S110. The carrying step S100 includes a first carrying step S102 of carrying the polishing pad to a first position at which a chamfering part formed at a peripheral edge part of the dress surface contacts a peripheral edge part of the polishing surface of the polishing pad, without making the dress surface oppose to the polishing surface. The dress step S110 includes a first dress step S112 of moving the polishing pad and the dresser relatively in a state where the polishing pad is carried to the first position in the first carrying step S102.SELECTED DRAWING: Figure 8

More Like This: