Title:
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC PARTS USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2006/025139
Kind Code:
A1
Abstract:
A circuit board capable of being thinned and reduced in its manufacturing cost, a method for manufacturing the circuit board, and electronic parts using the circuit board and capable of improving gastightness. The circuit board (1) comprises an insulating substrate (10), a through hole (11) formed in the thickness direction of the insulating substrate (10) for connecting the first principal plane (10a) of the insulating substrate (10) and the second principal plane (10b) of the insulating substrate (10), a conductive film (12) formed on the inner wall of the through hole (11) and around the opening of the through hole (11) on the first and second principal planes (10a and 10b); and a metallic member (14) fitted in the through hole (11) and jointed to the conductive film (12).
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Inventors:
KIMURA MITSUYUKI
Application Number:
PCT/JP2005/010047
Publication Date:
March 09, 2006
Filing Date:
June 01, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
KIMURA MITSUYUKI
KIMURA MITSUYUKI
International Classes:
H05K1/11; H01L23/12; H03H9/02; H03H9/10; H05K3/40; H05K3/42; (IPC1-7): H05K1/11; H01L23/12; H03H9/02; H03H9/10; H05K3/40; H05K3/42
Foreign References:
| JP2003115658A | 2003-04-18 | |||
| JP2002270718A | 2002-09-20 | |||
| JP2001308481A | 2001-11-02 | |||
| JP2000031613A | 2000-01-28 | |||
| JP2003101181A | 2003-04-04 |
Attorney, Agent or Firm:
IKEUCHI SATO & PARTNER PATENT ATTORNEYS (OAP TOWER, 8-30, Tenmabashi 1-chome,, Kita-ku, Osaka-sh, Osaka, JP)
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