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Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/181590
Kind Code:
A1
Abstract:
This high-frequency module (1) is provided with: a mounting board (30) having main surfaces (30a and 30b) which face each other; a PA (11) which is mounted on the main surface (30a) and which is a high-frequency component and has an emitter terminal; a through-electrode (51) which is connected to the emitter terminal of the PA (11) and passes through the main surface (30a) and the main surface (30b) of the mounting board (30); and ground terminals (411 and 412) connected to the through-electrode (51).

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Inventors:
MATSUMOTO SHO (JP)
Application Number:
PCT/JP2019/009579
Publication Date:
September 26, 2019
Filing Date:
March 11, 2019
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01L25/00; H01L25/065; H01L25/07; H01L25/18; H04B1/38
Domestic Patent References:
WO2018043162A12018-03-08
Foreign References:
JP2015146333A2015-08-13
JP2004327604A2004-11-18
JP2005150443A2005-06-09
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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