Title:
MEMBER FOR SEMICONDUCTOR CLEANING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/079724
Kind Code:
A1
Abstract:
Provided is a member for a semiconductor cleaning apparatus, the member being less likely to be thermally deformed and cause metal to be eluted therefrom. The member for a semiconductor cleaning apparatus includes a prepreg in which a carbon fiber and a tetrafluoroethylene/perfluoro (alkyl vinyl ether) copolymer are thermally fused.
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Inventors:
MURAKAMI SHINJI (JP)
YUKAWA HIROKAZU (JP)
HAGI KEISUKE (JP)
MASUI TOSHIAKI (JP)
YUKAWA HIROKAZU (JP)
HAGI KEISUKE (JP)
MASUI TOSHIAKI (JP)
Application Number:
PCT/JP2020/037733
Publication Date:
April 29, 2021
Filing Date:
October 05, 2020
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
H01L21/304; B29C70/06
Domestic Patent References:
| WO2019155975A1 | 2019-08-15 | |||
| WO2007020910A1 | 2007-02-22 |
Foreign References:
| JP2010260922A | 2010-11-18 | |||
| JP2019151111A | 2019-09-12 | |||
| JP2012532217A | 2012-12-13 | |||
| JP2014113713A | 2014-06-26 | |||
| JP2001358109A | 2001-12-26 | |||
| JP3064019B2 | 2000-07-12 | |||
| JP3146200B2 | 2001-03-12 | |||
| JP2016027956A | 2016-02-25 | |||
| JP2017031342A | 2017-02-09 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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