METHOD FOR MANUFACTURING LAMINATED PLATE

WIPO Patent Application WO/2012/176424

A1

The following two steps are carried out continuously: a lamination step for obtaining a laminate by depositing, under heat and pressure, a build-up material (200) formed from a resin composition including thermosetting resin (201), onto a circuit-forming surface (103) of a core layer (102) comprising the circuit-forming surface (103) on one side or both sides; and a planarizing step for planarizing the surface of the deposited build-up material (200), after which a curing step is carried out in which the laminate is heated to further cure the thermosetting resin (201). In this case, the minimum complex dynamic viscosity value (η1) at a measurement range of 50 to 200°C, a temperature increase rate of 3°C/min., and a frequency of 62.83 rad/sec is adjusted to between 50 Pa∙s and 500 Pa∙s according to a dynamic viscoelasticity test on the build-up material (200) at the stage when the lamination step is completed.

JP2003309375	MULTILAYER CIRCUIT BOARD
JP3431247	DEPOSITION OF THIN FILM AND PRODUCTION OF THIN FILM MULTILAYER SUBSTRATE
JPS6185889	THICK SUBSTRATE

OHIGASHI NORIYUKI (JP)
MURAKAMI HARUO (JP)
ENDO TADASUKE (JP)
KIMURA MICHIO (JP)

PCT/JP2012/003964

December 27, 2012

June 18, 2012

Click for automatic bibliography generation  

SUMITOMO BAKELITE CO (JP)
OHIGASHI NORIYUKI (JP)
MURAKAMI HARUO (JP)
ENDO TADASUKE (JP)
KIMURA MICHIO (JP)

H05K3/46; B32B15/08

WO2009119621A1	2009-10-01
WO2003099952A1	2003-12-04

JP2008198774A	2008-08-28
JP2005251895A	2005-09-15
JP2006179888A	2006-07-06
JP2005240019A	2005-09-08

HAYAMI, SHINJI (JP)
Shinji Hayami (JP)

View/Download PDF      PDF Help

Previous Patent: LAMINATED PLATE MANUFACTURING METHOD

Next Patent: MANUFACTURING METHOD FOR BUFFER LAYER OF PHOTOELECTRIC CONVERSION ELEMENT, AND MANUFACTURING METHOD ...