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JP7206727B2 |
To provide a tension adjustment device which has durability so that rotation moment is not generated at a support part even when receiving reaction force and is small in the number of part items, low in a cost, and easy in assembling to ...
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JP7208036B2 |
To provide an alignment method of a wafer, capable of performing an accurate θ matching for the wafer in which a key pattern is exposed only at an outer periphery.An alignment method of a wafer, comprises: a rough alignment step of dete...
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JP2022190380A |
To provide a processing device which can easily create a map of a wafer.Control means 14 of a processing device comprises: an X-axis direction positioning part 22 which positions a straight line region corresponding to a first division s...
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JP7195834B2 |
To simplify a mechanism which controls horizontal bridge balance and also to contribute to acceleration of precise fast machining by a machine tool such as a jig grinder by electrically detecting a main shaft position and balancing a hor...
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JP2022172752A |
To provide a grinding device which can grind a workpiece at a proper processing feed speed.A grinding device grinds a workpiece and includes: a chuck table having a holding surface which holds the workpiece; a grinding unit which has a s...
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JP7168831B2 |
The invention relates to a grinding and/or erosion machine (10), as well as to a method for gauging and referencing the axis arrangement (11) comprising several machine axes (12), wherein each can be configured as a rotational or transla...
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JP7165041B2 |
To improve processing accuracy of a ground surface of a workpiece.A position adjustment mechanism (40) adjusts a grinding position, which is a position of a grinding tool (31) with respect to a position of a workpiece (W) in a grinding f...
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JP7162986B2 |
To make it possible to derive a speed at a time of measurement that shortens a time required to measure a height of an object to be measured.A measuring device includes: a chuck table; a measuring unit for measuring a height of an object...
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JP2022164493A |
To provide a polishing device which has a highly rigid workpiece holding mechanism, which achieves small inclination of a workpiece, and may polish the plate-like workpiece precisely.A polishing device pushes a plate-like workpiece W hor...
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JP2022162416A |
To explain a surface treatment device capable of locally polishing a surface of an object.A surface treatment device 1A for polishing an inner surface Wa of a non-magnetic or a feebly magnetic object W is provided, comprising: a magnetic...
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JP7157511B2 |
To provide a cutting device capable of accurately recognizing cutting edge projecting quantity of a cutting blade.A cutting device includes: a cutting blade (31) which is mounted at a tip of a spindle (32) through a mounting tool (33); a...
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JP2022158457A |
To determine whether a grinding stone tool and a processing condition are suitable for processing an object to be processed on the basis of processing information.A determination method for determining the suitability of a grinding stone...
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JP2022153745A |
To provide a spindle rotation speed measurement method using a cutting device that can measure a rotation speed of a spindle without using a dedicated measuring instrument.A spindle rotation speed measurement method measures a rotation s...
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JP2022152993A |
To shorten a period required for alignment operation.A processing device comprises: cutting tables 2A, 2B which hold a sealed substrate W on which an alignment mark AM is provided, and which can rotate; a cutting mechanism 4 for cutting ...
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JP7149873B2 |
A power tool includes a brush holder with a brush positioned more accurately with respect to a commutator. A grinder as a power tool includes a housing, a stator fixed to the housing, a rotor rotatable relative to the stator and includin...
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JP7148361B2 |
To automatically set processing conditions which can be continuously processed in consideration of a maintenance timing of a tool.A processing device includes: a tool which processes a workpiece in a state of being brought into contact w...
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JP2022146881A |
To provide a workpiece polishing device capable of controlling a shape of a suspending member that suspends a carrier holding and pressing a workpiece at a polishing head, and also capable of forming a polishing shape of the workpiece to...
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JP7145029B2 |
The present invention relates to a semiconductor material sawing apparatus for sawing a semiconductor strip into individual semiconductor packages, and, more particularly, to a semiconductor material sawing apparatus that improves the ac...
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JP2022141482A |
To provide a surface grinding device which has high measurement accuracy of a workpiece surface by a detection sensor and can highly accurately grind a workpiece.A surface grinding device comprises: a grinding wheel 2 which grinds a work...
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JP7143025B2 |
To provide a technology capable of setting properly a reciprocation range of a grindstone, when performing a chopping operation in a grinding device.In a grinding device, a relation between chopping speed and overshooting is checked befo...
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JP7142123B1 |
A belt processing apparatus is provided that can efficiently obtain a good processed surface simply by simply setting a normal processing belt without adding a complicated structure. In a belt processing device (10) for processing a work...
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JP7137916B2 |
To provide an internal grinding device that is capable of grinding holes at both ends of a workpiece simultaneously and easily secures dimensional tolerance and geometric tolerance with high precision.An internal grinding device 1 for gr...
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JP7135288B2 |
The invention provides a grinding machine. A control device (31) for a grinding machine (1) is provided with an input device (32) for inputting a correction amount (B3) for correcting the bending of aworkpiece (W) before grinding and an ...
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JP7135289B2 |
To provide a grinding machine and a grinding method which can improve grinding processing accuracy.A control device 31 of a grinding machine 1 determines an eccentricity amount d of a shaft line of a work-piece W to be grinding-processed...
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JP7136953B2 |
[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding st...
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JP7133434B2 |
To provide a belt transmission device and a grinder that can restrain an increase in size of the device.A belt transmission device 2 according to an embodiment comprises a first rotating body 10, a driving source 20 for rotating the firs...
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JP2022131312A |
To provide a tailstock device enabling pressing force for pressing a workpiece to a headstock to be adjusted in a wide range.A tailstock device 100 that supports one end, in a rotary shaft direction, of a workpiece 9 to be worked while r...
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JP7129904B2 |
To provide an electrode terminal insertion jig capable of easily inserting an electrode terminal in an insertion port.An electrode terminal insertion jig 100 is formed on a bottom portion 23C1 of a recessed portion 23C formed at a rear e...
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JP7127994B2 |
To perform dressing of a grindstone so that a surface to be ground is not roughened even if a product wafer is ground with the grindstone in a state immediately after being dressed, in dressing a grinding surface of the grindstone using ...
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JP2022124134A |
To cut a workpiece so that the centers of processed grooves in a width direction on a back surface side and a front side of the workpiece are aligned with each other.A method of processing a workpiece includes a holding step of holding a...
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JP2022120277A |
To provide a cutting device capable of executing setting-up at a suitable timing according to the consumption amount of a cutting blade.A cutting device cutting a workpiece, is equipped with a chuck table that has a holding surface holdi...
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JP7117996B2 |
To provide an aspect suppressing variation when polishing a bevel of a substrate.A transfer machine 80 transports a substrate W to a substrate adsorption holding portion 20 holding a back surface of the substrate W. The transfer machine ...
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JP7117832B2 |
To provide a polisher capable of performing design with a high degree of freedom regarding a ratio of revolution to rotation of a polishing pad while making use of an advantage of a gear action having stable polishing force.A polisher in...
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JP7114925B2 |
To provide a machine tool capable of detecting an outer peripheral position of a workpiece in short time.A machine tool 10 includes: a bed 11; a traverse table 20 which is provided on an upper surface of the bed and is movable along a gu...
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JP2022114176A |
To provide a grindstone holding device capable of grinding an end surface, etc., without machining a grindstone in advance corresponding to a curved shape of the end surface of an object to be ground or the like.A grindstone holding devi...
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JP7110112B2 |
A hand-held machine tool, in particular a sanding machine, including a rod-type handle element for the user to grip and a processing head which is moveably mounted on the handle element by means of a joint assembly. The processing head h...
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JP2022110834A |
To provide a grinder which can accurately perform continuous rotation processing and rotation stop processing on workpiece having a large inertial moment using a motor having a small capacity.A grinder includes a storage part 40 for stor...
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JP7108775B1 |
To provide a simple inner surface grinding device capable of accurately grinding an inner surface of a pipe. An inner surface grinding apparatus (1) of one embodiment of the present invention has a support portion (10) for supporting a r...
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JP7107688B2 |
To provide a polishing method which can optimize a relative angle between a substrate stage and a pressurizing member.A polishing method includes measuring heights at least three points on a substrate holding surface 2a with at least thr...
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JP7106298B2 |
A chuck table includes a main part having a holding surface for holding thereon a workpiece through a dicing tape, and a frame holder disposed around the main part for holding the annular frame. The main part has a flat surface that func...
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JP2022107988A |
To provide a processing device that allows a user to easily and reliably recognize the relation between a processed area of a work piece seen in an image and processing conditions which have been applied for the processing on the area.A ...
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JP7098257B2 |
Provided is a control device of a grinding apparatus capable of suppressing heat from accumulating to a work, and shortening an air-cut time. A grinding apparatus, with respect to a work, repeats a transport motion of relatively moving a...
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JP7094532B2 |
To provide a double-ended grinder which, eve if areas of both end surfaces of a work-piece are different from each other, can uniformly grind the both end surfaces.A pair of turntables 13 are so located on a same axis as to be respective...
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JP2022098684A |
To provide a multiple spindle control mechanism capable of automation of polishing work and the like by controlling a relative position to a processing surface of a mold of a polishing tool.A multiple spindle control mechanism 1 is inter...
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JP2022097890A |
To make it possible to grind a top face of a work-piece while preserving an edge of a side corner.According to an operation method for a grinder that grinds a top face of a work-piece 100 by a rotary grindstone 15 of the grinder, a cut-i...
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JP7083232B2 |
To provide an automatic grinding device capable of automatically starting grinding processing by simple operation without performing teaching operation or the like by an operator.An automatic grinding device includes first detecting mean...
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JP2022085183A |
To provide a cutting blade tip position detection method capable of reducing the amount of a workpiece used for detecting the position of the tip of a cutting blade.A cutting blade tip position detection method of detecting the tip posit...
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JP2022083623A |
To grind workpiece with high accuracy regardless of the shape of its ground surface.A machine tool grinds workpiece 100 by a rotary grinding wheel 15. A ground surface of the rotary grinding wheel 15 is detected by a ground surface detec...
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JP3237654U |
To provide a rust removing device for a collet for removing rust generated on an outer peripheral surface of a collet and an inner peripheral surface of a mounting hole of the collet. A collet rust removing device has an outer peripheral...
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JP7069634B2 |
To provide a grinding machine and a grinding method which can reduce whole grinding time.A grinding machine 1 comprises a grinding wheel head 26, a head stock 12, feeding devices 24 and 25, coolant supply devices 30, 31, 31a and 32, and ...
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