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JP7464410B2 |
To provide a processing device that processes a non-circular work-piece into a desired thickness.A grinding device 1 comprises: a chuck 31 that adsorbs and holds a work-piece W; a detecting part 32 that can detect a rotation angle of the...
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JP2024047143A |
An object of the present invention is to propose an operation determination device that can appropriately determine the operation state of a hydraulically driven machine tool. [Solution] The operation determination device includes the ta...
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JP2024044602A |
An object of the present invention is to provide a processing device that allows the execution status of alignment to be confirmed by displaying on a monitor even when the alignment function is sped up. In a laser processing device, a co...
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JP7460711B2 |
[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding st...
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JP2024042336A |
[assignment]To provide a processing device capable of quickly centering a disc workpiece with a simple mechanism. [Solution] A control unit 100 of a processing device 1 carries out a wafer (disc workpiece) W by a robot hand 51 from a cas...
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JP2024041494A |
An object of the present invention is to provide an inspection method that can suitably inspect whether the orientation of an imaging unit has shifted with respect to the X-axis direction of the device. [Solution] In an apparatus includi...
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JP7449923B2 |
Retention apparatus and systems for material removal machines are disclosed. In some examples, a material removal machine having a material removal tool (e.g., a saw blade, an abrasive saw, a polisher, a grinder, and/or more general mate...
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JP7446714B2 |
There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatu...
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JP7445852B2 |
To provide a dicing device and a dicing method capable of stabilizing the dicing quality without being affected by the waviness of a work table surface and the variation in the thickness of a dicing tape.A dicing device (10, 10A) for dic...
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JP2024510303A |
A polishing and/or sanding head (9) is rotatably housed in an axially hollow primary disk (10) and an inner cavity of the primary disk (10). a rotating shaft (12) designed to be subjected to rotational movement by an external power take-...
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JP2024026950A |
An object of the present invention is to provide a grinding device that can improve productivity by reducing the time required to bring a grinding wheel of a grinding device into contact with a wafer. [Solution] A control means 46 of a g...
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JP2024026371A |
[Problem] A wafer re-grinding method that allows the target wafer to be easily changed from a wafer with an orientation flat to a wafer with a notch, or from a wafer with a notch to a wafer with an orientation flat, in a semiconductor ma...
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JP2024025598A |
[Problem] Processing technology using a wire mesh grindstone that enables a variety of cutting processes such as straight groove machining, arbitrary groove width processing, and straight line cutting to arbitrary curve cutting on workpi...
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JP7431542B2 |
A tire grinding machine (10) includes a frame (14) having a plurality of vertically extending posts (22). A chuck assembly (16, 18) is associated with the frame and adapted to receive and rotate a tire. A grinding assembly (30) is associ...
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JP7431589B2 |
To provide a processing device which can inhibit processing quality from being deteriorated by signal delay.A processing device includes: a grinding wheel which grinds a workpiece held by a holding table; a spindle supporting the grindin...
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JP2024019342A |
An object of the present invention is to form machining marks on an arcuate surface having an arcuate cross section toward the center of curvature of the arcuate surface. [Solution] The processing device includes a chuck table 10 that fi...
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JP7427327B2 |
To provide a workpiece grinding method which can achieve small variations of thickness occurring in a non-circular workpiece.In a workpiece grinding method, a grind stone is placed in contact with a ground surface of a non-circular workp...
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JP7426743B1 |
The present invention provides a thread groove super-finishing device that enables super-finishing of the thread groove of a ball screw nut and has fewer restrictions on the inner diameter of the nut. [Solution] A thread groove super-fin...
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JP2024014904A |
The present invention provides an alignment device and method that can prevent workpiece alignment errors from occurring. [Solution] The alignment method detects a part of the outer edge of the workpiece based on the measurement results ...
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JP7425583B2 |
A tool device (1) for machining a workpiece (4) by cutting, milling, drilling or grinding, comprising a sensor (20) for detecting a condition of the tool device (1) during machining, wherein the sensor (20) is connectable to a receiving ...
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JP2024012966A |
An object of the present invention is to provide a method for grinding a workpiece that can suppress an increase in the time required to grind the workpiece. [Solution] Prior to a stop step in which spark-out is performed, a separation s...
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JP7420122B2 |
Provided is a power tool with which it is possible to perform braking in which deterioration and damage of elements are suppressed. In a brake control, a computation unit 21: performs switching control of a combination of any of upper-ar...
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JP7418916B2 |
A cutting blade position detecting method using a cutting apparatus including a holding table that holds a workpiece, and a cutting unit in which a cutting blade for cutting the workpiece held by the holding table is mounted in a rotatab...
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JP2024009097A |
The present invention provides a dicing device and a dicing method that stabilize processing quality without being affected by waviness on the surface of a work table or variations in the thickness of a dicing tape. [Solution] A map crea...
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JP2024008341A |
The present invention provides a cutting device and a method for cutting a workpiece that can realize desired processing without reducing throughput. [Solution] The cutting blade rotates at a rotational speed (second rotational speed) di...
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JP7417281B2 |
To provide a centerless grinder which can automatically adjust a positional relationship between a grinding grindstone, and a blade and an adjusting grindstone without use of a pressing mechanism which presses a work-piece from above.A c...
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JP2024502063A |
The diamond grinding and polishing integrated processing device of the present invention includes a frame, a base device (1), and a polishing device (2). The base device (1) has a carriage that can be sent along the Y axis with respect t...
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JP7412187B2 |
The invention provides a grinding machine. Thegrinding machine (1) is provided with an inner case (3) that houses a brushless motor (4); a main shaft (6) disposed in front of the brushless motor (4);and an outer housing (2) in which the ...
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JP7412418B2 |
Apparatus, assemblies, and/or systems related to material removal are disclosed, such as saws, grinders, polishers, and/or more general material preparation and/or testing machines, for example. A material removal system may include a ma...
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JP2023554432A |
A monitoring system (12) for a moving component (3), such as a rotating component, supported by a fixed component (2). The monitoring system (12) includes an acoustic sensor (10) located within the movable component (3) and comprising tw...
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JP2023182220A |
To provide a production system which can reduce a processing cost regardless of variation of workpieces.A data processing apparatus 7 constituting a production system 1 determines start positions X2 and X12 of an idle running operation S...
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JP7394712B2 |
A cutting device is equipped with a spindle part, a control part, and a measuring device. The spindle part can adjust the height position, and the blade is installed therein. The measuring device is configured to measure the height posit...
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JP7392748B2 |
Provided is a rotary tool in which, when a switch is turned off to stop a tip tool, a fixture that fixes the tip tool is prevented from being loosened. In the rotary tool, the rotating tip tool is mounted on a spindle by the fixture, and...
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JP7391568B2 |
To provide a cutting device capable of detecting a division expected line by enabling imaging of the whole area of a workpiece even when imaging means is disposed at a position where it can image a first area including a rotation center ...
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JP7390574B2 |
To provide a device and a method for dicing which can prevent occurrence of an error in alignment of a work-piece during dicing processing and prevent a blade from interfering with a jig.A method for dicing includes: a step of measuring ...
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JP2023170262A |
To provide a substrate polishing method for performing polishing corresponding to substrates having various dimensions.Provided is a substrate polishing method which uses a polishing device that is provided with a polishing table having ...
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JP7382833B2 |
A processing apparatus includes a processing feed unit and a control unit. The processing feed unit moves a holding unit along guide rails between a processing zone, and an imaging zone in which a workpiece is imaged by a camera. The con...
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JP7382840B2 |
To provide a grinding device that can suppress the difficulty in replacing a grinding wheel.In a grinding device 1, grinding units 3, 4 are provided at the lower end part of a spindle. The grinding device comprises a wheel engagement par...
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JP2023165509A |
To suppress the degradation of detection accuracy of a height position of a polishing member, with a simple structure.A polishing device includes: a conveyer 10 that carries a workpiece W in a carrying direction P on a horizontal surface...
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JP2023161766A |
To provide a technique that can suppress elongation of a shaft grinding time.A grinding method comprises a process in which a reference journal is rotated around a rotation axis so as to decenter a reference center axis of the reference ...
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JP2023160031A |
To prevent a processing tool from colliding with a holding surface.When a rotation-start receiving part 71 receives a command to start rotation of a spindle 300, a set-up starting part 72 actuates a first set-up mechanism 81 and a second...
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JP2023158691A |
To provide a spindle unit capable of reducing a frequency of cleaning a tip of a spindle by suppressing adhesion of treated liquid containing treatment wastes to the tip.A groove is formed around a spindle in a region opposite an inner s...
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JP2023157088A |
To provide a spindle device that can easily switch whether or not to transmit rotation output generated by the rotation of a second motor to a spindle.A spindle device is provided with: a spindle having a mounting part on which a tool is...
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JP7369645B2 |
To improve flatness of a substrate that is processed by a processing device whose inner temperature is out of a desired processing temperature.A processing method, in which a substrate is processed by a processing device whose inner temp...
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JP2023154135A |
To provide an origin determination method capable of preventing a damage of a chuck table or a grinding wheel.An origin determination method includes: an adjustment step of adjusting a positional relation between a chuck table and a grin...
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JP2023151593A |
To provide a polishing device and a polishing method which can reduce the time needed for polishing process to stabilize the quality of a seal surface, and to provide a machine component in which the quality of the seal surface is stabil...
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JP2023144209A |
To provide a device which does not require a work for installing a separate fixation member around a movable body, and does not require a work for removing the fixation member when being transported to an installation location and execut...
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JP7355564B2 |
To recognize a height (an initial height) of a cutting blade when a tip of the cutting blade comes into contact with a holding surface while suppressing damage to the holding surface.On an image G taken with a camera 66, a height of a cu...
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JP7354069B2 |
Provided is a cutting apparatus which can calculate a height of at least a part of a spindle unit regardless of a horizontal position of the spindle unit. The cutting apparatus comprises the spindle unit, a movement unit, and a detector....
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JP2023131269A |
To provide a new work-piece processing method in which a time required for completing a cutting process can be shortened.A work-piece processing method includes: a first processing step in which a work-piece is cut on a first processing ...
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