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Patent Searching and Data


Matches 801 - 850 out of 3,444

Document Document Title
JP6182110B2  
JP6179109B2  
JP6161930B2
To provide a hydraulic circuit which cools a pressure oil supplied to a hydraulic actuator and controls the operation of the hydraulic actuator, and to provide a hydraulic cylinder driven by using the hydraulic circuit, a processor inclu...  
JP6157229B2  
JP6141135B2  
JP6130677B2
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing...  
JP6124571B2  
JP2017077587A
To provide a polishing device capable of performing easily and quickly deburring on the cut end face of a workpiece without skilled technique, and capable of finishing finely.A polishing device for polishing and deburring a cut end face ...  
JP6102502B2  
JPWO2015050186A1
An object of the present invention is to provide a polishing apparatus and a polishing method capable of polishing a work piece to be polished having various shapes. The polishing device moves the work piece (K) to be polished in the tan...  
JP6091879B2  
JP2017042856A
To provide a positioning device which can easily set a sensor in a predetermined reference position with respect to a measuring object.A positioning device positions a sensor 51 for measuring a distance contactlessly in a predetermined r...  
JP2017042840A
To provide a reciprocating grinder capable of accurately grinding workpiece.A reciprocating grinder is equipped with a table 22 which is reciprocated on a machine base 11 by a first linear motor 21 while placing workpiece 100 thereon; a ...  
JP2017035758A
To accurately and surely perform processing with a sufficient drop amount (crowning amount) even at the crowning of an extremely small curvature radius R.In a crowning method which uses a through-feed super finishing machine, presses a w...  
JP6058386B2  
JP6050086B2  
JP6044910B1
[Subject] Let a source-of-power pump be a double pipe pump of the double pipe cylinder more than 2 cylinder, and a piston (plunger), The ON/OFF operation member of a nonreturn function is provided in one nonreturn valve of each nonreturn...  
JP6041682B2  
JP6043848B1
[Subject] Efficiency of polish processing cannot be reduced, and breakage of a polish subject can be prevented, moreover, it excels in cost, and quality provides the polish device and grinding method whose good polish processing is attai...  
JP6041003B2  
JP6038260B1
[Subject] A coat stripping device which can ensure [correctly and] positioning of long board material to the surface when exfoliating a primer of long board material to which primer paint was given is provided. [Means for Solution] In co...  
JP2016192494A
To achieve management such that an amount of cut by a cutting blade is a predetermined amount required to completely cut a wafer, without dropping cutting efficiency.A dividing method for a wafer W1 comprises: an exposed area cutting ste...  
JP6013934B2  
JP6012303B2  
JP6012119B2
The invention relates to a machine (10) for machining and/or measuring a workpiece (49). Machine (10) has a machine frame (18), a first transverse member (24) which is rotatably mounted by means of a first round guide (25) about a first ...  
JP6000047B2  
JP5991417B2  
JP5988365B2  
JP5988765B2  
JP2016147329A
To provide a device which does not generate a secondary burr during chamfering.A grinding circumferential surface 7 of a grindstone wheel 5 during rotating is brought into contact with an edge ridge line part 10 of an end edge part 6 of ...  
JP5972107B2  
JP5964637B2  
JP5959544B2  
JP5959284B2  
JP3205398U
[Subject] It enables it to reduce time and effort which exchange of the worn-out cutting edge takes in a stick material cutting device. [Means for Solution] Nut runner 6 who is pipe material cutting device 1 which cuts stick material 100...  
JP2016124035A
To provide a slider body polishing device which can polish a slider with a stable accuracy.A slider body polishing device 100 polishes a top face of a slider 1 by a rotary polishing body 21 in such a manner that an anchor block 10 onto w...  
JP2016112680A
To provide a grinding machine for machining gearwheels, which has improved structure.A grinding machine 100 includes: a tool spindle 1 adapted to receive and rotationally drive a grinding tool 2 about a tool rotation axis B; a first work...  
JP5938296B2  
JP5939935B2  
JP5914138B2  
JP5907445B1
[Subject] A source-of-power pump of chopping processing is optimized with an NC unit of a machine tool, and improvement in processing efficiency is aimed at, It is related with a chopping processing method according energy-saving operati...  
JP5898983B2  
JP5898984B2  
JP5898982B2  
JP5896131B2  
JP5892526B2
The housing of a grinding spindle unit is pivotably mounted by way of a pivot axle on the receiving part of a grinding machine, e.g., on a grinding headstock. The grinding spindle unit bears a grinding wheel which is driven in rotation. ...  
JP5886680B2  
JP5887986B2  
JP5877783B2  
JP5865159B2  

Matches 801 - 850 out of 3,444