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JP7070340B2 |
A spindle device (10) with a built-in motor, wherein a flinger (40) is fixed to the front end of a rotational shaft (11) to form a labyrinth seal (44) with a housing H. The housing H has an opening (71) that allows air from outside the s...
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JP7069822B2 |
To flatly polish a polishing object with good accuracy.A polishing device 1 comprises: a spindle 31 to a lower part of which a polishing tool is connected; magnet couplings 33 which are provided on an outer peripheral surface of the spin...
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JP7067637B2 |
A spindle device (10) having a built-in motor, wherein a flinger (40) is fixed to one end side of a rotating shaft (11) and a labyrinth seal (44) is formed between the flinger (40) and a housing H. The housing H has: at least one air pur...
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JP2022068587A |
To provide a method of, when detecting the position of a cutting edge of a cutting blade, detecting the position of the cutting edge that can appropriately cut a division-scheduled line of a wafer without incorrectly recognizing a remnan...
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JP2022065818A |
To reduce a damaged layer that may be formed on a grinding target surface of a wafer.A second control unit 22 controls a gap changing mechanism 120 to extend the distance of a thrust gap 301 longer than a predetermined distance when a gr...
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JP2022063507A |
To creep-feed grind a workpiece so as to have a uniform thickness.During grinding, a wear amount of a grinding wheel 77 is measured by using a grindstone height measurement unit 80 or a grindstone length measurement unit 90, and the grin...
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JP7054195B2 |
To provide a double-head surface grinder which can improve process tolerance of both principal surfaces of a work-piece.A double-head surface grinder 10 comprises: a pair of grindstones 14a, 14b which are so located at an interval in an ...
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JP7054226B2 |
To provide a double-head surface grinder which is good in productive efficiency and is economically excellent while maintaining process tolerance when grinding a single surface of a work-piece, and a grinding method.A double-head surface...
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JP7052292B2 |
To restrain excess shaving with a rotary grindstone.A grinding device comprises a most-strain part identifying unit for identifying a most-strain part which approaches a workpiece most during grinding in a part included in a grinding sur...
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JP7049866B2 |
To shorten a cut groove length measuring time when performing set-up of chopper cut.A cutting device 1 comprises blade diameter recognition means 8. The blade diameter recognition means 8 comprises: a confirmation table 80 which holds a ...
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JP7049936B2 |
To suitably adjust plural chucks, which hold a substrate, in a processing device for processing the substrate.A method for adjustment of a processing device which comprises plural chucks and processes a substrate held by the chucks has: ...
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JP2022049944A |
To provide a machining device which enables an operator to quickly grasp an error occurrence part.A machining device for machining workpiece includes a chuck table having a holding surface for holding the workpiece, a machining unit for ...
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JP2022049249A |
To provide a substrate processing apparatus for making a forcing pressure of a substrate uniform.A substrate processing apparatus 1 includes: a top ring 24 (first rotor) that holds a substrate and has a rotating substrate holding surface...
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JP2022047801A |
To enable deterioration of accuracy of detecting an origin position to be prevented without requiring expertise of an operator.An origin position setting method for setting an origin position on a chuck table of a grind stone in a grindi...
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JP2022045938A |
To shorten grinding time while suppressing shortening of a service life of a grindstone.There is provided a cylindrical grinding device which comprises a disc-shaped grindstone, relatively moves the grindstone and a workpiece in a notchi...
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JP2022043641A |
To provide a processing device which enables high speed driving and can inhibit deterioration of processing accuracy caused by thermal expansion.A processing device 1 includes: a rotary tool 2b; a processing tool 2 which is provided at a...
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JP2022043869A |
To provide a processing device that is able to accurately detect a depth to which a cut is to be made into a workpiece by a cutting blade.A processing device 1 includes: a setup unit 40 that detects a tip position Z1 of a cutting blade 2...
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JP2022042470A |
To provide a tool holding device and a deburring device which are more compact than conventional devices.A deburring device 95A according to the present disclosure is configured so that portion of rotation power transmitted from a rotary...
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JP2022041491A |
To recognize a height of a highest upper face of a wafer to set an appropriate preparation position.A height of a rear face 82 of a wafer 80 is measured over a wide range on the rear face 82, so that a height of a highest portion of the ...
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JP2022039182A |
To provide an alignment method that can quickly complete the focusing prior to an alignment process.In the present invention, prior to an alignment process, the surface of a wafer is imaged using an image pickup unit arranged such that t...
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JP2022039183A |
To provide an alignment method that can quickly complete the focusing prior to an alignment process.In the present invention, an image pickup unit takes an image of the surface of a wafer through a transparent member having a plurality o...
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JP7033030B2 |
To prevent an operator from forgetting reference alignment work to be performed after attaching a grinding wheel to a mount.Provided is a tool management jig 6 capable of unified management of: a wrench 8 for fastening a bolt 79 to be us...
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JP2022029598A |
To grind a workpiece to have a uniform thickness.By performing an in-feed grinding step of, in such a horizontal position relation between a first grinding wheel 310 and a holding surface 211 that a lower surface 312 of the first grindin...
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JP7021455B2 |
A machining apparatus machines an end face of a tapered roller with a grinding wheel. The machining apparatus includes a support mechanism configured to support the tapered roller, a wheel unit on which the grinding wheel is mounted, and...
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JP2022023378A |
To improve productivity of a grinding device by shortening a wait time of grinding means.Conveying means 100 receives a plurality of plate-like workpieces temporarily placed on temporarily-placing means and conveys to a first holding sur...
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JP7014733B2 |
Described is an apparatus for robot-aided grinding, comprising the following: a manipulator, a linear actuator, and a grinding machine which includes a rotating grinding tool and is connected to the manipulator via the linear actuator. T...
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JP2022019014A |
To provide a cutting device that enables an operator to grasp the life of a workpiece for forming a cutting mark in advance before the workpiece for forming a cutting mark becomes unusable.Provided is a cutting device in which, when sign...
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JP2022019386A |
To propose a hydraulic system which can easily reduce an impact caused when a driving direction of a movable table is reversed.A hydraulic system (1) includes: an actuator (10) which drives a movable table (2) in a reciprocating manner a...
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JP2022019388A |
To propose a hydraulic system which can reduce an impact caused when a driving direction of a movable table is reversed.A hydraulic system (1) includes: an actuator (10) which drives a movable table (2) in a reciprocating manner and has ...
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JP7009234B2 |
To provide a wafer processing method by which the depth of a cut groove can be maintained highly accurately.A wafer processing method comprises: a processing device preparation step in which a processing device is prepared, comprising at...
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JP7009233B2 |
To provide a wafer processing method by which the depth of a cut groove can be maintained highly accurately.A wafer processing method comprises: a processing device preparation step in which a processing device is prepared, comprising at...
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JP6999263B2 |
To provide a method for manufacturing multiple ball screws in which wobble errors are rotationally synchronized.A manufacturing method according to one embodiment of the present invention comprises the steps of: mounting a first ball scr...
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JP2022506811A |
The present specification relates to a hand-held power tool provided with a gear device, wherein the gear device includes a gear input shaft and an output shaft, and a subassembly, and the subassembly is a sun gear that rotates together ...
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JP6994407B2 |
To provide a measuring tool capable of shortening a time until the parallelism of a retention surface and a grinding surface is measured.A measuring tool 10 is provided with a gauge 14 for measuring a retention surface height of a retent...
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JP6994334B2 |
To replace and add a cooling mechanism without adjusting belt tension and shorten a work time.A processing device includes holding means 2 for holding a wafer W. The holding means 2 has a holding table 20 for holding the wafer W, a rotar...
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JP2022001395A |
To enhance workability in confirming inclination relation between a grinding rotary shaft and a polishing rotary shaft.A confirmation jig 1 is fitted to a chuck table 205, and a flat top surface 12 of the confirmation jig 1 is used to ad...
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JP2022500848A |
The embodiments described herein relate to a rotating union for use in a wafer cleaning process. The rotating union includes the processing medium and the supporting medium, the processing medium and the supporting medium interact in the...
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JP6985457B2 |
The invention refers to an electric power tool arrangement (100) comprising an electric power tool (10) with a housing (12), an electric motor (34) located inside the housing (12), a working element (22) protruding from the housing (12) ...
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JP6985495B2 |
A manufacturing apparatus for producing a curved contour on an end face of a roll includes a grinding device and a holding device, linearly movable relative to the grinding device. The grinding device is for grinding the curved contour o...
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JP2021534991A |
Devices, systems and / or methods for adjusting belt tension in material removers are disclosed. In some examples, the material remover comprises a material remover 304 fixed to the spindle 310. The spindle pulley 314 is fixed to the spi...
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JP2021183375A |
To provide a plate polishing machine used for charging stand.A plate polishing machine used for charging stand comprises a frame, a fixing mechanism installed in the frame, a longitudinal conveying mechanism 5, a polishing mechanism 12 a...
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JP6975570B2 |
An object of the invention is to provide a cutting device and electrode terminal unit capable of improving workability while replacing an electrode terminal. The solution is characterized in comprising an origin detection mechanism (70) ...
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JP6970492B2 |
The present invention is to efficiently perform grinding processing on a wafer. A grinding device (1) includes a grinding means for grinding a wafer (W) held on a holding table (10), a Y-direction moving means (13) for positioning the ho...
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JP6961289B2 |
To provide a wafer processing method capable of specifying a street of a wafer whose front surface side having devices is covered with a sealing resin with high accuracy to appropriately process a wafer.A wafer processing method includes...
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JP2021167031A |
To provide a grinding device that can register an origin position more correctly and more safely while reducing burden on an operator.An origin position setting unit 50 of a grinding device 1 has a control unit 51 that sets an origin pos...
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JP6943692B2 |
To provide a processing device that can perform both cutting processing and honing processing alone, is small-sized and does not require a complicated structure.The processing device, in which a cutting processing unit 6 having a cutting...
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JP6937370B2 |
A grinding apparatus configured to grind a substrate includes a substrate holder configured to hold the substrate; and an annular grinder configured to come into contact with at least a central portion and a peripheral portion of the sub...
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JP6935168B2 |
Disclosed herein is an apparatus including an imaging unit configured to image a region in which a holding unit is moved by operation of a moving unit, a basic image storage unit configured to store a basic image corresponding to proper ...
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JP2021133451A |
To prevent a workpiece from being contaminated with oil.Before a workpiece 11 is mounted on a holding surface 200 in a state in which horizontal moving means 5 and vertical moving means 4 are coated with oil as a lubricant including phot...
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JP2021122929A |
To prevent breakage of a grindstone and a work-piece.A grinding device comprises: holding means which holds a work-piece; grinding means which grinds the work-piece held by the holding means by use of a grindstone; grinding feed means wh...
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