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JP6884292B1 |
Provided is an automatic abrasive exchange device capable of easily peeling off the sheet-shaped abrasive even when polishing under high load conditions such as high rotation speed and high pressing pressure while reducing the cost of th...
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JP2021079503A |
To provide a polish paper that has excellent usability while ensuring the strength necessary for polishing.A polish paper 1 has an abrasive 2, and a base material 3 bonded to the abrasive 2. The abrasive 2 has glass cloth 21 made by weav...
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JP6868454B2 |
To provide a polishing pad which enables the polishing of a semiconductor wafer backside, and the formation of a gettering layer without causing fiber falling.A polishing pad comprises a polyvinyl acetal-based resin foaming body impregna...
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JP6865497B2 |
To form a wafer gettering layer on a wafer, by controlling the melting of alkaline fine grains contained in an abrasive pad while supplying pure water.A processing method of a wafer (W) includes a polishing step of polishing the reverse ...
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JP6865180B2 |
An abrasive article includes a plurality of abrasive particles and the rotational orientation of at least a portion of the abrasive particles about the z-axis varies randomly within a defined range, and the spacing of the abrasive partic...
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JP2021058962A |
To provide a polishing tool which is excellent in polishing performance and can continuously polish the entire inner surface of a metal pipe with drawn tip, and a polishing method.This polishing tool is configured in such a manner that a...
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JP6859035B2 |
The purpose of the present invention is to provide an abrasive material which can has relatively high machining efficiency while inhibiting damage to a workpiece caused when the workpiece falls in a groove, etc. The present invention is ...
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JP6851794B2 |
To provide a polishing pad and a polishing method which make possible to supply an alkali polishing liquid to a wafer without providing a polishing liquid supply source.A polishing pad 78b for polishing a wafer comprises abrasive grains ...
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JP2021508609A |
The present disclosure generally relates to a coated polished article containing a pulverizing aid aggregate in a make coat, a size coat, a super size coat, or a combination thereof, and a method for producing the coated polished article.
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JP6839434B2 |
To provide a fixed grain wire saw having a binding material layer of high abrasive grain holding force and a method for manufacturing the same in order to suppress falling of abrasive grains.A fixed abrasive grain wire which contains a n...
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JP6838811B2 |
Interrupted structured abrasive articles comprise an abrasive layer comprising shaped abrasive composites that extend outwardly from a first major surface of a backing to which they are secured. The abrasive layer defines at least one op...
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JP6836532B2 |
A grinding material includes a base sheet and a grinding layer overlaid on a front face side of the base sheet and including abrasive grains and a binder for the abrasive grains. The grinding layer includes the abrasive grains of a plura...
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JP2021030325A |
To provide a manufacturing method for a polishing material that can eliminate the necessity of a step of making a base material adhere to a support body by laminating a polishing layer directly on a surface side of the support body, is s...
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JP2021506608A |
A device for replacing abrasive discs (8) that are coated with abrasive during function, the abrasive discs are made of, in particular, foam material, foam rubber, felt, or lambskin, and the abrasive discs are robots. The device for repl...
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JP2021020314A |
To provide a polishing pad which can achieve both reduction of processing time and prevention of scratches on a polished object.A polishing pad 1 comprising a base 10 and a polishing layer 20 laminated on a front surface of the base, and...
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JP2021019816A |
To provide a cleaning tool that can suppress falling of granular abrasive before use.A cleaning tool includes a cleaning base material to which granular abrasive is attached and water soluble paste contained in the cleaning base material...
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JP2021504170A |
The coated polishing disc includes a disc backing having an outer circumference. The polishing layer is placed on top of the disc backing. The polishing layer comprises a triangular polishing strip secured to the main surface of the disc...
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JP2021504171A |
The coated polishing disc includes a disc backing and a polishing layer placed on the disc backing. The polishing layer comprises a polishing element secured to the main surface of the disc backing by at least one binder material. Polish...
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JP2021504168A |
The coated polishing disc includes a polishing layer arranged on the main surface of the disc backing. The polishing layer comprises a triangular polishing strip secured to the main surface of the disc backing by at least one binder mate...
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JP2021504169A |
The coated polishing disc includes a disc backing and a polishing layer placed on the disc backing. The polishing layer comprises a polishing element secured to the main surface of the disc backing by at least one binder material. Polish...
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JP6829465B2 |
To allow use of a recycled product and reduce cost of a product price.A wire material F for surface processing is a melt-extruded product of a recycle pellet obtained by crushing, melting and extruding a waste product of a glass fiber-re...
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JP6827289B2 |
To provide a wafer processing method and a polishing device which enable rapid transfer to the formation of a gettering layer after polishing, and which enable a wafer processing as designed.A wafer processing method hereof is a method f...
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JP6829037B2 |
To provide a polishing pad which enables the polishing (thinning process, and stress release) of a silicon wafer backside, and the formation of a gettering layer, and by which the falling of fiber coming from the polishing pad can be sup...
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JP2021008006A |
To provide an abrasive material which does not easily peel off an abrasive pad.An abrasive material comprises: an abrasive pad having a base material, and a polishing layer laminated on a front surface side of the base material; a suppor...
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JP6822840B2 |
The purpose of the present invention is to provide a polishing pad which is able to achieve a good balance between reduction of the processing time and prevention of scratches on a polished object. The present invention is a polishing pa...
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JP2021003806A |
To provide a printing method on a filamentous member, which can improve performance of a filamentous saw with a simple method, and a filamentous saw.A printing method on a filamentous member comprises the steps of: providing a nipping pa...
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JP6805292B2 |
An abrasive article having a plurality of abrasive areas arranged in a non-uniform distribution pattern, wherein the pattern is spiral or phyllotactic, such as a spiral lattice, and in particular those patterns described by the Vogel mod...
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JP2020535978A |
A polishing article comprising a substrate having an elongated body and abrasive particles adhering to the elongated body, the amount of polishing particles being between a minimum and a maximum along the length of the body. It vibrates ...
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JP6797252B2 |
An abrasive article includes a substrate having an elongated body, a plurality of discrete tacking regions defining a discontinuous distribution of features overlying the substrate, where at least one discrete tacking region of the plura...
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JP2020188103A |
To provide a wafer manufacturing method, which can solve the problems of the strictness of management of a polishing liquid and the troublesomeness of a process for polishing liquid discard, and which can reduce the causes of generation ...
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JP2020185617A |
To provide a gear polishing body which, even if large rotational torque is applied to a gear to perform polishing operation, can suppress excessive deflection of a polishing sheet, and makes it possible that the polishing shee moderately...
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JP6786075B2 |
A wheel brush (1) includes a grinding element bundle holder (3) having an annular grinding element bundle-holding surface (12) that faces the outer circumferential side and a plurality of grinding element bundles (4) that are formed by g...
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JP2020168664A |
To provide a method for manufacturing a polishing sheet of a two-layered structure in which a material having a relatively high polishing force is stuck to a fibrous base material without spoiling flexibility of the base material.A manuf...
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JP2020167436A |
To suppress flaws to an object to be polished caused by a polishing film.A polishing film comprises a substrate film, an elastic layer disposed on a first surface of the substrate film and containing nonwoven fabric or silicone rubber, a...
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JP2020163550A |
To provide an abrasive grain electro-deposition wire which has a high abrasive grain holding force and has high working performance.A nickel plating film 14 formed on the surface of a metal wire 12 has a polygonal particle abrasion ratio...
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JP2020163476A |
To provide a polishing member capable of improving uniformity of roughness of a polishing surface of a polishing object.A polishing member is for polishing a target object, and includes a base material and a plurality of polishing parts ...
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JP2020161531A |
To provide a polishing dispersion liquid capable of maintaining a state for a long time in which diamond particles are dispersed in a state of primary particles.A method for manufacturing a polishing dispersion liquid includes steps of: ...
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JP2020157389A |
To provide a polishing sheet capable of polishing a polishing object without causing unevenness and scratches on a polished surface of the polishing object.A method for producing a polishing sheet includes the steps of: mixing a dispersi...
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JP6760930B2 |
A polishing article is described. The polishing article includes a composite pad body. The composite pad body includes a plurality of polishing features forming a polishing surface. The plurality of polishing features are formed from a f...
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JP2020116652A |
To achieve an extremely clean work environment by effectively suppressing abrasive powder generated during polishing from scattering around.Abrasive particles 5 are adhered on a surface of a base material sheet 2 of a polishing sheet. Th...
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JP6722748B2 |
A brush-like grinding stone (3) in a polishing brush (1) includes a brush holder (6) and a linear member aggregate (7) detachably held in the brush holder (6). The linear member aggregate (7) includes a large number of bundles (51) of th...
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JP6719125B2 |
To provide a polishing member and a polishing method, capable of smoothly polishing a raw material to be processed from a peripheral end side face up to the main surface regardless of the shape.A polishing member 10 polishes a peripheral...
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JP2020519468A |
The various embodiments disclosed relate to the polished article (10). The polished article (10) includes a backing (12) that defines the main surface. The polishing article (10) comprises a polishing layer containing a plurality of tetr...
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JP6703454B2 |
To provide a coil-shaped wire saw capable of restraining displacement of an abrasive coil in an axial or diameter direction of a core wire and capable of efficiently transmitting the cutting pressure of the abrasive coil to a cutting tar...
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JP6698682B2 |
A method is described to produce a fixed abrasive saw wire (104) by electrolytic deposition of abrasive particles pre-coated with a first metal on an elongated substrate wire (104, 202). The method is specific in that in the initial fixa...
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JP2020075357A |
To provide an improved polishing material having cutting performance independent of orientation.An improved polishing material (300) having cutting performance independent of orientation comprises a polishing structure (310) that include...
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JP2020513337A |
The abrasive article includes a backing, abrasive particles fixed to the backing, and a size coat provided on the abrasive particles, which size coat includes a binder resin, at least one filler material, and at least about 200. Includes...
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JP2020055090A |
To provide a grinding and cleaning tool which allows for increase in the economic efficiency of a grinding and cleaning brush and has high working efficiency in working of applying brushing work to a surface to be ground of a workpiece.A...
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JP6668042B2 |
To provide a gear polishing method using a gear polishing body that is able to prevent gear teeth from entering between adjacent polishing sheets during a gear polishing operation.In a gear polishing method using a gear polishing body 4 ...
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JP2020025993A |
To provide a wire saw capable of reducing the abrasion and/or scratching of a guide groove of a grooved roller of a multi wire saw.In a wire saw of the present invention, grinding abrasive grains adhere to a wire surface. The wire has a ...
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