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WO/2023/189776A1 |
A temperature control module 10a according to the present invention is provided with a temperature controller 11 and a composite material 1. The composite material 1 includes a skeleton 30, a plurality of voids 40, and a plurality of ino...
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WO/2023/190419A1 |
The present invention provides a resin composition for molding, the resin composition containing a curable resin, and an inorganic filler that contains silica particles and/or alumina particles, and calcium titanate particles. The conten...
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WO/2023/191534A1 |
The present invention makes it possible to: manufacture a CNT-coated substrate, which has a highly dense and uniform CNT film formed thereon and thus exhibits high stability against water or an organic solvent, by using a click reaction;...
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WO/2023/189741A1 |
The present invention provides: a rubber composition which is capable of reducing the proportion of petroleum-derived starting materials used therein without deteriorating the properties required for rubber products such as elongation pr...
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WO/2023/190596A1 |
The present invention provides a composite material which has a honeycomb structure that contains cellulose nanofibers and a carbon material, wherein the carbon material is composed of at least one material which is selected from among a...
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WO/2023/191681A1 |
A surface coating method comprises heating a coating solution comprising a gelling agent, at least one sulfate salt and water to a temperature above the melting temperature of the gelling agent but below 100C. The heated coating solut...
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WO/2023/192401A1 |
A polymer composition includes a matrix polymer and 0.1 to 30 wt% of an impact modifier including 40 to 90 wt% of an acrylate monomer, 1 to 50 wt% of at least one copolymerizable monomer, and 1 to 30 wt% of a functional monomer. A method...
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WO/2023/188491A1 |
This thermally conductive silicone composition contains a silicone polymer (A), thermally conductive particles (B), and a silane coupling agent (C). The thermally conductive particles (B) include aluminum hydroxide particles (B1), spheri...
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WO/2023/184665A1 |
The present invention relates to the field of hot melt adhesive films, in particular to an ultraviolet-aging-resistant TPU hot melt adhesive film, comprising the following raw materials in parts by weight: 85-100 parts of TPU granules; 1...
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WO/2023/189203A1 |
Provided is a composition containing particles, the particles including first particles (A-1) having an average particle diameter d of at least 100×10-7 cm. The composition further includes at least one type of compound selected from th...
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WO/2023/188690A1 |
Provided is a transparent resin film including a first resin layer containing a first resin and a second resin layer disposed on a first surface of the first resin layer and containing a second resin, wherein the first resin layer contai...
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WO/2023/190893A1 |
The present invention relates to a curable silicone composition comprising at least: (A) an organopolysiloxane resin that has at least two aliphatic unsaturated monovalent hydrocarbon groups per molecule; (B) an organopolysiloxane that h...
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WO/2023/190735A1 |
A thermally conductive filler according to the present invention comprises coarse inorganic particles and small-diameter inorganic particles. The coarse inorganic particles comprise, at a mass ratio of 60:40 to 100:0, large-diameter elec...
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WO/2023/189497A1 |
Provided is a copolymer represented by general formula (1). (In general formula (1): R1 to R4 are each independently a hydrogen atom, a halogen atom, an optionally substituted hydrocarbon group having 1-20 carbon atoms, or a substituent ...
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WO/2023/189610A1 |
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B havi...
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WO/2023/184057A1 |
A carbon black dispersion comprises a diol selected from an alkylene diol having 2-12 carbon atoms, cycloaliphatic diol having 6-24 carbon atoms, and an aromatic diol having 6-24 carbon atoms; 15-25 %by weight of a modified carbon black,...
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WO/2023/188031A1 |
The present invention provides a polyurethane resin composition which has excellent compatibility, while exhibiting excellent heat resistance and heat cycle properties. The present invention provides a polyurethane resin composition wh...
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WO/2023/190817A1 |
Provided below is an ethylene-vinyl alcohol copolymer composition in which thermal degradation during melt forming is suppressed. Provided is a modified ethylene-vinyl alcohol copolymer composition containing: a modified ethylene-vinyl...
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WO/2023/190145A1 |
The present invention provides a chloroprene polymer latex which enables the achievement of a dip-molded article of a chloroprene polymer, the dip-molded article having a sufficient tensile strength at break and excellent texture. The pr...
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WO/2023/189800A1 |
Provided are hollow particles having an excellent balance of pressure resistance, dielectric properties, and a thermal expansion coefficient as a filler for electronic material applications. The hollow particles each comprising a shell a...
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WO/2023/190309A1 |
A surface-modifier resin composition which is for use in a process comprising a step in which the surface-modifier resin composition is adhered to a surface of a structure including a first region, which is made of a cured epoxy resin co...
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WO/2023/190965A1 |
[Problem] To provide a novel antibacterial/antiviral resin composition. [Solution] An antibacterial/antiviral resin composition having antibacterial/antiviral properties and containing monovalent copper compound particles as an active in...
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WO/2023/189996A1 |
This resin composition for molding is for collectively sealing: a substrate equipped with an electronic component; a stator core which is fixed onto the substrate and which has a plurality of slots formed in the circumferential direction...
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WO/2023/190456A1 |
Provided is a cured product that has a surface onto which a marking ink can be easily applied, exhibits excellent adhesiveness with the marking ink after curing, and can form a marker having excellent visibility of characters and symbols...
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WO/2023/181942A1 |
[Problem] To provide a high-quality polyolefin resin foam despite the use of a biomass material therein. [Solution] Provided is a polyolefin resin foam containing a biomass material that has calcium carbonate as the main component. The b...
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WO/2023/183938A1 |
This disclosure provides CaCO3 and/or ZnO-loaded microcapsules for use as whitening agents in foods, beverages, supplements, pharmaceutic products, cosmetic products, and personal care products.
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WO/2023/178880A1 |
Disclosed in the present invention is a spraying-free composite material for preventing heavy metal pollution, and the present invention belongs to the technical field of polymer materials. The spraying-free composite material comprises ...
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WO/2023/183390A1 |
A thermal interface material that conducts heat is disclosed. The thermal interface includes a bulk layer and at least one adhesive layer. The bulk layer includes a first acrylic rubber, plasticizer particles, and first filler particles,...
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WO/2023/182414A1 |
A paste containing a polysiloxane having a mercapto group (A), a compound containing a group having two or more ethylenically unsaturated bonds per molecule (B), and a radical initiator (C).
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WO/2023/182346A1 |
The present invention provides a curable resin composition for an electronic material, said composition being easy to apply to an electronic material, and imparting flame resistance to the electronic material or improving the flame resis...
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WO/2023/182511A1 |
The purpose of the present invention is to provide: spherical silica particles suitable for use as a filler for a semiconductor sealing material having excellent dielectric properties in a millimeter wave band, i.e., spherical crystallin...
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WO/2023/182464A1 |
[Problem] To provide a sheet molded body that has excellent dielectric properties and solder heat resistance, and that also exhibits a low dimensional change rate (low thermal shrinkage) and a low linear expansion coefficient. [Solution]...
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WO/2023/181878A1 |
The present invention addresses the problem of providing: a polyvinylidene fluoride resin composition which is not susceptible to a hydrogen fluoride elimination reaction from a vinylidene fluoride polymer during molding, while exhibitin...
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WO/2023/182254A1 |
This thermoplastic elastomer composition comprises a thermally conductive filler (14) and a base polymer containing a styrenic thermoplastic elastomer and an ethylene-propylene rubber. The thermoplastic elastomer composition is character...
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WO/2023/183803A1 |
A nanocomposite includes a stack that includes at least one bilayer. Each of the bilayers independently includes an anionic layer and cationic layer. The anionic layer includes a polyanionic polymer, first particles, or a combination the...
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WO/2023/181708A1 |
This invention relates to: a plant freshness keeping composition comprising a (meth)acrylic resin, anti-aging agent, and porous material; and applications of the composition.
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WO/2023/178415A1 |
An extrudable composition includes: an aqueous phase comprising acidic water and piezoelectric ceramic particles suspended in the water; and, an organic phase having an organic solvent, a curable polymer precursor or both an organic solv...
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WO/2023/182495A1 |
[Problem] To provide a curable resin composition for black light shielding for an inkjet, the curable resin composition having excellent surface curability in addition to high light-shielding properties, exhibiting stable adhesion under ...
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WO/2023/181446A1 |
This thermally-conductive composition contains a liquid rubber having two or more hydroxyl groups per molecule, a plasticizer that has one or more hydroxyl groups per molecule and is compatible with the liquid rubber, a tackifier that is...
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WO/2023/180405A1 |
The invention relates to a rubber composition, comprising a rubber component that has at least one halobutyl rubber in an amount of 60 to 100 phr, and a filler component that comprises fillers F1 having a 14 C content in the range from 0...
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WO/2023/182041A1 |
Provided is a photosensitive resin composition having excellent patterning property and providing excellent pressure resistance (elastic modulus) of a cured product. This photosensitive resin composition contains (A) a polyimide, (B) a c...
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WO/2023/181977A1 |
A problem was presented in that the use of conventional, known organic-solvent-type electroconductive polymer compositions was limited by high surface resistance. The purpose of the present invention is to provide an electroconductive po...
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WO/2023/182123A1 |
The purpose of the present invention is to provide: a resin composition which is suitable for use in the production of an insulating layer of a printed wiring board, the insulating layer having a high dielectric constant and a low dielec...
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WO/2023/179286A1 |
The present application relates to the field of dentistry. Disclosed in the present application are a photocuring 3D printing material used for a dental model, and a preparation method therefor. Said photocuring 3D printing material is p...
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WO/2023/182459A1 |
A thermally-conductive composition according to the present invention includes a liquid polymer, a thermally-conductive filler, and a thixotropic agent, wherein a viscosity ratio (η1/η3) of a viscosity η1 measured by a rheometer at a ...
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WO/2023/181847A1 |
An object of the present invention is to provide at least a thermosetting resin composition and an adhesive that can suppress the bleeding phenomenon. Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a poly...
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WO/2023/182339A1 |
Provided are: a composition from which a film having high flexibility and suppressed cracking and peeling during dicing can be obtained; and a film, a laminate, and an optical member which are obtained using the same. The composition c...
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WO/2023/182763A1 |
A novel hyaluronic acid derivative according to the present invention is prepared by substituting an aldehyde group into a hyaluronic acid, which is a natural polymer having excellent biocompatibility as an extracellular matrix component...
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WO/2023/182485A1 |
This resin composition for encapsulation is used to produce a single-sided-encapsulation-type structure by single-sided encapsulation of a mother board on which at least one electronic device is mounted. This resin composition for encaps...
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WO/2023/182395A1 |
Provided is a resin composition that achieves lightweighting and high levels of both thermal conductivity and insulation. The resin composition comprises a thermoplastic resin (A), graphite (B), and an insulating thermal-conductive fil...
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