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WO/2024/155062A1 |
The present invention provides a gel nail sticker (100) comprising: a peel-off film layer (10); an adhesive layer (20) formed on the peel-off film layer (10); a base layer (30) formed on the adhesive layer (20); a color layer (40) formed...
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WO/2024/154463A1 |
The present invention addresses the problem of providing a composition that can form a conductive joining material having high conductivity and joining strength, and a conductive joining material, a device and a method for producing a co...
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WO/2024/154409A1 |
An adhesive composition containing two or more release agent components.
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WO/2024/154729A1 |
The present invention provides an adhesive film that allows for efficient removal of a support body even when irradiated with low-energy laser light, and also has excellent adherend removability even when high-temperature processing is p...
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WO/2024/154915A1 |
The present invention relates to a hypophosphorous acid-based flame retardant and a method for manufacturing same, the method for manufacturing a hypophosphorous acid-based flame retardant having a controlled particle size due to divalen...
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WO/2024/150784A1 |
[Problem] To provide an adhesive which exhibits excellent thermal durability and mechanical strength. [Solution] An adhesive composition which contains a (meth)acrylic resin (A), a crosslinking agent (B) and a silane compound (C), wherei...
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WO/2024/150765A1 |
An adhesive composition according to the present invention contains a cationically polymerizable compound and a curing agent. The cationically polymerizable compound contains an epoxy compound having three or more functional groups and a...
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WO/2024/148574A1 |
This invention relates to an adhesive composition which is advantageously employed to improve the bonding of various of low energy substrates such as rubber-based substrates. The adhesive composition comprises silicone, fillers, and spec...
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WO/2024/149166A1 |
Disclosed in the present invention are a low-fluidity packaging adhesive film specially for a heterojunction solar cell assembly and a preparation method for same. The packaging adhesive film is prepared from the following raw materials ...
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WO/2024/150783A1 |
(Abstract) (Problem) To provide an adhesive that exhibits excellent heat resistant durability and metal corrosion resistance. (Solution) An adhesive composition containing a (meth)acrylic resin (A), a crosslinking agent (B), a silane com...
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WO/2024/150762A1 |
This adhesive film for circuit connection is an adhesive composition that comprises a cationically polymerizable compound and a curing agent, with the cationically polymerizable compound containing an epoxy compound, and with the epoxy c...
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WO/2024/150766A1 |
An adhesive composition according to the present invention contains a cationic polymerizable compound, a curing agent, and conductive particles. The cationic polymerizable compound includes an epoxy compound having a bisphenol structure ...
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WO/2024/150767A1 |
This adhesive composition contains a cationically polymerizable compound and a curing agent. The cationically polymerizable compound contains an epoxy compound that has a trisphenol methane structure. The curing agent contains a pyridini...
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WO/2024/150782A1 |
[Problem] To provide an adhesive which exhibits excellent thermal durability and easy reworkability. [Solution] An adhesive composition which contains a (meth)acrylic resin (A), a crosslinking agent (B) and a silane compound (C), wherein...
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WO/2024/150781A1 |
[Problem] To provide an adhesive having excellent heat resistance and durability. [Solution] An adhesive composition containing a (meth)acrylic resin (A), a crosslinking agent (B1), and a silane compound (C), wherein the (meth)acrylic re...
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WO/2024/146548A1 |
Disclosed in the present application are a polymer, a preparation method therefor, a separator, an electrode sheet, a battery and an electrical apparatus. The polymer comprises an organic polymer and an inorganic substance, polymerizatio...
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WO/2024/147200A1 |
One aspect of the present invention is an adhesive film 100 comprising a substrate 1 and an adhesive layer 2 disposed above the substrate 1. When the adhesive layer 2 is observed in plan view, it is found that the adhesive layer 2 has a ...
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WO/2024/146064A1 |
The present application relates to the technical field of batteries, and discloses a binder, a separator, an electrode sheet, an electrode assembly, a battery cell, a battery, and an electric device. The binder comprises an organic polym...
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WO/2024/146375A1 |
A light adjusting packaging composition, comprising a photocurable glue composition and scattering particles. The scattering particles account for 1-10 wt% of the total weight of the light adjusting packaging composition, and the refract...
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WO/2024/143421A1 |
This adhesive composition comprises a moisture-curable urethane resin (A) that is a reaction product of a polyol (a1) having a polytrimethylene glycol skeleton and a polyfunctional isocyanate (a2).
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WO/2024/142684A1 |
Provided is a sticky agent for a wound dressing with which water-absorbing property and firm skin contact property can both be achieved. This sticky agent for wound dressing contains a sticky agent of a hot-melting type, a water-absorbin...
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WO/2024/143054A1 |
A seal material 1a has a thickness t of 1-40 mm. The seal material 1a has a surface section 10e. The surface section 10e includes an edge surface 11 in the thickness direction of the seal material 1a and has a thickness of 300 μm. The s...
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WO/2024/143135A1 |
This conductive paste comprises a compound (A) having a carbon-carbon double bond, a thermoplastic resin (B), and conductive particles (C).
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WO/2024/142446A1 |
Provided are: a curable resin composition which can be cured through heating at a low temperature and/or ultraviolet ray irradiation and with which corrosion of an adherend is suppressed; an adhesive; a sealing material; a cured product ...
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WO/2024/143341A1 |
The purpose of the present invention is to provide an adhesive tape which can be less environmentally harmful and which exhibits excellent optical transparency even if exposed to a high temperature and high humidity environment. The pres...
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WO/2024/142447A1 |
Provided are: a curable resin composition which can be cured at low temperatures, from which a cured product having a low Tg can be obtained, and which has excellent conformability to an adherend; an adhesive; a sealing material; a cured...
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WO/2024/144248A1 |
The present invention relates to an anaerobic adhesive composition and a method for preparing same and, more specifically, to an anaerobic adhesive composition and a method for preparing same, the composition comprising, in addition to (...
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WO/2024/142448A1 |
Provided are: a curable resin composition which can be cured at a low temperature and which has excellent pot life; an adhesive; a sealing material; a cured product; a semiconductor device; and an electronic device. This curable resin co...
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WO/2024/143121A1 |
This adhesive composition comprises: a modified polyolefin resin (A) having a reactive functional group which reacts with an epoxy group; an epoxy resin (B); and a silica filler (C). The silanol group concentration of the silica filler (...
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WO/2024/143457A1 |
The present invention addresses the problem of providing: an adhesive composition which has adhesive force, heat resistance, resistance to wet heat whitening, outgas resistance, light resistance, low dielectric constant and metal corrosi...
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WO/2024/143128A1 |
The present invention addresses the problem of providing: a solventless adhesive for a structure, said adhesive exhibiting excellent room temperature rapid curing properties and long-term resistance to wet heat; and a cured product and a...
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WO/2024/142685A1 |
The present invention achieves a sticky and adhesive agent excellent in a peeling property and a dispersion property of a water-absorbing material at the time of thermal melting. The sticky and adhesive agent contains a sticky and adhesi...
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WO/2024/144240A1 |
The present invention relates to an optical adhesive composition comprising a (meth)acrylate-based syrup with a viscosity of 1,500 to 10,000 cPs, a photoinitiator, and a UV absorber, and to an adhesive sheet manufactured therefrom.
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WO/2024/142943A1 |
The present invention addresses the problem of providing an adhesive sheet with which the visualization of a copper mesh can be prevented even when the adhesive sheet is bonded to a copper mesh-based transparent electroconductive film. T...
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WO/2024/143778A1 |
The present invention relates to: a compound, an adhesive composition comprising same; an adhesive film comprising same; and an electronic device. The compound according to one embodiment of the present invention has the structure of che...
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WO/2024/135808A1 |
Provided is a joining method for joining a heat generating body and a heat dissipation component, or a heat dissipation component and a heat dissipation component by means of a solid thermoconductive material. The present invention invol...
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WO/2024/136114A1 |
An adhesive coating composition for an electrical steel sheet, according to an embodiment of the present invention, comprises a mixed resin of a urethane resin and an epoxy resin, wherein the urethane resin comprises repeating units repr...
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WO/2024/134355A1 |
In some embodiments, the antistatic pressure sensitive adhesive includes a (meth)acrylate-based optically clear pressure sensitive adhesive matrix that is the product of a reaction mixture and at least one antistatic agent. The reaction ...
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WO/2024/136047A1 |
The present invention relates to a color film for a solar cell module and, more specifically, to a color film for a solar cell module, which comprises: a first substrate film layer as a base substrate; a second substrate film layer dispo...
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WO/2024/135438A1 |
This anaerobic curing-type adhesive agent composition contains a bifunctional ethylenically unsaturated compound, a polyfunctional ethylenically unsaturated compound having a functionality of three or more, a radical polymerization initi...
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WO/2024/135432A1 |
[Problem] To provide an adhesive film which is capable of suppressing lifting and peeling even when used by being attached to a cover window that has undergone an antifouling treatment. [Solution] This adhesive film is to be used by bein...
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WO/2024/135514A1 |
Provided are: a two-part curable adhesive which contains a polyol composition (X) containing a polyester polyol compound (A), and also contains a polyisocyanate composition (Y) containing a polyisocyanate compound (B), wherein the number...
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WO/2024/135805A1 |
[Problem] To provide: a curable silicone composition which can be cured rapidly at low temperatures, has excellent storage stability, and which forms, through curing, a relatively hard cured product that has less surface tackiness; a cur...
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WO/2024/135268A1 |
This thermosetting resin composition contains: a polyamideimide resin having an acrylonitrile-butadiene skeleton; an epoxy resin that is not solid at 25ºC; fine rubber particles dispersed in the non-solid epoxy resin; an inorganic fille...
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WO/2024/135756A1 |
The curable adhesive composition of the present invention is characterized by containing (1) at least one cationic polymerizable component selected from the group consisting of cationic polymerizable monomers, cationic polymerizable olig...
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WO/2024/135806A1 |
[Problem] To provide: a hot melt curable silicone composition which is useful as a material for a die attach film, with which an unwanted dicing tape can be easily separated after dicing from a surface of a semiconductor device in a semi...
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WO/2024/130618A1 |
Provided by the present application are an adhesive glue, an adhesive tape, an electrochemical apparatus, and an electrical apparatus. The adhesive glue comprises a styrene-isoprene-styrene block copolymer, an acrylic resin and polyethyl...
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WO/2024/135755A1 |
A curable adhesive agent composition according to the present invention is for the adhesion of a metal and a resin and is characterized in that the curable adhesive agent composition contains (1) a cation-polymerizable component containi...
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WO/2024/136539A1 |
Provided are an optical member and an optical display device comprising same, the optical member comprising: a substrate layer having an 80% or higher light transmittance at a wavelength of 350-400 nm; and an adhesive film adhering to on...
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WO/2024/128581A1 |
The present invention relates to an adhesion-imparting resin comprising: a petroleum-based resin monomer-derived repeating unit (a) and a phenolic monomer-derived repeating unit (b) wherein the repeating unit (b) has an epoxy group-beari...
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