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WO/2022/244558A1 |
The present invention provides an adhesive sheet having an adequate storage elastic modulus and improved durability. This adhesive sheet has a 25°C storage elastic modulus G' of 0.4 MPa or greater. When a cross-section of the adhesive s...
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WO/2022/241772A1 |
Provided is a curable composition comprising (A) at least one (meth) acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst, which can thermally be curable at a temperature of lower than 100℃ and can...
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WO/2022/244556A1 |
The provided adhesive agent composition includes a (meth)acrylic polymer (A) as a main component, and furthermore includes a cross-linking agent (B). When an adhesive sheet is formed from the adhesive agent composition, the gelling rate ...
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WO/2022/244880A1 |
Provided is a curable resin composition containing the following components (A)-(E). (A) A compound having two or more glycidyl groups per molecule (however, not including (B)). (B) A glycidyl-group-containing acrylic polymer. (C) A tack...
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WO/2022/244756A1 |
The purpose of the present invention is to provide an adhesive tape which exhibits excellent peeling performance with respect to a chip component, and which can suppress adhesive residue on a chip component. The present invention is an a...
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WO/2022/244554A1 |
The present invention provides a pressure-sensitive adhesive composition which contains a sufficient amount of an isocyanate-based crosslinking agent and is suitable for producing pressure-sensitive adhesive sheets that are less apt to c...
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WO/2022/244796A1 |
The purpose of the present invention is to provide a surface-protective film which has high adhesive force (initial adhesive force) and which, after having been applied to an adherend, is less apt to increase in adhesive force with the l...
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WO/2022/244555A1 |
An adhesive composition provided herein includes a (meth)acrylic polymer (A) as a main component, and further includes a cross-linking agent (B) having a functional group reactive with a hydroxyl group, and a polyfunctional alcohol (C). ...
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WO/2022/238377A1 |
Method for bonding a thermoplastic piping system (1) without the use of solvent-based adhesives, the piping system (1) comprising at least one first pipe or fitting part (11), and at least one second pipe or fitting part (12), which comp...
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WO/2022/239785A1 |
Provided is a composition for forming a release layer comprising a polymer including a repeating unit having a photosensitive group that undergoes photo-Fries rearrangement.
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WO/2022/240551A1 |
Disclosed is a two-component, liquid curable polyurethane adhesive system comprising an isocyanate reactive part A and an isocyanate functional part B. Either or both parts include substantial amounts of sustainable materials. The invent...
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WO/2022/235189A1 |
The present invention relates to biobased binder compositions which are environmentally benign, renewable, compostable and/or biodegradable. The biobased compositions comprise chitosan, an acid and a plasticizer. By treating an airlaid n...
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WO/2022/234802A1 |
[Problem] To provide, as a curable silicone composition used in an optical display or the like, an ultraviolet radiation-curable silicone composition which exhibits storage stability and sufficient rapid curing properties and yields a cu...
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WO/2022/230745A1 |
The present invention provides a compound which is represented by formula (1). (In formula (1), each of R1, R2, R3 and R4 independently represents a hydrogen atom, a polymerizable functional group having 1 to 50 carbon atoms or an alkyl ...
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WO/2022/230768A1 |
Provided is an epoxy resin curable composition that cures quickly and has a high hardness and excellent color tone after curing. This epoxy resin curable composition, which contains an epoxy resin having two or more epoxy groups per mole...
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WO/2022/230869A1 |
The purpose of the present invention is to provide a 2-component type urethane-based adhesive composition that exhibits excellent workability, excellent mechanical discharge properties and excellent heat-resistant adhesive properties. Th...
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WO/2022/230767A1 |
Provided is an epoxy resin curable composition that cures quickly and has high hardness and exceptional color tone after curing. Provided is an epoxy resin curable composition containing an epoxy resin having two or more epoxy groups per...
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WO/2022/227445A1 |
Disclosed in the present invention are an organosilicon-modified acrylate, a silane-modified polyether adhesive, and a preparation method therefor. The organosilicon-modified acrylate has a structure as shown in formula I. The silane-mod...
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WO/2022/230027A1 |
The present invention relates to: an energy ray-crosslinkable adhesive agent composition which contains (A) an acrylic resin that is energy ray-crosslinkable and (B) a tackifier, wherein the tackifier (B) contains (B1) a styrene resin; a...
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WO/2022/230935A1 |
The purpose of the present invention is to provide an adhesive tape that achieves both excellent adhesive power and holding power. The adhesive tape according to the present invention has an adhesive agent layer. When a small-angle X-ray...
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WO/2022/232730A1 |
Multiple cure coreactive compositions for three-dimensional printing include a polythiol, a reactive polyamine, and a coreactive compound that is reactive with both the polythiol and the reactive polyamine. The reaction between the polyt...
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WO/2022/230936A1 |
The purpose of the present invention is to provide: an adhesive tape which has both excellent adhesive power and excellent holding power; and an adhesive composition which is used for this adhesive tape. The present invention provides an...
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WO/2022/230874A1 |
The present invention provides a composition for provisional fixation containing the components (A) to (C) described below, the composition being excellent in terms of compatibility, adaptability to spin coating processes, heat resistanc...
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WO/2022/230222A1 |
A pressure-sensitive adhesive sheet (S) as this pressure-sensitive adhesive sheet changeable in color includes a pressure-sensitive adhesive layer (10). The pressure-sensitive adhesive layer (10) comprises: a polymer component having a m...
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WO/2022/224934A1 |
Provided is an adhesive composition containing a polymerizable compound, a thermal polymerization initiator, and a dicarboxylic acid diester compound.
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WO/2022/224688A1 |
The present invention provides: an adhesive composition that has excellent moldability in various types of molding such as extrusion molding, excellent film forming properties, and excellent adhesiveness even to highly polar materials, a...
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WO/2022/219969A1 |
The present invention addresses the problem of providing: an adhesive composition that exhibits high adhesiveness with respect to a low-polarity adherend and that is capable of forming an adhesive layer and the like having excellent heat...
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WO/2022/217672A1 |
Provided in the present invention is a water-based low-temperature heat transfer printing adhesive, which is prepared from the following raw materials in parts by weight: 20-30 parts of an ethylene acrylic resin, 3-10 parts of an alkalin...
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WO/2022/220253A1 |
The purpose of the present invention is to provide a curable resin composition that has excellent heat resistance, thermal conductivity, and adhesiveness. Another purpose of the present invention is to provide a cured product of said cur...
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WO/2022/220498A1 |
The present application may provide a pressure-sensitive adhesive composition for forming a pressure-sensitive adhesive layer that is applied to a flexible device to effectively cope with repeated deformation and recovery, does not cause...
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WO/2022/220261A1 |
An insulating resin sheet according to the present invention is formed from a curable resin composition that contains a thermosetting resin, a curing agent and an insulating heat-dissipating filler having a thermal conductivity of 10 W/m...
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WO/2022/220285A1 |
A hardener comprising a pyridinium salt, wherein the pyridinium salt has a benzyl group at the 1-position and has an electron-attracting group at the 2-position, the benzyl group having an electron-donating group; an adhesive composition...
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WO/2022/216397A1 |
Embodiments of the present disclosure are directed to a coating composition comprising a first thermoplastic resin suspended in a liquid medium, and a second thermoplastic resin in the form of solid particles, wherein the second thermopl...
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WO/2022/215521A1 |
The present invention provides a two-part curable resin composition that does not use a dibutyltin catalyst, has exceptional storage stability, cures quickly upon mixing, and yields a cured product having high elongation and high strengt...
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WO/2022/213324A1 |
Provided is a UV curable adhesive composition, an adhesive tape comprising the UV curable adhesive composition, an adhesive film formed by UV curing of the adhesive composition, and a corresponding bonding member. The UV curable adhesive...
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WO/2022/215877A1 |
The present invention provides an adhesive composition having improved reliability with respect to penetrating bubbles, and a display device. The display device comprises: a display panel; a cover window disposed on the display panel; an...
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WO/2022/215522A1 |
The present invention provides a two-part curable resin composition that, while maintaining the adhesive strength with respect to metals, can provide a cured product having high strength and high elongation. Provided is a two-part cura...
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WO/2022/209901A1 |
An epoxy resin adhesive for medical instruments which comprises the following components (A) to (C); a cured object obtained from the epoxy resin adhesive; a medical-instrument member; and a medical instrument. (A) An epoxy resin (B) A...
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WO/2022/210576A1 |
The purpose of the present invention is to provide an adhesive agent which is safe and has low environmental impact, and an adhering method which uses the adhesive agent. An adhesive agent according to the present invention is characteri...
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WO/2022/210276A1 |
An objective of the present invention is to provide a radiation-curable adhesive sheet with which the progress of curing during storage can be suppressed, with which excellent thickness unevenness absorbability and stress relaxation prop...
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WO/2022/206876A1 |
Disclosed are a composition of heat-expandable microspheres and an application thereof. The composition comprises heat-expandable microspheres and a solvent, wherein: (1) the particle size of the heat-expandable microspheres is 5 μm≤D...
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WO/2022/210275A1 |
An objective of the present invention is to provide a radiation-curable adhesive sheet with which the progress of curing during storage can be suppressed, with which excellent thickness unevenness absorbability and stress relaxation prop...
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WO/2022/209875A1 |
According to the present invention, in a semiconductor device in which a plurality of connection portions of a semiconductor chip and a plurality of connection portions of a wiring circuit board are electrically connected to each other o...
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WO/2022/210053A1 |
The present invention relates to a modified polyolefin resin in which a polyolefin resin (A) is modified using an α,β-unsaturated carboxylic acid and/or an acid anhydride thereof (B), the modified polyolefin resin being furthermore mod...
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WO/2022/210263A1 |
Provided are: a chloroprene-based polymer latex in which generation of aggregates during or after having undergone a polymerization reaction is less, and from which an adhesive agent composition that does not cause layer separation for a...
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WO/2022/210261A1 |
The present invention provides a curable resin composition that gives a cured product having reduced surface gloss, and a sealing material that includes the same. The present invention also provides a cured product that is obtained by cu...
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WO/2022/209222A1 |
The present invention addresses the problem of providing: adhesive tape in which adhesive force with respect to an adherend can be adequately reduced and which can easily be detached and removed, without damaging or dirtying the adherend...
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WO/2022/210087A1 |
A filmy adhesive (13) which is thermally curable and includes an acrylic resin (a) having a carboxy group. The filmy adhesive (13), when applied to a #2000-polished surface of a silicon wafer and thereafter peeled from the silicon wafer ...
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WO/2022/210166A1 |
An adhesive composition which contains a polymerizable monomer that has a (meth)acryloyl group, a radical polymerization initiator and polymer particles that are swellable with an organic solvent, wherein with respect to the particle siz...
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WO/2022/210579A1 |
The following is provided as an adhesive composition having excellent adhesiveness in a frozen state at -10°C even while decreasing the amount of petroleum-derived materials used, that forms an adhesive having excellent curved surface a...
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