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WO/2023/092286A1 |
Provided are a polyurethane phase-change nanocapsule, a phase-change polyurethane pouring sealant and a preparation method therefor. The polyurethane phase-change nanocapsule is a nanocapsule formed by coating a phase-change material wit...
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WO/2023/092288A1 |
A graphdiyne dispersion liquid, a bi-component polyurethane adhesive and a preparation method therefor, wherein the graphdiyne dispersion liquid is prepared from graphdiyne powder and a polyurethane dispersant; component A of the bi-comp...
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WO/2023/087411A1 |
An organopolysiloxane composition having excellent bonding performance and reliability and a preparation method therefor, especially an organopolysiloxane composition suitable for positioning and bonding a heat dissipation cover plate of...
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WO/2023/090026A1 |
The present invention provides a microcapsule type curable resin composition which is applied to a screw member so as to reduce the generation of dust when the screw member is screwed into a base material, while additionally having excel...
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WO/2023/090030A1 |
The purpose of the present invention is to provide: an adhesive composition which can ensure desired adhesiveness without requiring the use of resorcin and does not reduce operation efficiency when used; and an organic fibrous material, ...
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WO/2023/090049A1 |
[Problem] The present invention addresses the problem of providing a thermally conductive silicone adhesive composition that has satisfactory handling properties and can achieve sufficient adhesion strength. The present invention also ad...
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WO/2023/090684A1 |
The present invention relates to an electrode assembly for a lithium secondary battery and a secondary battery comprising same, wherein at least one electrode disposed at the outermost region of the electrode assembly is a single-sided p...
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WO/2023/090431A1 |
Provided is a silicone adhesive that can be used easily underwater, has excellent curability even in water, exhibits excellent adhesiveness to adherends such as rocks and structures underwater, and has excellent workability. A one-compon...
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WO/2023/091806A1 |
The present disclosure relates generally to two part adhesive compositions comprising a thiol part including a component having thiol functionality and a (meth)acrylate functional part including a polyolefin polymer having (meth)acrylate...
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WO/2023/090347A1 |
A purpose of the present invention is to provide a curable resin composition having excellent heat resistance, thermal conductivity, and adhesiveness, and low linear expansion. Another purpose of the present invention is to provide a cur...
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WO/2023/089863A1 |
[Problem] To provide a low-viscosity electroconductive adhesive that can be suitably used in a jet dispenser, can maintain a constant discharge shape and a constant discharge rate, can be discharged continuously due to being unlikely to ...
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WO/2023/090008A1 |
The present invention addresses the problem of providing an adhesive composition which can ensure desired adhesiveness without requiring the use of resorcin and does not reduce operation efficiency when used. The adhesive composition is ...
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WO/2023/085280A1 |
A curable resin composition containing a prepolymer (A) having a reactive silyl group, an epoxy compound (B), and a photoacid generator (C).
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WO/2023/085413A1 |
The present invention provides: an aqueous adhesive which uses an adhesive component that does not contain resorcinol and formalin, and which exhibits excellent adhesion between fibers and an elastomer, while being capable of suppressing...
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WO/2023/085167A1 |
The present invention provides a thermosetting adhesive composition which is used for the purpose of bonding circuit members to each other, and which has a storage elastic modulus of 700 MPa or less at 35°C after being heated at 130°C ...
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WO/2023/085335A1 |
The adhesive composition provided herein contains, as a main component, a polymer (A) having a polyether structure, and further contains a conductive agent and a radical scavenger. When an adhesive sheet is formed from said adhesive comp...
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WO/2023/085034A1 |
Provided are surface-treated inorganic particles from which a curable composition having good handling and storage stability, and a cured product having good thermal conductivity can be formed. Surface-treated inorganic particles (D) hav...
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WO/2023/085103A1 |
Provided are: a two-part curable adhesive with which little residual organic solvent is included in an adhesive coating film and which poses no risk of solvent odor, even when a solvent-type adhesive having a polyester polyol as a main c...
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WO/2023/085083A1 |
The present invention provides an optical multilayer body which comprises an adhesive sheet having a sufficiently low surface resistance, and which is suitable for suppression of unwanted coloring of light from an image display device ev...
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WO/2023/083837A1 |
The present invention relates to a double-face adhesive tape that can be removed by twisting, prying or peeling off from, e.g., a wall, without leaving residues.
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WO/2023/085269A1 |
Provided is a composition for adhesion containing a hydrolyzable silyl group-containing polyoxyalkylene polymer, wherein the composition for adhesion has improved adhesiveness to polyester base materials. An adhesive composition for poly...
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WO/2023/085409A1 |
An adhesive tape comprising a substrate and an adhesive layer layered on at least one side of the substrate, wherein the adhesive layer contains a (meth)acrylic polymer having a carboxyl group, an amine compound having a secondary or hig...
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WO/2023/085387A1 |
The present invention comprises a component (A) containing an isocyanate-terminated polyisocyanate, a component (B) containing a polyol, and a component (C) containing urethane particles. The component (B) contains a cross-linking agent ...
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WO/2023/085412A1 |
The present invention provides: reinforcing fibers which use an adhesive component that does not contain resorcinol and formalin, and which exhibit excellent adhesion especially to a rubber adherend that has high polarity; a method for p...
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WO/2023/085281A1 |
Provided are an adhesive and an adhesive tape that have high flame retardance even when there is little flame retardant in the adhesive layer. Specifically provided is an adhesive containing a resin component and a flame retardant, whe...
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WO/2023/085084A1 |
The present invention provides an image display panel with a touch sensing function, the image display panel comprising an adhesive sheet that has a sufficiently low surface resistance, while being suppressed in durability decrease even ...
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WO/2023/080637A1 |
Provided are a silicone-based adhesive film, an optical member comprising same, and an optical display device comprising same, the silicone-based adhesive film being formed of a composition comprising: a reactive silicone-based resin; an...
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WO/2023/080599A1 |
Embodiments of the present invention provide an adhesive composition. Provided is an adhesive composition comprising an acrylic copolymer comprising a repeating unit derived from a first acrylic monomer, wherein the first acrylic monomer...
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WO/2023/077915A1 |
The present application discloses an insulating adhesive, an insulating adhesive tape, and a preparation method for the insulating adhesive. The insulating adhesive comprises an insulating adhesive matrix and insulating particles with wh...
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WO/2023/080638A1 |
Provided are an optical display device and an adhesive film to be included therein. The optical display device comprises: a panel for an optical display device and an adhesive film stacked on at least one surface of the panel for an opti...
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WO/2023/079780A1 |
Provided are a temperature indicator manufacturing system and a temperature indicator manufacturing method that reduce the labor and cost of management associated with temperature indicator manufacturing. This temperature indicator manuf...
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WO/2023/074890A1 |
A projection screen 1 is used by being attached to an optically transparent adherend, and is provided with a transparent base material 11 and an adhesive agent layer 12. A 0°-frontal luminance on the transparent base material 11 side as...
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WO/2023/074788A1 |
This aqueous resin composition at least contains: a polyurethane resin having a carboxylate group; a crosslinking agent having at least two carbodiimide groups per molecule; and a surfactant. Said aqueous resin composition is characteriz...
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WO/2023/074840A1 |
Provided is a new moisture-curable hot-melt adhesive composition having an even better effect. An embodiment of the present invention is a moisture-curable hot-melt adhesive composition including a urethane prepolymer, characterized in t...
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WO/2023/074556A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet including a base polymer and having photocurability. The base polymer is a photopolymerization product. The pressure-sensitive adhesive sheet (10...
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WO/2023/074448A1 |
Provided is an adhesive sheet that exhibits both tack and holding power despite having a structure comprising a thin adhesive layer. Specifically provided is an adhesive sheet comprising an adhesive layer having a thickness of 10 µm or ...
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WO/2023/071202A1 |
The present disclosure provides an adhesive, and a preparation method therefor and the use thereof. The adhesive comprises the following raw materials, in percentages by mass: 40-90% of an acrylic monomer, 5-50% of a hydrogen bond accept...
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WO/2023/074558A1 |
This adhesive sheet (10) contains a base polymer as a photopolymer and is photocurable. This adhesive sheet (10) has a gel fraction of at least 75% by mass after curing by a photocuring process under the condition of an irradiation integ...
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WO/2023/074474A1 |
The present invention provides a film-like adhesive 1 for semiconductors, the film-like adhesive 1 comprising a first adhesive region 2 and a second adhesive region 3 in the thickness direction. With respect to this film-like adhesive 1 ...
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WO/2023/074557A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet containing a base polymer. This pressure-sensitive adhesive sheet (10) has a gel percentage G (%) of 90% or less, a shear storage modulus E (MPa)...
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WO/2023/074468A1 |
Provided is an adhesive agent composition able to form an adhesive agent which is lightly releasable at a low peeling speed and can suppress an increase in peeling force at a high peeling speed. Also provided is an adhesive sheet which i...
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WO/2023/068277A1 |
An adhesive tape for circuit connection provided with a first base material, an adhesive film, and a second base material, in that order, the adhesive film containing a cationic polymerizable compound, a thermal cationic polymerization i...
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WO/2023/068559A1 |
An anisotropic conductive adhesive film according to the present invention minimizes the movement of conductive particles in a compression process by fixing the conductive particles with strong force through the high modulus of a polymer...
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WO/2023/065311A1 |
Provided is a hot melt adhesive composition, comprising: (a) from 30 to 45% by weight of at least one thermoplastic block copolymer; (b) from 0.1 to 5% by weight of at least one wax having a melting point of no less than 100℃; (c) from...
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WO/2023/068302A1 |
[Problem] The present invention addresses the problem of developing a chloroprene polymer latex adhesive composition that has excellent adhesiveness to soft polyvinyl chloride resins and also has excellent thermal creep resistance with a...
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WO/2023/068558A1 |
An anisotropic conductive adhesive film according to the present invention minimizes the movement of conductive particles in a compressing process by fixing the conductive particles by means of strong force through a high modulus of a po...
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WO/2023/067662A1 |
This thermosetting resin composition contains: an epoxy resin that is solid at 25°C; an epoxy resin that is non-solid at 25°C; a finely particulate rubber that is dispersed in the non-solid epoxy resin; a setting agent; an inorganic fi...
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WO/2023/062938A1 |
A method for ejecting a resin composition is provided in which the resin composition can be effectively inhibited from curing inside a jet dispenser. This ejection method comprises using a jet dispenser 50 to eject a resin composition 20...
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WO/2023/063052A1 |
The purpose of the present invention is to provide a sheet for application to component-mounting surfaces of electronic substrates and for thereby protecting the electronic substrates; and an electronic substrate protected by the sheet. ...
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WO/2023/063457A1 |
This semiconductor light-emitting element includes an emission layer, a passivation layer on the emission layer, and a first adhesive layer on the passivation layer. The passivation layer may include a plurality of grooves, and the first...
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