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WO/2023/021773A1 |
Provided is a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer which can be formed with low heat energy and can exhibit excellent adhesive force. This pressure-sensitive adhesive sheet comprises a substra...
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WO/2023/022094A1 |
A curable adhesive composition for use in bonding wiring members as a component of a multilayered wiring board. The curable adhesive composition gives a cured object which, when the thermal expansion coefficient and glass transition temp...
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WO/2023/020226A1 |
The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silico...
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WO/2023/017787A1 |
[Problem] To achieve an anaerobic adhesive composition with which the occurrence of coating failures during application can be suppressed. [Solution] This anaerobic adhesive composition contains a (meth)acrylic monomer, an organic peroxi...
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WO/2023/017788A1 |
[Problem] To provide an anaerobic adhesive composition containing a novel component that functions as an anaerobic curing accelerator in the anaerobic adhesive composition. [Solution] This anaerobic adhesive composition contains a (meth)...
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WO/2023/017752A1 |
The present invention addresses the problem of providing a resin composition and an adhesive that are highly curable and have a high photocuring adhesive strength with UV light having a longer wavelength (for example, 405 nm) and that ar...
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WO/2023/015797A1 |
The present invention discloses a zwitterionic liquid silane coupling agent, and the preparation and use thereof. According to the present invention, a series of zwitterionic liquid silane coupling agents are prepared by reacting a silox...
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WO/2023/017777A1 |
The purpose of the present invention is to provide a (meth)acrylic adhesive composition, a laminate, and a tire, in each case for which the vulcanized rubber-to-vulcanized rubber adhesiveness is excellent. The present invention is a two-...
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WO/2023/013128A1 |
Provided is a composition that becomes cured objects which have flexibility enough to be films and which have high adhesiveness to low-roughness copper foils, are low in permittivity and dielectric dissipation factor, and have a high gla...
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WO/2023/013399A1 |
The present invention provides an adhesive composition with which it is possible to form an adhesive having both a high refractive index and low elastic modulus. Provided is an adhesive composition including an acrylic polymer and a plas...
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WO/2023/013651A1 |
A bonding method for bonding an adherend (120) with an adhesive (11) for high-frequency dielectric heating, the bonding method comprising a placement step in which the electrodes of a dielectric heater (50), the adherend (120), and a spa...
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WO/2023/013678A1 |
The present invention addresses the problem of developing a binder or an adhesive having superior easy-disassembly properties or decomposition properties while having sufficient adhesiveness prior to being heated. The above problem is ...
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WO/2023/013701A1 |
An adhesive skin patch material having good adhesive properties (adhesive strength, water-resistant adhesiveness, etc.) even in the presence of water such as bathing, perspiring, etc., in addition to practical initial adhesive properties...
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WO/2023/007982A1 |
The present invention provides: a novel phosphorus compound having an isocyanurate ring; a synthetic method for said phosphorus compound; a flame retardant containing said phosphorus compound; and a resin composition containing said phos...
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WO/2023/008747A1 |
The present invention relates to an adhesive sheet and, more specifically, to an adhesive sheet comprising a substrate film having a predetermined range of water contact angle and an adhesive layer disposed on the substrate film. The pre...
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WO/2023/005396A1 |
Disclosed in the present application are chip packaging underfill and a chip packaging structure. The underfill comprises 19-25% by mass of epoxy resin, 55-60% by mass of a filler, 15-25% by mass of a curing agent, and 0.5-0.8% by mass o...
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WO/2023/008175A1 |
The purpose of the present invention is to provide a two-pack type curable adhesive composition which can attain both high fatigue resistance and high damping properties. The two-pack type curable adhesive composition comprises a main in...
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WO/2023/008542A1 |
The present invention aims to provide a curable resin composition that has excellent curing characteristics and a high refractive index for cured products. In addition, the present invention aims to provide a sealant for display elements...
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WO/2023/008961A1 |
The present invention relates to a shatterproof heat shield sheet and, more specifically, to a shatterproof heat shield sheet which is disposed between a display panel substrate and an outermost display cover window to prevent display pa...
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WO/2023/002970A1 |
Provided is a curable adhesive composition comprising a binder resin (A) having a reactive functional group, a poly(phenylene ether) resin (B) having a vinyl group and a number-average molecular weight of 1,500 or higher but lower than 5...
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WO/2023/003071A1 |
A packaging container having antibacterial and antiseptic effects, according to the present invention, comprises a natural antibacterial material, wherein the natural antibacterial material is not mixed with a normal polymer resin but ra...
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WO/2023/002830A1 |
The present invention provides a polarizing plate in which it is possible to suppress a decrease in transmittance in high temperature environments. This polarizing plate has: a polarization element in which a dichroic pigment is adsorbed...
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WO/2023/288259A1 |
The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range. The invention features a ...
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WO/2023/286701A1 |
The present invention addresses the problem of providing a curable resin composition which exhibits high curability even when subjected only to a heat-curing treatment and comes to have moderate flexibility and stretchability through a U...
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WO/2023/284252A1 |
A tunnel fiber composite resin pavement structure. The tunnel fiber composite resin pavement structure comprises, sequentially from bottom to top: a concrete slab (1); a toughened epoxy resin waterproof bonding layer (2); a polyurethane ...
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WO/2023/286389A1 |
Problem: To provide a thermoconductive film-like adhesive agent that can sufficiently cause progression of a curing reaction under a milder condition, that can, when being used as a die-attach film, effectively suppress residual voids be...
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WO/2023/288260A1 |
The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range. The invention features a ...
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WO/2023/286699A1 |
The present invention addresses the problem of providing a UV-curable resin composition that provides a flexible cured product having a lower crosslinking density than conventional cured products. The present invention comprises the foll...
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WO/2023/286576A1 |
The present invention aims to provide a novel polarizing plate that: has an adhesive layer formed from an adhesive that has sufficient pot life during production; and suppresses reduction in transmittance when exposed to high-temperature...
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WO/2023/286681A1 |
A tape laminate is provided which, when used to seal a flow path, enables suppressing gas leakage and contamination while not being prone to peeling due to gas generation. This tape laminate 1 is provided with: a first substrate 2; a f...
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WO/2023/286491A1 |
The purpose of the present invention is to provide a method for producing a polarizing plate, the method being capable of improving the water resistance of an adhesive layer that is arranged between a polarizing element and a protective ...
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WO/2023/286620A1 |
Provided is a pressure-sensitive adhesive sheet which has satisfactory conformability to the surface contours of adherends and which, when used for encapsulating a semiconductor chip with a resin on the pressure-sensitive adhesive layer,...
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WO/2023/286700A1 |
The present invention addresses the problem of providing a UV/heat-curing type curable resin composition which exhibits sufficiently high adhesion strength even after having only undergone either a UV-curing treatment or a heat-curing tr...
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WO/2023/286757A1 |
The present invention addresses the problem of providing an adhesive agent composition having excellent nanocellulose dispersing ability. Said problem can be solved by an adhesive agent composition containing nanocellulose and a resin th...
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WO/2023/286621A1 |
Provided is a pressure-sensitive adhesive sheet having excellent removability from adherends. The pressure-sensitive adhesive sheet comprises a substrate and a pressure-sensitive adhesive layer disposed on at least one side of the substr...
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WO/2023/286644A1 |
This adhesive comprises a polyurethane resin (A), an epoxy resin (B), and an isocyanate crosslinking agent, wherein the epoxy resin (B) comprises a hydroxyl group-containing epoxy resin which has a hydroxyl group and has an epoxy equival...
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WO/2023/286619A1 |
The present invention provides an adhesive sheet having a satisfactory balance of reduced adhesive residue when peeling and excellent conformability to the surface shape of an adherend. Provided is an adhesive sheet comprising a base mat...
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WO/2023/282008A1 |
The present invention provides a double-sided adhesive sheet that has excellent impact resistance and excellent reworkability. A double-sided adhesive sheet 1 comprises an adhesive layer 2. The thickness of the double-sided adhesive sh...
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WO/2023/282217A1 |
Provided is an adhesive tape having high adhesive strength with respect to olefinic materials at high temperature and having holding power at high temperature, these features being difficult to achieve with adhesive tapes using conventio...
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WO/2023/282011A1 |
Provided is a double-sided pressure-sensitive adhesive sheet which includes a colored pressure-sensitive adhesive layer and which exhibits excellent impact resistance and excellent processability. A double-sided pressure-sensitive adhe...
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WO/2023/282219A1 |
Provided is a pressure-sensitive adhesive tape having high adhesive force in application to olefin-based materials and satisfactory pressure-sensitive adhesive properties at high temperatures. The pressure-sensitive adhesive tape include...
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WO/2023/281996A1 |
The present invention addresses the problem of providing an adhesive tape for wafer processing that combines tensile stress and uniform expandability suitable for a step of dividing an adhesive layer by expansion, and high shrinkability ...
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WO/2023/281906A1 |
Provided is a heat-curable adhesive sheet which includes a release liner that is adherent to the adhesive surface and that, when peeled from the adhesive surface, is easy to peel off and which has excellent handleability and is less apt ...
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WO/2023/282007A1 |
Provided is a double-sided adhesive sheet having excellent impact resistance and reworkability. A double-sided adhesive sheet 1 comprises an adhesive layer 2 and has a thickness of at most 500 μm. The adhesive layer 2 is an acrylic ad...
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WO/2023/282218A1 |
Provided is an adhesive tape having strong adhesive force and holding power at high temperatures, as well as high tackiness. According to the present invention, provided is an adhesive tape comprising an adhesive layer containing an adhe...
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WO/2023/282318A1 |
[Problem] To provide an adhesive composition which has high adhesiveness to not only conventional polyimides and liquid-crystal polymers but also metal substrates, can attain high soldering heat resistance, and is excellent in terms of l...
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WO/2023/276331A1 |
Provided is an adhesive composition including a copolymer (A) and a curing agent (B), the copolymer (A) being formed from a monomer mixture containing an alkyl (meth)acrylate (a1) that has a C4-12 alkyl group, a (meth)acrylate (a2) that ...
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WO/2023/277445A1 |
An adhesive tape cutter, according to the present invention, comprises: a body having side surface portions on the respective sides thereof and a seating groove formed between the side surface portions; a cutting blade provided on one en...
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WO/2023/276773A1 |
The present invention addresses the problem of providing a resin composition and an adhesive that have a high moisture resistance after heat curing. The present invention provides a resin composition including (A) a (meth)acrylate compou...
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WO/2023/276944A1 |
Provided is a pressure-sensitive adhesive composition which can give cured objects inhibited from changing in gel content even under high-temperature high-humidity conditions. This pressure-sensitive adhesive composition comprises a uret...
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