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Matches 451 - 500 out of 28,390

Document Document Title
WO/2023/032979A1
Provided is a solventless two-part curing-type adhesive which has excellent initial cohesive power and for which a decrease in the cohesive power over time is prevented. The two-part curing-type adhesive contains: an isocyanate composi...  
WO/2023/033075A1
Provided is an adhesive composition having both high adhesive strength and improved cohesive failure rate. An adhesive composition that includes a thermosetting resin (component (A)), a toughening agent (component (B)), a curing agent ...  
WO/2023/033064A1
Provided is a refractive index adjustment agent for adjusting the refractive index of adhesives, wherein this refractive index adjustment agent for adhesives is an organic compound comprising a structure having at least two substituents ...  
WO/2023/032790A1
Provided is an adhesive sheet that has excellent flexibility at low temperatures and also has excellent resilience. According to the present invention, an adhesive sheet is formed from an adhesive composition [I] that contains an acryl...  
WO/2023/032700A1
The present disclosure provides a curable composition that contains an -ene compound and a thiol compound, a resulting cured product of which can be highly flexible, and is less likely to lose preservation stability. A curable compositio...  
WO/2023/033074A1
The present invention provides an adhesive composition which has achieved a good balance between high bonding strength and improvement of cohesive failure ratio. The present invention provides an adhesive composition which contains a t...  
WO/2023/032685A1
The present invention provides an antireflection film with a pressure-sensitive adhesive sheet, the antireflection film being suitable for use in organic EL display devices (OLEDs). This antireflection film 10 with a pressure-sensitive a...  
WO/2023/033076A1
Provided is an adhesive composition having both a high adhesion strength and an improved cohesive failure rate. The adhesive composition comprises a heat-curable resin [referred to as component (A)], thermoplastic-resin particles [refe...  
WO/2023/032690A1
Provided are: a two-component curable adhesive exhibiting excellent adhesion to a metal foil or a metal deposition layer; and a laminate and a packaging material that are obtained by using said adhesive. The present invention provides ...  
WO/2023/032888A1
The present invention addresses the problem of providing an adhesive which exhibits adhesive properties and heat resistance and is capable of transferring/mounting a large number of semiconductor elements all at once even in a step in wh...  
WO/2023/032782A1
A multilayer body which comprises a semiconductor substrate, a supporting substrate and a bonding layer that is provided between the semiconductor substrate and the supporting substrate, wherein: the bonding layer is formed of a cured pr...  
WO/2023/030317A1
The present invention relates to the technical field of polyurethane, and to a low-viscosity reactive flame-retardant polyether polyol, and a preparation method therefor and an application thereof. In the present invention, low-molecular...  
WO/2023/032795A1
The present invention provides an adhesive composition suited for use in an organic EL display device (OLED). The provided adhesive composition (I) includes a (meth)acrylic polymer (A) as a principal component thereof, and also includes ...  
WO/2023/032135A1
The purpose of the present invention is to provide a heat-removable pressure-sensitive adhesive tape which is suitable for use in high-temperature heating steps and, when heated at a higher temperature after use in a heating step, can be...  
WO/2023/027563A1
Various embodiments of the present disclosure relate to an electronic device including a ceramic resin composite frame. Various embodiments of the present disclosure may provide an electronic device including a ceramic structure, the ele...  
WO/2023/023966A1
A UV adhesive for packaging, and a preparation therefor. The UV adhesive for packaging at least comprises, in percentages by weight: 5%-26% of a modified bisphenol A epoxy resin, 16%-42% of an acrylate prepolymer and 6%-10% of inorganic ...  
WO/2023/024267A1
The present invention provides a bridging agent, a composition, a masterbatch, a packaging film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1 xR2 y[CH3SiO]n, wher...  
WO/2023/026872A1
A problem addressed by the present invention is to provide a resin composition, an adhesive, or a sealing material that gives a cured product having reworkability at a specific temperature that does not have a thermal effect on parts. Th...  
WO/2023/026687A1
Provided are: an adhesive composition that has a low resistance and excellent reworkability, and can inhibit the occurrence of dents; and a polarizing plate using the adhesive composition. The adhesive composition according to an embodim...  
WO/2023/026586A1
This adhesive comprises: a first agent containing gelatin, a gelatin derivative in which a hydrophobic group is bonded to the gelatin via an imino group and that is represented by formula 1: GltnNH-R1, and cyclodextrin, the gelatin havin...  
WO/2023/019766A1
The present invention relates to the technical field of artificial turf, and specifically relates to a non-contact type permanent antibacterial artificial turf and a manufacturing process thereof. The artificial turf comprises a back adh...  
WO/2023/022541A1
The present invention relates to a graft copolymer, and more particularly, to: a core-shell graft copolymer comprising a core containing a rubber polymer, and a shell formed by graft-polymerizing the rubber polymer with a graft monomer, ...  
WO/2023/023205A1
A power transmission belt having a belt body, a tensile cord embedded in the belt body, and a jacket defining a pulley contact surface, where the jacket has been treated on at least the pulley contact surface with an aqueous fabric treat...  
WO/2023/021773A1
Provided is a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer which can be formed with low heat energy and can exhibit excellent adhesive force. This pressure-sensitive adhesive sheet comprises a substra...  
WO/2023/022094A1
A curable adhesive composition for use in bonding wiring members as a component of a multilayered wiring board. The curable adhesive composition gives a cured object which, when the thermal expansion coefficient and glass transition temp...  
WO/2023/020226A1
The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silico...  
WO/2023/017787A1
[Problem] To achieve an anaerobic adhesive composition with which the occurrence of coating failures during application can be suppressed. [Solution] This anaerobic adhesive composition contains a (meth)acrylic monomer, an organic peroxi...  
WO/2023/017788A1
[Problem] To provide an anaerobic adhesive composition containing a novel component that functions as an anaerobic curing accelerator in the anaerobic adhesive composition. [Solution] This anaerobic adhesive composition contains a (meth)...  
WO/2023/017752A1
The present invention addresses the problem of providing a resin composition and an adhesive that are highly curable and have a high photocuring adhesive strength with UV light having a longer wavelength (for example, 405 nm) and that ar...  
WO/2023/015797A1
The present invention discloses a zwitterionic liquid silane coupling agent, and the preparation and use thereof. According to the present invention, a series of zwitterionic liquid silane coupling agents are prepared by reacting a silox...  
WO/2023/017777A1
The purpose of the present invention is to provide a (meth)acrylic adhesive composition, a laminate, and a tire, in each case for which the vulcanized rubber-to-vulcanized rubber adhesiveness is excellent. The present invention is a two-...  
WO/2023/013128A1
Provided is a composition that becomes cured objects which have flexibility enough to be films and which have high adhesiveness to low-roughness copper foils, are low in permittivity and dielectric dissipation factor, and have a high gla...  
WO/2023/013399A1
The present invention provides an adhesive composition with which it is possible to form an adhesive having both a high refractive index and low elastic modulus. Provided is an adhesive composition including an acrylic polymer and a plas...  
WO/2023/013651A1
A bonding method for bonding an adherend (120) with an adhesive (11) for high-frequency dielectric heating, the bonding method comprising a placement step in which the electrodes of a dielectric heater (50), the adherend (120), and a spa...  
WO/2023/013678A1
The present invention addresses the problem of developing a binder or an adhesive having superior easy-disassembly properties or decomposition properties while having sufficient adhesiveness prior to being heated. The above problem is ...  
WO/2023/013701A1
An adhesive skin patch material having good adhesive properties (adhesive strength, water-resistant adhesiveness, etc.) even in the presence of water such as bathing, perspiring, etc., in addition to practical initial adhesive properties...  
WO/2023/007982A1
The present invention provides: a novel phosphorus compound having an isocyanurate ring; a synthetic method for said phosphorus compound; a flame retardant containing said phosphorus compound; and a resin composition containing said phos...  
WO/2023/008747A1
The present invention relates to an adhesive sheet and, more specifically, to an adhesive sheet comprising a substrate film having a predetermined range of water contact angle and an adhesive layer disposed on the substrate film. The pre...  
WO/2023/005396A1
Disclosed in the present application are chip packaging underfill and a chip packaging structure. The underfill comprises 19-25% by mass of epoxy resin, 55-60% by mass of a filler, 15-25% by mass of a curing agent, and 0.5-0.8% by mass o...  
WO/2023/008175A1
The purpose of the present invention is to provide a two-pack type curable adhesive composition which can attain both high fatigue resistance and high damping properties. The two-pack type curable adhesive composition comprises a main in...  
WO/2023/008542A1
The present invention aims to provide a curable resin composition that has excellent curing characteristics and a high refractive index for cured products. In addition, the present invention aims to provide a sealant for display elements...  
WO/2023/008961A1
The present invention relates to a shatterproof heat shield sheet and, more specifically, to a shatterproof heat shield sheet which is disposed between a display panel substrate and an outermost display cover window to prevent display pa...  
WO/2023/002970A1
Provided is a curable adhesive composition comprising a binder resin (A) having a reactive functional group, a poly(phenylene ether) resin (B) having a vinyl group and a number-average molecular weight of 1,500 or higher but lower than 5...  
WO/2023/003071A1
A packaging container having antibacterial and antiseptic effects, according to the present invention, comprises a natural antibacterial material, wherein the natural antibacterial material is not mixed with a normal polymer resin but ra...  
WO/2023/002830A1
The present invention provides a polarizing plate in which it is possible to suppress a decrease in transmittance in high temperature environments. This polarizing plate has: a polarization element in which a dichroic pigment is adsorbed...  
WO/2023/288259A1
The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range. The invention features a ...  
WO/2023/286701A1
The present invention addresses the problem of providing a curable resin composition which exhibits high curability even when subjected only to a heat-curing treatment and comes to have moderate flexibility and stretchability through a U...  
WO/2023/284252A1
A tunnel fiber composite resin pavement structure. The tunnel fiber composite resin pavement structure comprises, sequentially from bottom to top: a concrete slab (1); a toughened epoxy resin waterproof bonding layer (2); a polyurethane ...  
WO/2023/286389A1
Problem: To provide a thermoconductive film-like adhesive agent that can sufficiently cause progression of a curing reaction under a milder condition, that can, when being used as a die-attach film, effectively suppress residual voids be...  
WO/2023/288260A1
The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range. The invention features a ...  

Matches 451 - 500 out of 28,390