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WO/2015/158860A1 |
The invention relates to a composition comprising at least one polymer that contains silane groups and at least one catalyst of formula (I), said catalyst having specific amidine groups or guanidine groups. The composition is low in emis...
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WO/2015/158257A1 |
A high-adhesive one-component deoximation type room-temperature vulcanized silicone rubber sealant comprises the following components (A) to (F) in parts by weight: 100 parts of modified α,ω-dihydroxylpolydimethylsiloxane (A), 10 to 30...
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WO/2015/158862A1 |
The invention relates to a composition, comprising a) at least one silane-functional polymer; and b) at least one carbodimide and/or at least one guanidine, which is an adduct of the carbodiimide and an amino silane. The composition is i...
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WO/2015/158863A1 |
The invention relates to a composition comprising at least one organic polymer that contains silane groups and at least one catalyst of formula (I). The composition is low in emissions and low-odour, has a good shelf-life, cures rapidly ...
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WO/2015/158624A1 |
The invention relates to cross-linkable masses containing A) 100 parts by weight of compounds of formula (I): Y-[(CR1 2)3-SiRa(OR2)3-a]b; B) at least 5 parts by weight of silicon resins containing units of formula (II): R3 c(R4O)dR5 eSiO...
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WO/2015/155950A1 |
Provided are: a curable organopolysiloxane composition which exhibits an excellent improving effect on initial adhesive properties with respect to a variety of base materials, and which, when cured, achieves particularly excellent adhesi...
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WO/2015/155949A1 |
Provided are: an adhesion promoter that has an excellent initial adhesion improvement effect with respect to a variety of substrates, that has particularly excellent adhesion durability after curing, and that makes it possible to achieve...
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WO/2015/151221A1 |
A double-sided pressure-sensitive adhesive sheet (1) used to adhere a first hard object (4) and a second hard object (5) together. Said double-sided pressure-sensitive adhesive sheet (1) has a first pressure-sensitive adhesive surface (1...
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WO/2015/151222A1 |
A double-sided pressure-sensitive adhesive sheet (1) used to adhere a first hard object (4) and a second hard object (5) together. Said double-sided pressure-sensitive adhesive sheet (1) has a first pressure-sensitive adhesive surface (1...
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WO/2015/151352A1 |
Provided are: an adhesive composition which has excellent weather resistance and contains, as a base material, a silicone polymer having excellent curability; and an adhesive sheet. An adhesive composition which contains an addition-cura...
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WO/2015/143592A1 |
Provided is a method for preparing an MT resin, comprising the following steps: a first step: adding anhydrous toluene, anhydrous ethanol and an alkoxyl silane into a reaction vessel, and then adding acetic acid dropwise into the reactio...
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WO/2015/148318A1 |
Compositions, particularly photocurable compositions that can cure upon irradiation, cured compositions, and methods of making such cured compositions, wherein the photocurable compositions include a polydiorganosiloxane having vinyl fun...
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WO/2015/143591A1 |
Provided is a transparent organic silicone gel binder. The transparent organic silicone gel binder is prepared by mixing components A and B in a mass ratio of 1 : 1, wherein the component A consists of the following materials: 60 - 95 pa...
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WO/2015/148255A1 |
A copolymer composition is provided that is formed as the reaction product of (I) a cured polyorganosiloxane intermediate having repeating Si-O-Si units and at least one Si-OH functional group and (II) a polyfluoropolyether silane. The c...
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WO/2015/141294A1 |
This temperature sensitive adhesive includes a side chain crystalline polymer obtained by polymerizing (meth)acrylate having a straight chain alkyl group with at least 16 carbon atoms, and adhesion of the temperature sensitive adhesive d...
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WO/2015/141156A1 |
The present invention is a temporary bonding material for wafer processing, which is used for the purpose of temporarily bonding a wafer having a front surface serving as a circuit surface and a back surface to be processed to a supporti...
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WO/2015/132975A1 |
An adhesive scattering prevention sheet (1) which is bonded to at least one surface of a cover glass that is used for a capacitive touch panel. This adhesive scattering prevention sheet (1) is provided with a base (11), a hard coat layer...
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WO/2015/133840A2 |
The present invention relates to a novel epoxy compound having a spacer between a core and an alkoxysilyl group, a method for preparing the same, a composition comprising the same, a cured product, and a use thereof. The epoxy compound e...
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WO/2015/129312A1 |
Provided is an aqueous composition, characterized in comprising an epoxy group-containing alkoxy silane, an epoxy group-free alkoxy silane, inorganic particles having an average particle diameter of 60 to 350 nm, and a metal complex, whe...
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WO/2015/128496A1 |
The present invention relates to a new synthesis procedure for a family of silica based polymer materials synthesized through the reaction of silicate oligomers with highly reactive silanes. By using this synthesis it is possible to gene...
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WO/2015/125882A1 |
The purpose of the present invention is to provide an adhesive composition for a high-power optical fibre having a low pull-in amount. This adhesive composition for a high-power optical fibre contains: a compound (A) having an aromatic r...
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WO/2015/125879A1 |
The purpose of the present invention is to provide an adhesive composition for a polarisation-maintaining optical fibre exhibiting a high extinction ratio. This adhesive composition for a polarisation-maintaining optical fibre contains: ...
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WO/2015/127179A1 |
Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for t...
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WO/2015/122112A1 |
The composition according to the present invention is a silicone pressure sensitive adhesive composition comprising 100 parts by weight of a peroxide-curable silicone resin, 1.2 - 3.2 parts by weight of an organic peroxide curing agent, ...
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WO/2015/119210A1 |
Provided is a glass laminate wherein a glass substrate is able to be easily separated even after a high-temperature heat treatment, and wherein decomposition of a silicone resin layer is suppressed. A glass laminate which is provided wit...
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WO/2015/115212A1 |
Provided is an adhesive agent composition which can adhere a metal to a metal, a metal to an organic material or an organic material to an organic material, has excellent storage stability, and can keep the adhesion strength thereof at a...
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WO/2015/115060A1 |
The present invention is a wafer workpiece in which a provisional adhesive material layer is formed upon a support body and a wafer, which has a circuit face on the obverse face and is to be worked on the reverse face, is stacked upon th...
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WO/2015/096570A1 |
The present invention relates to a curable silicon rubber composition for LED packaging, a preparation method therefor and a use thereof. The composition particularly comprises at least one tackifier component D which contains: a) an iso...
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WO/2015/098949A1 |
This film for temporary fixing is used in a processing method for a semiconductor wafer, said method comprising: a temporary fixing step wherein a semiconductor wafer is temporarily fixed to a supporting body with this film for temporary...
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WO/2015/100198A1 |
A moisture curable composition comprising (A) a polymer containing reactive hydroxyl or hydrolysable groups bonded to silicon which groups are reactive in the presence of moisture; (B) a crosslinking agent comprising at least two and pre...
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WO/2015/098118A1 |
To provide a room-temperature-curable silicone rubber which exhibits good adhesion to a substrate contacted during curing and can be efficiently peeled. The problem is solved by a room-temperature-curable silicone rubber composition comp...
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WO/2015/098119A1 |
To provide a room-temperature-curable silicone rubber composition exhibiting good adhesion to a substrate contacted during curing and capable of suppressing the occurrence of oil bleeding. The problem is solved by a room-temperature-cura...
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WO/2015/093127A1 |
An adhesive composition for medical devices, comprising: at least one type of epoxy resin (A) selected from a group comprising a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a phenol novolak epoxy resin; and a modified silicon...
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WO/2015/093329A1 |
A silicone adhesive film obtained by hydrosilylation, the B-stage, of a silicone composition comprising at least (A) an organopolysiloxane having a phenyl group and an alkenyl group, (B) an arbitrary diorganopolysiloxane having a phenyl ...
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WO/2015/094521A1 |
A method of adhering a first structure to a second structure using a primer, containing a primer fugitive inhibitor, and a film adhesive by removing the primer fugitive inhibitor under vacuum at room temperature conditions.
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WO/2015/093139A1 |
Provided is a multicomponent room temperature-curable organopolysiloxane composition capable of providing a cured product having excellent rapid-curing properties, excellent storage stability, and excellent durability. The room temperatu...
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WO/2015/087686A1 |
The purpose of the present invention is to provide a polyorganosilsesquioxane which can be cured into a cured article having high surface hardness and heat resistance and also having excellent flexibility and processability. The present ...
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WO/2015/081698A1 |
The present invention relates to an antistatic pressure-sensitive adhesive protection film, comprising a substrate and a pressure-sensitive adhesive layer applied on the substrate and having an antistatic function, the antistatic functio...
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WO/2015/080188A1 |
Provided is a semiconductor-processing pressure-sensitive adhesive tape provided with strong adhesion necessary when physical/mechanical peeling of a support member is to be performed, in which even if a washing fluid for washing away ad...
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WO/2015/079904A1 |
Provided is an adhesive sheet for temporary fixing use, which cannot come off or cannot be detached even when an electronic material on a thin film is fixed temporarily onto a hard substrate using the adhesive tape and then the resultant...
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WO/2015/079903A1 |
Provided is a surface-protecting adhesive sheet which can be easily bonded to the surface of an electronic device with little need for external force, and which can be easily re-bonded. This surface-protecting adhesive sheet is provided ...
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WO/2015/079902A1 |
Provided are: a double-sided adhesive sheet which can exhibit good peeling properties under a constant load even when an adhesive layer therein has relatively high coagulation power; and a double-sided adhesive sheet production method wh...
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WO/2015/074877A1 |
An optoelectronic component (1) is provided. This component comprises a sequence of layers (4) with an active layer, which emits primary electromagnetic radiation, and a converter platelet (3), which is arranged in the path of rays of th...
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WO/2015/074611A1 |
The present invention relates to the technical field of protective film, especially to a protective film having high transparency and impact resistance, and a preparation method therefor. The protective film comprises a main film layer. ...
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WO/2015/072092A1 |
This silicone adhesive is used for bonding semiconductor elements, and comprises: (A) an addition-reaction-curable silicone resin composition having a viscosity at 25°C of less than or equal to 100 Pa·s; (B) a thermally conductive fill...
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WO/2015/072418A1 |
The purpose of the present invention is to provide an adhesive composition using a silicone polymer compound, which does not require exposure, baking and development processes for the production, thereby making the production cost low an...
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WO/2015/068633A1 |
This silicone adhesive sheet, which has ultraviolet ray shielding properties and is for sealing a solar cell, and which forms a silicone adhesive layer contacting a back surface panel in a solar cell module provided with a light-receivin...
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WO/2015/052859A1 |
The present invention is a room temperature curing resin composition which comprises a phosphazene backbone-containing organic silicon compound represented by general formula (1). Accordingly, a room temperature curing resin is provided ...
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WO/2015/050251A1 |
The present invention relates to a cured product of a curable polyorganosiloxane composition which comprises (A) an alkenyl-group-containing polyorganosiloxane containing at least two alkenyl groups in the molecule, (B) a polyorganohydro...
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WO/2015/048109A1 |
Silicone-polyether copolymers, adhesives and medical articles comprising same, and methods of making same. The silicone-polyether copolymer composition can include a backbone composition having a first (silicone) segment and a second (po...
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