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WO/2015/046254A1 |
The purpose of the present invention is to provide: a heat-conductive adhesive sheet which can be stacked easily and without interposing an adhesive layer in an electronic device, and, additionally, can selectively radiate heat in a spec...
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WO/2015/046253A1 |
The purpose of the present invention is to provide: a heat-conductive adhesive sheet which is stacked in an electronic device so as to efficiently radiate heat, and which can selectively radiate heat in a specific direction, as well as i...
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WO/2015/041340A1 |
The present invention is: a silane compound copolymer represented by formula (a-1) [In the formula, R1 represents a hydrogen atom or a C1-6 alkyl group; X0 represents a sulfur atom-containing functional group; D represents a C1-20 bivale...
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WO/2015/041343A1 |
The present invention is: a curable composition containing component (A) and component (B) at a ratio of 100:0.1 to 100:70 (component (A): component (B)) in terms of the mass ratio of component (A) and component (B); a cured product obta...
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WO/2015/041342A1 |
The present invention is: a curable composition characterized by containing component (A) and component (B) at a weight ratio that is the fraction [component (A): component (B)] = 100:0.1 to 100:50; a curing product resulting from curing...
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WO/2015/041344A1 |
The present invention provides the following: a curable composition that is characterized by containing component (A) and component (B), with the mass ratio of component (A) and component (B) being such that [component (A) : component (B...
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WO/2015/041339A1 |
The present invention relates to: a curable composition comprising the following components (A) and (B) at a mass ratio between said component (A) and said component (B) (component (A):component (B)) of from 100:0.3 to 100:8; a cured pro...
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WO/2015/030116A1 |
Provided is a polyene-polythiol composition having excellent storage stability. The composition comprises: (A) a silsesquioxane derivative having at least two carbon-carbon unsaturated bonds per molecule and having a random structure; (B...
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WO/2015/017985A1 |
This invention provided an aqueous coating composition for metal surface pre-treatment comprising: (i) at least one organosilane with at least one hydrolyzable substituent; (ii) at least one water soluble and/or water dispersible silane-...
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WO/2015/016010A1 |
[Problem] In durability tests of a moisture-curing composition, it is difficult to both suppress foaming inside of the cured product and to stably maintain the physical properties of the cured products. [Solution] This moisture-curing co...
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WO/2015/017751A1 |
Disclosed is a masking article such as a masking tape, roll of masking tape, masking sheet, etc. that has a substrate or backing with a primer layer on a first major surface thereof and a pressure-sensitive silicone adhesive layer on the...
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WO/2015/008709A1 |
Provided is a rapid-curing photocurable composition having excellent processability and being capable of photocuring in a short period of time even with low cumulative luminous energy. The composition contains (A) a cross-linking silicon...
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WO/2015/003875A1 |
The invention relates to moisture-curing compositions having increased storage stability, said compositions being based on silyl group-carrying compounds, and to the use thereof.
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WO/2015/000150A1 |
A debondable adhesive composition comprises (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7- tetramethylcyclotetra-siloxane and the terminal Si-H hydrogens on a silane or silo...
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WO/2014/208724A1 |
This invention provides a polarization conversion element that is highly resistant to the heat and light that result from increased brightness levels. In said polarization conversion element, inorganic half-wave plates provided selective...
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WO/2014/208725A1 |
This invention provides a polarization conversion element that is highly resistant to the heat and light that result from increased brightness levels. In said polarization conversion element, which is provided with a polarizing beam-spli...
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WO/2014/200100A1 |
The present invention provides an adhesive composition having excellent adhesive strength. This adhesive composition is characterized by containing 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group, 1-20 parts b...
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WO/2014/199993A1 |
Provided is a heat-resistant adhesive sheet for semiconductor inspection that makes deformation of the adhesive sheet due to heating less likely to occur. This heat-resistant adhesive sheet for semiconductor inspection is used in a step ...
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WO/2014/196347A1 |
Provided is a thermally conductive composite sheet affixed to the rear side of the back surface of a portable electronic terminal known as an Ultrabook, a tablet PC, or a smartphone, and provided so that a given air gap is present with r...
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WO/2014/185296A1 |
A thermally conductive silicone adhesive composition for a reactor, having good fluidity even when containing a large amount of thermally conductive filler to obtain a thermally conductive silicone adhesive composition, permitting pottin...
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WO/2014/185276A1 |
Provided are: an aluminium chelate compound which is useful as a curing catalyst for a room-temperature-curable resin; and a room-temperature-curable resin composition including said compound. Provided is an aluminium chelate compound pr...
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WO/2014/183236A1 |
The present invention provides a single-component high-refractivity LED packaging adhesive. The adhesive is prepared by using the following raw materials in parts by weight: 50 to 80 parts of phenyl polysiloxane with vinyl, 25 to 40 part...
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WO/2014/181610A1 |
Provided are: a dam material composition that, in addition to the cured material thereof having adhesiveness to an adherend and appropriate hardness as a dam material, preferably enables the determination of joints to be difficult; and a...
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WO/2014/181609A1 |
Provided are: a dam material composition that, in addition to the cured material thereof having adhesiveness to an adherend and appropriate hardness as a dam material, preferably enables the determination of joints to be difficult; and a...
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WO/2014/171503A1 |
A substrate (11) as a glass laminate comprises, laminated in order therein, a resin layer (21), an adhesive layer (22), a thin-film glass (23), an adhesive layer (24), and a polarizing layer (25). The resin layers (21, 24) include a co-c...
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WO/2014/171075A1 |
This adhesive composition contains: 100 mass parts of a polymer (A) having a glass transition temperature of less than 0°C; and 0.1 to 20 mass parts of a polymer (B) containing, as monomer units, a monomer having a polyorganosiloxane sk...
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WO/2014/167898A1 |
Provided is a solvent-free silicone adhesive agent composition comprising: (A) an organopolysiloxane which has at least two alkenyl-group-containing organic group per molecule in an amount of 40 to 95 parts by mass; (B) an organopolysilo...
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WO/2014/163188A1 |
To provide a method for manufacturing a semiconductor device, which uses a method for bonding a supporting substrate to a semiconductor wafer, said method being applicable to a high-temperature process at around 1,000°C. A method for ma...
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WO/2014/163327A1 |
The present invention relates to an acrylic adhesive composition, and more specifically, to an acrylic adhesive composition comprising a silane compound having a specific structure, thereby having superior adhesive durability in extreme ...
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WO/2014/075879A9 |
The present invention relates to a product formulation based on silicone elastomer compounds for temporarily bonding a workpiece to be abraded or polished to a carrier substrate, wherein the silicone elastomer compound can be abraded or ...
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WO/2014/160067A1 |
Provided in various embodiments are silicone-based storage stable temporary bonding adhesive compositions. The storage stable TBA compositions are formed by combining (e.g., mixing or blending) an alkenyl functional siloxane polymer, an ...
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WO/2014/150302A1 |
A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu-Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu-Ag ...
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WO/2014/151464A1 |
Provided in various embodiments are film-forming agents formed by mixing or blending silicone pressure sensitive adhesives and silicone acrylic copolymers in generally desired ratio ranges. The resulting film-forming agents demonstrate u...
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WO/2014/143728A1 |
Cosmetic compositions are disclosed comprising: i) a silicone resin emulsion comprising; A) 0.5 wt % to 95 wt % of a silicone resin or pressure sensitive adhesive (PSA), B) 0.1 to 90 wt % of a ethylene oxide/propylene oxide block copolym...
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WO/2014/143757A1 |
The present invention describes personal care compositions useful for preparing hair care and skin care compositions. The pesonal care compositions comprise: i) a silicone resin emulsion comprising; A) 0.5 wt % to 95 wt % of a silicone r...
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WO/2014/141502A1 |
The purpose of the present invention is to provide an adhesive tape that provides excellent appearance in the case where the adhesive tape is used between a windshield and a cowl top. This adhesive tape includes a film and an adhesive la...
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WO/2014/143627A1 |
A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu-Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu-Ag ...
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WO/2014/135261A1 |
The present invention relates to a catalyst for cross-linking silicone rubber compositions with a lactate-based cross-linking agent. In particular, the present invention provides a composition for producing a silicone rubber composition ...
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WO/2014/133103A1 |
The present invention relates to: a curable composition which contains the components (A), (B) and (C) described below, with the mass ratio of the component (A) to the component (B), namely (component (A)):(component (B)) being from 100:...
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WO/2014/129797A1 |
A phosphor-containing curable silicone composition giving a curable hotmelt film and the curable hotmelt film used for light-emitting semiconductor device are provided. The composition containing the phosphor gives a tack free film at ro...
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WO/2014/129768A1 |
The present invention relates to a transparent flexible hard-coated film and a manufacturing method therefor and, more specifically, to a transparent flexible hard-coated film comprising a scratch-resistant surface and a manufacturing me...
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WO/2014/124382A1 |
An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a rea...
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WO/2014/124362A1 |
A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of...
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WO/2014/124388A1 |
An alkoxy-functional organopolysiloxane resin and polymer is disclosed that comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin comprising R3SiO1/2 units and SiO4/2 units; (ii) an alkoxysilane-functio...
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WO/2014/124364A1 |
A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a...
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WO/2014/124389A1 |
A moisture-curable silicone adhesive composition is provided that comprises (A) a reactive resin, (B) a reactive polymer, (C) a moisture cure catalyst, and (D) a crosslinker resin. The reactive resin (A) comprises the reaction product of...
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WO/2014/124378A1 |
A curable silicone composition is provided that comprises a reaction product of a reaction of (I) a clustered functional polyorganopolysiloxane having at least one radical curable group selected from an acrylate group and a methacrylate ...
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WO/2014/124367A1 |
A method for forming a thermally conductive thermal radical cure silicone composition comprising (I) a clustered functional polyorganopolysiloxane; optionally (II) a silicone reactive diluent, (III) a filler comprising a thermally conduc...
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WO/2014/119930A1 |
The present invention relates to a silicone rubber composition for adhering a semiconductor chip (die) onto an SR-substrate and, more specifically, to a silicone rubber composition for adhering a semiconductor chip (die) which has improv...
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WO/2014/119161A1 |
This sheet for optical semiconductor is provided with: an adhesive layer formed of a first silicone resin; and a non-adhesive layer, which is provided on one surface in the thickness direction of the adhesive layer, and which is formed o...
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