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WO/2015/156193A1 |
A composition which includes: a polythiol compound; a compound having a carbon-carbon double bond at a terminal thereof; a photo radical generator; and a thermal radical generator. The ratio (Ene/SH) of the total number of moles (Ene) of...
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WO/2015/154271A1 |
A bonding system (100) comprises a first substrate (110) having a first contact surface (115) comprising a plurality of protuberances (130), a second substrate (120) having a second contact surface (125), an adhesive (200) in contact wit...
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WO/2015/156946A1 |
The manufacturing of articles relies on the bonding of two or more components to form some forms of the articles, such as a shoe sole bonded with a shoe upper. The bonding may be achieved with an adhesive particulate that is applied to a...
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WO/2015/153612A1 |
Radiation curable adhesives compositions and label assemblies are described which can be used in various labeling systems and methods. The adhesive compositions may be curable by exposure to UV radiation and are incorporated in the label...
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WO/2015/152010A1 |
A protective film that is stuck to a circuit formation surface of a semiconductor wafer, that has a polyimide substrate, and that has a heat-curable adhesive layer that is provided on one surface of the polyimide substrate and that is ob...
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WO/2015/150251A1 |
The invention relates to a method for producing an adhesive bond by means of an adhesive, wherein a composition containing at least a substance reactive in a radical polyreaction and a catalytically active substance is used as the adhesi...
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WO/2015/152212A1 |
The purpose of the present invention is to provide: a remover liquid for removing a cured product of a specific curable composition that exhibits strong adhesion to an object; and a removing method which uses this remover liquid. A remov...
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WO/2015/145408A1 |
An adhesive comprising a solvent free powder of average particle size in the range 20 to 300 preferably 20 to 150 microns is heat activated at a temperature in the range 140°C to 220°C, is flowable at a temperature below the heat activ...
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WO/2015/144863A1 |
The present invention relates to a method for bonding a first body to a second body comprising filing the gap between the facing surfaces of the said first and second bodies with a curable adhesive composition comprising at least one mon...
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WO/2015/140236A1 |
The invention relates to the field of adhesive bonding a sealing film to the base of a structure using a single-component polyurethane adhesive which can be applied, for example, from a pressure container. The invention also relates to a...
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WO/2015/137008A1 |
An electronic component is connected at a low temperature and connection failure of the electronic component is improved by using a photocurable adhesive. An anisotropic conductive adhesive which comprises a binder resin layer supported ...
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WO/2015/136770A1 |
Provided is a method whereby it becomes possible to cure within a short time without putting a thermal load on an adherend, and therefore it becomes possible to produce a cured article having steady quality. A method for curing a resin c...
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WO/2015/133040A1 |
A thermosetting adhesive composition which contains (A) an acrylic rubber, (B) at least one crosslinking agent that is selected from the group consisting of isocyanate crosslinking agents, blocked isocyanate crosslinking agents and amine...
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WO/2015/127179A1 |
Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for t...
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WO/2015/115212A1 |
Provided is an adhesive agent composition which can adhere a metal to a metal, a metal to an organic material or an organic material to an organic material, has excellent storage stability, and can keep the adhesion strength thereof at a...
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WO/2015/114678A1 |
Provided is a method in which an adhesive layer for adhering unvulcanized rubber to an adherence surface of an adherence subject is formed on the adherence surface by using an adhesive sheet and a fixing device. The fixing device has a s...
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WO/2015/113798A1 |
The invention relates to a method and a device for bonding two substrates, wherein an adhesive is applied to a first substrate and a second film-type substrate consisting of a thermoplastic material is converted into a plasticized state ...
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WO/2015/111599A1 |
Provided are a connection body production method and an electronic component connection method such that electronic components are connected at a low temperature using a photo-curing adhesive and poor electronic component connections are...
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WO/2015/112966A1 |
Surface pretreating additive compositions, surface pretreating compositions therefrom, surface adhesion promoting compositions, and paint compositions therefrom including an adhesion promoter system, a surfactant system, a solvent system...
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WO/2015/105854A1 |
Disclosed in certain embodiments is a composition comprising a first material; an adhesive material attached to the first material; a plurality of linker molecules bonded to the adhesive material; and a second material bonded to the link...
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WO/2015/104987A1 |
Disclosed is a film-like conductive adhesive to be used in a semiconductor device manufacturing method that includes: a step for die-bonding, via the film-like conductive adhesive, a semiconductor chip on a body on which the semiconducto...
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WO/2015/094960A1 |
Disposable absorbent articles assembled from a collection of components using an adhesive consisting essentially of an amorphous polyolefin composition comprising more than 40% 1-butene and a second amorphous polymer comprising at least ...
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WO/2015/093916A1 |
The present invention relates to a binder composition and a binding method using the same, and can provide a binding method of a fibrous material using the binder composition. The binder composition according to the present invention lit...
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WO/2015/095480A1 |
A hot melt adhesive material and articles made using the hot melt adhesive to assemble structures in an article. The adhesive material typically is manufactured by blending amorphous polymer with a compatible amorphous polymer.
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WO/2015/094521A1 |
A method of adhering a first structure to a second structure using a primer, containing a primer fugitive inhibitor, and a film adhesive by removing the primer fugitive inhibitor under vacuum at room temperature conditions.
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WO/2015/094959A1 |
A hot melt adhesive material and articles made using the hot melt adhesive to assemble structures in an article. The adhesive material typically is manufactured by blending amorphous polymer with a compatible amorphous polymer.
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WO/2015/090650A1 |
Disclosed are magnetic particles coated with initiators for free radical polymerization, the production thereof, and the use thereof.
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WO/2015/086778A1 |
The invention relates to a method for treating substrates, comprising applying a composition, which comprises at least one latent alkyl borane and is substantially free of decomplexing agents for the latent alkyl borane, to a substrate (...
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WO/2015/079028A1 |
Disclosed is a method for curing a polymer adhesive composition using microwaves, said method being characterized in that the adhesive composition contains an ionic liquid [A]+ a[B]a-, where [A]+ represents a cation, [B]a- represents an ...
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WO/2015/076235A1 |
Provided is a method for manufacturing an electronic component, which is capable of easily forming a cured adhesive layer with high accuracy. A method for manufacturing a curable film electronic component (1) according to the present inv...
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WO/2015/075040A1 |
The invention relates to a method for connecting a substrate to silicone rubber, wherein the silicone rubber is treated with UV radiation in such a way that bonding between the substrate surface and the silicone rubber surface occurs whe...
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WO/2015/076205A1 |
[Problem] To provide a method for bonding hydrogels to each other with a hydrogel-forming composition interposed between the gel surface to be bonded of one hydrogel and that of the other. [Solution] A method for bonding hydrogels to eac...
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WO/2015/072437A1 |
The present invention addresses the problem of providing a natural adhesive composition that can adequately bond wood elements under comparable conditions as conventional petroleum-based adhesives, and that is capable of improving proble...
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WO/2015/072268A1 |
Provided is a method for manufacturing a polarizing plate including a polarizing film and a first protective film, using a polarizing plate manufacturing device including a film conveyance path which passes through a bonding section and ...
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WO/2015/072205A1 |
A method for producing an optical film which comprises a multilayer structure wherein at least a first film and a second film are bonded with each other with an adhesive layer or bonding agent layer being interposed therebetween, said ad...
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WO/2015/069676A1 |
An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can be used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be ap...
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WO/2015/068659A1 |
Provided is an adhesive agent having excellent heat resistance and adhesion properties. An adhesive agent comprises: a fluorinated polymer having a weight average molecular weight (Mw) of 6 × 103 to 3 × 104 inclusive and having a iodin...
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WO/2015/067178A1 |
The present invention relates to an adhesive and a method for preparing and using same. Disclosed are a metal/fabric adhesive, and a method for preparing and using same, the formulation being: 80-120 g of epoxy resin, 10-30 g of active d...
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WO/2015/065935A1 |
A one-component moisture curing composition expands and cures under ambient conditions without the use of external blowing agents. The one-component moisture cure foam contains (1) a moisture curing polymer, (2) anhydrous molecular sieve...
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WO/2015/061489A1 |
Fluid activatable adhesive compositions and activating fluid(s) for activating the adhesive composition are described herein. The adhesive compositions contain at least two polymers with different hydrophilicities. The hydrophilic polyme...
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WO/2015/055816A1 |
The invention relates to a method (100) for producing a mechanical connection between a first component and a second component, comprising electrophoretically applying (102) a thermoplastic or thermoelastic polymer material at least to a...
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WO/2015/054821A1 |
Provided is a waterborne adhesive composition comprising (i) an aqueous medium; (ii) one or more isocyanate compounds dispersed in said aqueous medium, and (iii) one or more functional silane compounds dispersed in said aqueous medium. A...
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WO/2015/056632A1 |
The purpose of the present invention is to provide a photocurable composition which is suitable for temporary fixing by means of active energy rays in a state bonded to an adherend, which does not release even when processing operations ...
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WO/2015/055717A1 |
The invention relates to a method for pre-treating a surface of a substrate (50), in particular for a subsequent adhesive bonding process, wherein in the method an atmopheric-pressure plasma is generated by means of a discharge between e...
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WO/2015/053304A1 |
This invention provides a method for manufacturing a fuel-cell membrane electrode assembly. Said method makes it easy to handle a polymer electrolyte membrane, prevents deformation and wrinkling of said polymer electrolyte membrane, and ...
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WO/2015/053303A1 |
This invention provides a pressure-sensitive adhesive sheet for conveying an electrolyte membrane. When processing a membrane electrode assembly (MEA), said pressure-sensitive adhesive sheet can contribute to making it easier to handle a...
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WO/2015/053223A1 |
Provided are: an adhesive agent which can exert strong adhesiveness and can adhere and fix an object of interest even under a high-temperature environment during a period in which fixing is needed, and can be removed without damaging the...
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WO/2015/053807A1 |
Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators...
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WO/2015/050251A1 |
The present invention relates to a cured product of a curable polyorganosiloxane composition which comprises (A) an alkenyl-group-containing polyorganosiloxane containing at least two alkenyl groups in the molecule, (B) a polyorganohydro...
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WO/2015/050643A1 |
A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or m...
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