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WO/2017/081216A1 |
An adhesive bonding process can include: - treating at least one region of the surface of a silicone part so as to increase the surface energy of the region treated to a value greater than 30 m J/m2, - providing a double-sided adhesive t...
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WO/2017/082106A1 |
This bonding method comprises: a step (1) for disposing an adhesive layer on a first material to be bonded; a step (2) for disposing a curing agent layer, which is capable of curing the adhesive layer by coming into contact with and reac...
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WO/2017/078532A1 |
The invention is directed to a method for using a polymer composition for connecting a first object to a second object, wherein the method comprises, the step of applying a polymer composition to at least part of the surface of at least ...
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WO/2017/078047A1 |
The present invention pertains to a first protective film forming sheet obtained by laminating a first adhesive layer on a first substrate and laminating a curable resin layer on the first adhesive layer. The first protective film formin...
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WO/2017/072681A1 |
Described herein is a process for gluing two components on a vehicle-body assembly line, comprising the steps of: providing a first component and a second component; - applying a layer of glue on said first component and/or on said secon...
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WO/2017/072682A1 |
Described herein is a process for gluing two components on a vehicle-body assembly line, comprising the steps of: providing a first component and a second component; - applying a layer of glue on said first component and/or on said secon...
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WO/2017/075084A1 |
As described herein, the invention includes a building underlayment sheet that comprises an underlayment lamina having a top surface and a bottom surface. The bottom surface includes an interior portion and a selvage portion that extends...
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WO/2017/070045A1 |
The present disclosure relates to a method of applying a pressure-sensitive adhesive to a substrate, which comprises the steps of: a) providing an uncrosslinked curable precursor of a pressure-sensitive adhesive comprising: (1) a (meth)a...
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WO/2017/067904A1 |
The invention relates to a joining method in which a first surface (2) of a first joining part (1) and a second surface (8) of a second joining part (6) are bonded to each other, in which an adhesive tape (3) with a first side (4) and a ...
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WO/2017/067816A1 |
The invention relates to a connecting arrangement (1) and to a method for the adhesive connection of a positionally sensitive element (10) to a receiving body (11), in particular an optical element (12, 13, 14) such as a semiconductor li...
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WO/2017/067031A1 |
A method, structure, and device for binding two substrates, comprising a first substrate and a second substrate. The binding method comprises: first forming, on a surface of the first substrate, a closed surrounding barrier provided with...
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WO/2017/070097A1 |
An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substanti...
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WO/2017/063081A1 |
There are provided a holding strap, methods of making the same, and methods using such holding strap for tying down objects on a flatbed of a vehicle, retaining underground tanks, or lifting electrodes out of an electrolytic cell. The ho...
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WO/2017/066363A1 |
The present disclosure relates to a method of adhering a first part to a second part, wherein the first part and the second part are used for outdoor applications and comprise a thermoplastic or a thermosetting organic polymer. The prese...
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WO/2017/061625A1 |
Provided are: an adhesive-sheet set comprising a pair of adhesive sheets respectively including adhesive layers which, upon contact with each other, can cure and bond together; and a process for producing an article using the adhesive-sh...
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WO/2017/062202A1 |
A system and method for creating three-dimensional nanostructures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or ...
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WO/2017/061416A1 |
Provided is an adhesive enabling: adhesion and fixing of an adherend onto a support while maintaining a high adhesive property during when the adherend is required to be fixed onto the support, even in a high temperature environment or a...
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WO/2017/062088A1 |
A process for preparing a waterborne heat seal coating composition comprising the steps of: a) melt blending ethylene vinyl acetate copolymer, at least one tackifier, and optionally a surfactant in a mixing and conveying zone to form a m...
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WO/2017/059057A1 |
A compound for self-assembly onto a mineral and/or metal oxides substrate, the compound comprising a catechol group attached to an end group through a spacer group. The compound include a structure of Formula (I): Formula (I)
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WO/2017/054169A1 |
An electrically conductive film (10) comprises: a resin layer (11); and multiple electrically conductive particles (13) distributed in the resin layer (11). The electrically conductive film (10) comprises a first surface (111) and a seco...
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WO/2017/043283A1 |
A metal panel reinforcement material that comprises a resin composition, said resin composition at least comprising a plastic component for a curable crosslinked polymer matrix, a curing agent for the plastic component, a curing accelera...
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WO/2017/037170A1 |
The present patent application relates to a method for gluing two adjacent substrates together by using a radiation curable adhesive composition and a use of a radiation curable adhesive composition for gluing. In particular, the method ...
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WO/2017/032600A1 |
The invention relates to a method for attaching a body (1) having a planar base (2) onto a surface (6) by means of a double-sided self-adhesive adhesive strip (3), comprising the steps: orienting the body (1) and placing an edge (7) of t...
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WO/2017/033980A1 |
Provided is a method for treating a surface of a molded resin object or molded rubber object, the method necessitating no installation of large equipment, not requiring much labor for the surface treatment, being capable of attaining ene...
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WO/2017/033545A1 |
The purpose of the present invention is to provide a method for bonding two substrates and a device for bonding two substrates, enabling a first substrate and a second substrate to bond via a functional film so as not to make direct cont...
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WO/2017/029345A1 |
The invention relates to a solution in particular for the pre-treatment of a surface, containing, preferably consisting of: I) at least one first silane of formula (I) with R1, R2, R3 independently selected from the groups methyl, ethyl,...
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WO/2017/021436A1 |
The present invention relates to an emulsion for producing a microcellular emulsion foam in film form, and a method for producing said microcellular emulsion foam in film form. The emulsion comprises: a) a polymer solution, comprising a ...
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WO/2017/022500A1 |
This method for adhesion-fixing an optical assembly comprises forming an optical assembly by adhesion-fixing a plurality of assembly constituent components including an assembly constituent component having an optical component, the meth...
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WO/2017/021152A1 |
The invention relates to a method for producing a stacked-plate cooler (1), which has a first component (2) and at least a second component (3), wherein the first component (2) and the second component (3) each have at least one connecti...
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WO/2017/021085A1 |
The invention relates to a reactive adhesive film system comprising a first reactive adhesive film (A) and a second reactive adhesive film (B); the use of the reactive adhesive film system described herein to glue together materials havi...
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WO/2017/022285A1 |
Provided is a method for manufacturing an optical member with which it is possible to improve the fit between a first member and a second member that are optically transparent. The present invention comprises: a temporary-curing step for...
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WO/2017/019622A1 |
An apparatus (100) comprising: first and second structural parts (102, 104) that are formed of a rigid material or a semi-rigid material; and a bond comprising a first adhesive (304) and at least one conductive member (502) disposed in a...
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WO/2017/016694A1 |
The invention relates to a textile protective material, in particular providing protection against radioactive harmful and/or toxic substances and/or against biological harmful and/or toxic substances and/or against chemical harmful and/...
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WO/2017/013914A1 |
Provided is an adhesion technique for delaminating a material of interest while satisfying the requirements for the reliability assurance temperature for the material, with a view to reproduce the material. A double-sided adhesive tape c...
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WO/2017/006854A1 |
The thermally conductive composition according to the present invention comprises metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, the metal particles (A) sintering upon a heat treatment to ...
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WO/2017/002315A1 |
Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. According to the present invention, a heat dissipation material...
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WO/2017/001592A1 |
The present invention relates to a process for cold bonding elastomeric rubber substrates to non-elastomeric substrates of a different material, preferably metal, by use of a rubber treatment, preferably a primer composition and a 2k adh...
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WO/2016/207702A1 |
A method for bonding, and bonded assembly thereof, a cover layer to a display layer using a bonding material, comprising placing a peripheral spacer dam for confining the bonding material, wherein said dam has a substantially rectangular...
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WO/2016/204034A1 |
Provided is a film application method which can prevent the intrusion of foreign bodies and air bubbles onto an adhering surface even when the film is applied in a general environment where foreign bodies such as dust are present. This f...
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WO/2016/198319A1 |
The invention relates to a method for connecting sealing strips, comprising applying a composition, which comprises at least one latent alkyl borane and is substantially free of decomplexing agent for the latent alkyl borane, to a sealin...
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WO/2016/186837A1 |
The manufacturing of articles relies on the bonding of two or more components to form some forms of the articles, such as a shoe sole bonded with a shoe upper. The bonding may be achieved with an adhesive particulate that is applied to a...
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WO/2016/182655A1 |
The present invention relates to isocyanate free, moisture curable hot melt adhesive compositions having improved green strength, the production of such adhesives and the use of such adhesives.
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WO/2016/179010A1 |
Films comprising a resin matrix, an entanglement polymer, and a latent curative, wherein the resin has a functionality of at least 2.0 and a viscosity of at least 0.1 Pascal-seconds, and the film is dimensionally stable at 25°C. The fil...
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WO/2016/177726A1 |
A method for structuring a layer is provided in various exemplary embodiments. The method for structuring a layer comprises forming (001) an adhesive layer (104) on a first substrate (102) in such a way that the first substrate (102) has...
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WO/2016/174122A1 |
The invention relates to a method for sealing oxide protective layers on metal substrates using aqueous compositions containing a copolymer or a copolymer mixture of at least one aliphatic and acyclic alkene with at least one α,β-unsat...
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WO/2016/171939A1 |
The present invention is a layered optically clear adhesive including a first pressure-sensitive optically clear adhesive, a second pressure-sensitive optically clear adhesive, and a flowable optically clear adhesive positioned between t...
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WO/2016/170776A1 |
In the present invention, an adhesive is molded in elongated fashion, and an adhesion-preventive treatment is then performed on the surface of the adhesive. The adhesive subjected to the adhesion-preventive treatment is wound and stored ...
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WO/2016/171170A1 |
In the present invention, a manufacturing method for a sealed semiconductor element comprises the following: a sealing step in which, a semiconductor element, which has been subjected to pressure-sensitive adhesion to a pressure-sensitiv...
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WO/2016/165691A1 |
The aim of the invention is to provide an improved solution for an adhesive connection for the planar adhesion of components, in which the adhesive connection has a non-uniform stress distribution in different regions of the adhesive sur...
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WO/2016/167133A1 |
This adhesive sheet (X1) has an adhesive-agent layer (1) curable by radiation exposure and including an acrylic copolymer, a basic monomer, and a photopolymerization initiator. The acrylic copolymer in the adhesive-agent layer (1) includ...
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