CONNECTION BODY PRODUCTION METHOD AND ELECTRONIC COMPONENT CONNECTION METHOD

Title:

CONNECTION BODY PRODUCTION METHOD AND ELECTRONIC COMPONENT CONNECTION METHOD

Document Type and Number:

WIPO Patent Application WO/2015/111599

Kind Code:

A1

Abstract:

Provided are a connection body production method and an electronic component connection method such that electronic components are connected at a low temperature using a photo-curing adhesive and poor electronic component connections are avoided. An electronic component (18) is disposed on a transparent substrate (12) via a circuit connection adhesive (1) containing a photo-polymerization initiator. Heating and illumination are performed while the electronic component (18) is pressed against the transparent substrate (12), and the illumination is ended while the heating and the pressing continue.

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Inventors:

KAJITANI TAICHIRO (JP)

Application Number:

PCT/JP2015/051464

Publication Date:

July 30, 2015

Filing Date:

January 21, 2015

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Assignee:

DEXERIALS CORP (JP)

International Classes:

H01L21/60; C09J5/06; C09J11/06; C09J201/00; H01B5/16; H01R11/01; H05K3/32; H05K1/18

Domestic Patent References:

WO2013121858A1

2013-08-22

Foreign References:

JPH10340927A	1998-12-22
JP2009013316A	2009-01-22
JP2000169821A	2000-06-20

Attorney, Agent or Firm:

NOGUCHI, NOBUHIRO (JP)
Nobuhiro Noguchi (JP)

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