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WO/2022/201765A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 12; and an boundary surface ablation layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces and perform boundary surface ablatio...
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WO/2022/202271A1 |
A dicing die attach film which comprises a dicing film and a die attach film that is superposed on the dicing film, wherein: a surface of the die attach film has an arithmetic mean roughness Ra1 of 0.05 μm to 2.50 μm, the surface being...
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WO/2022/201788A1 |
[Problem] To provide a semiconductor processing adhesive tape capable of suppressing the cracking of chips when peeling off the adhesive tape.　[Solution] A semiconductor processing adhesive tape having a base material and an adhesive l...
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WO/2022/201790A1 |
[Problem] To provide a pressure-sensitive (PS) adhesive tape for semiconductor processing capable of suppressing cracking of a chip when peeling the PS adhesive tape.　[Solution] A PS adhesive tape for semiconductor processing that has ...
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WO/2022/202383A1 |
The present invention pertains to a release sheet having a base material and a release layer formed on the base material. The release layer is formed from a release agent composition containing a silicone-modified acrylic resin (A), a me...
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WO/2022/202160A1 |
A temperature-sensitive adhesive according to the present invention contains an ultraviolet curable side-chain crystalline polymer which is a reaction product of side-chain crystalline polymer and a compound having an ultraviolet curable...
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WO/2022/201687A1 |
A dicing die attach film which has a dicing film and a die attach film layered on this dicing film, wherein the die attach film contains an organic solvent which has a boiling point no less than 100°C and less than 150°C and a vapor pr...
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WO/2022/202659A1 |
Provided is a workpiece processing method in which a workpiece such as a wafer is processed in a state of a layered body obtained by fixing the workpiece to a support body via a temporary fixing material, wherein the workpiece such as a ...
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WO/2022/201858A1 |
Provided is a surface protective sheet in which, even when used in a state of being attached to an object to be protected in a process including a step for treating the object to be protected in a liquid, peeling from an end part as a re...
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WO/2022/202478A1 |
The present invention provides an electrically debondable adhesive sheet that includes a conductive substrate having a support body, an intermediate layer, and a conduction layer in the stated order, with an electrically debondable first...
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WO/2022/196752A1 |
The present invention relates to a semiconductor device manufacturing method including steps 1-3, said method using a double-sided adhesive sheet that has an adhesive layer (X1), a base material layer (Y), and an adhesive layer (X2) in t...
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WO/2022/195899A1 |
In order to provide a pressure-sensitive adhesive tape wherein the leaving of adhesive agent residue is suppressed, the present invention uses a pressure-sensitive adhesive tape having: a substrate 10 that has a base fabric 1 configured ...
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WO/2022/196327A1 |
Provided is a decorative material comprising an adhesive layer and a cholesteric liquid crystal layer in contact with this adhesive layer. The content in this cholesteric liquid crystal layer, per unit volume of the cholesteric liquid cr...
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WO/2022/196298A1 |
A heat-sealable resin composition including an ethylene-vinyl ester copolymer (A) and a tackifying resin (B), in which the content of a constituent unit derived from the vinyl ester included in the ethylene-vinyl ester copolymer (A) with...
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WO/2022/193572A1 |
Provided are a boron nitride heat dissipation film, a preparation method therefor, and an application thereof. Provided is the preparation method for the boron nitride heat dissipation film, comprising the following steps: mixing boron n...
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WO/2022/194716A1 |
The invention is directed to a method for adhesively bonding two substrates, comprising the steps: a) applying a liquid, radiation-curable primer composition onto the surface of a first substrate; b) curing the liquid, radiation-curable ...
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WO/2022/196987A1 |
The present invention relates to an adhesive composition comprising acrylic copolymer having refractive index of 1.55-1.70, and to an adhesive sheet, an optical member, and a display apparatus produced using the adhesive composition.
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WO/2022/196586A1 |
[Problem] To provide: an adhesive composition which has excellent heat resistance, excellent adhesive strength, low relative dielectric constant, low dielectric loss tangent and excellent dielectric characteristics; and a bonding sheet, ...
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WO/2022/196354A1 |
The present invention relates to: a thermally expandable adhesive composition which contains a thermosetting resin (A), thermally expandable particles (B) and an inorganic filler (C), wherein the inorganic filler (C) has an average parti...
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WO/2022/196355A1 |
The present invention pertains to a curable perfluoropolyether adhesive composition that contains: (A) 100 parts by mass of a straight-chain perfluoropolyether compound that has at least two alkenyl groups in one molecule, and that has, ...
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WO/2022/197168A1 |
The present invention relates to an adhesive for a stoma and an adhesive tape for a stoma comprising same. Specifically, the present invention relates to: an adhesive for a stoma, which can be attached to an affected part having a high a...
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WO/2022/196585A1 |
[Problem] To provide an adhesive composition with excellent heat resistance and adhesion strength, with low relative permittivity and dielectric loss tangent, and with excellent dielectric properties, and to provide an adhesive sheet, a ...
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WO/2022/191109A1 |
A bonding sheet according to the present invention contains a matrix resin, solder particles, and a flux agent. With respect to this bonding sheet, the solder particles are dispersed in the matrix resin, and the flux agent is unevenly di...
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WO/2022/191147A1 |
[Problem] To provide: a coating composition that can form a non-adhesive coating layer that demonstrates tight adhesion to various resin base materials, excellent surface hardness, tack resistance, flex resistance, scuff resistance, shri...
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WO/2022/191144A1 |
The present invention provides: a two-pack type curable coating agent which is capable of forming a surface protective layer that has excellent weather resistance, acid resistance, antifouling properties and elongation properties; and a ...
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WO/2022/189577A1 |
The present invention relates to a composition formed of a hot melt adhesive having a colour-forming compound admixed therein. The invention further relates to a substrate or multi-layer substrate construction having the composition appl...
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WO/2022/190808A1 |
Provided is an adhesive tape which has high flame retardancy and flexibility, has a favorable tape appearance, and has favorable workability during use. This adhesive tape comprises a substrate and an adhesive layer disposed on at least ...
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WO/2022/190927A1 |
Provided are: a laminated film having excellent adhesion to metal, a low environmental load, and excellent adhesiveness and ease of unwinding; and a film roll. This laminated film having a resin layer A and a substrate satisfies the foll...
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WO/2022/191212A1 |
This anticorrosion adhesive tape of the present invention is provided with an adhesive layer, does not generate rust in a cyclic corrosion test complying with a cycle D in JIS K5600-7-9, and has adhesion of 20N/25 mm or more after the cy...
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WO/2022/190860A1 |
The present invention addresses the problem of providing: a recyclable base paper for a release paper, excellent in filling properties and capable of forming a uniform release agent layer; and a release paper having a uniform release age...
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WO/2022/191143A1 |
The present invention provides: a two-pack type curable coating agent which is capable of forming a surface protective layer that has excellent weather resistance, acid resistance, antifouling properties and elongation properties; and a ...
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WO/2022/192686A1 |
A multilayer composite containing a polymeric membrane, a hot-melt adhesive layer A, a hot- melt adhesive layer B; and a release liner, wherein the hot- melt adhesive layer A comprises a non-ultraviolet (UV) curable pressure-sensitive ad...
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WO/2022/191056A1 |
The present invention provides a resin composition that can be molded into a film-like shape, and is such that a cured product thereof has high thermostability and adhesiveness and a low dielectric constant and dielectric loss tangent.ã€...
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WO/2022/190728A1 |
The present invention relates to an adhesive sheet for semiconductor processing having a base material, a middle layer (X) having energy ray curability, and an adhesive agent layer (Y) in that order, that satisfies requirement (1). Requi...
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WO/2022/191110A1 |
A bonding sheet according to the present invention contains a matrix resin, solder particles and a flux agent. This bonding sheet has a surface that has a surface roughness Sa of 2.5 μm or less.
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WO/2022/191154A1 |
[Problem] To provide adhesive tape configured such that pinhole formation is suppressed even if the substrate is thinned and that tends not to crack as a result of binding work performed under an environment of a low-temperature of -30â„...
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WO/2022/189631A1 |
The present invention relates to a method of making one or more fibrils, the method comprising the steps of providing a material of manufacture of the one or more fibrils; providing a random initial shape of the one or more fibrils, with...
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WO/2022/186229A1 |
A method for evaluating a bonding film which is used in a production process of a semiconductor device, the method comprising a step in which a tack test is carried out by means of a heated probe. With respect to this method for evaluati...
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WO/2022/186126A1 |
This adhesive sheet comprises a substrate, and an adhesive layer in this order toward one side in the thickness direction. The substrate includes: a first β-1,3-glucan derivative in which an acyl group is introduced into β-1,3-glucan; ...
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WO/2022/185611A1 |
The present invention provides an adhesive sheet including, on the surface thereof, an adhesive layer on which a sealing resin for sealing a semiconductor chip can evenly flow.　An adhesive sheet according to the present invention inclu...
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WO/2022/186181A1 |
A laminate sheet (L) according to the present invention is provided with: a color changeable adhesive sheet (X) that has colorability according to an external stimulus and includes a colored region (11) and a non-colored region (12); and...
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WO/2022/185607A1 |
A laminate comprising: a protection film having a base material and an adhesive layer; an engineering plastic film provided on the adhesive layer; and an inorganic substrate provided on the engineering plastic film, wherein the inorganic...
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WO/2022/186641A1 |
The present invention relates to: an adhesive composition comprising an acrylic copolymer comprising a repeating unit derived from a monomer having a functional group of chemical formula 1; an adhesive sheet prepared by using same; an op...
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WO/2022/186016A1 |
A bonding film for circuit connection, the bonding film being used for the purpose of connecting a first circuit member, which is obtained by forming a first circuit electrode on a main surface of a first substrate, and a second circuit ...
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WO/2022/185612A1 |
The present invention provides a double-sided adhesive sheet which can be used as a provisional fixing material during processing of a member, and with which it is possible to increase the uniformity of pressure application when pressure...
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WO/2022/186137A1 |
[Problem] To provide: an organopolysiloxane compound serving as a starting material for an organopolysiloxane adhesive that has sufficient adhesion as required at a provisional fixing or other step, and is easily peelable from a substrat...
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WO/2022/186427A1 |
A release film, an optical film comprising same, and an electronic device are disclosed. The release film comprises a substrate and a release layer positioned on at least one surface of the substrate, wherein the release layer is a cured...
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WO/2022/185715A1 |
One embodiment of the present invention relates to an adhesive agent composition, an adhesive sheet or an optical member. The adhesive agent composition contains: an acrylic polymer (A) which contains more than 0% by mass but not more th...
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WO/2022/185610A1 |
The present invention provides a liner-equipped double-sided adhesive sheet having liners on both sides thereof, wherein if either liner is peeled away first, the double-sided adhesive sheet remains only on one liner.　A liner-equipped ...
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WO/2022/186914A1 |
A synthetic glass screen protector apparatus may include a polymethyl methacrylate (PMMA) layer. The apparatus may further include an A-B glue layer, where the A-B glue layer includes an optically clear adhesive sub-layer and a silicone ...
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