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Patent Searching and Data


Matches 1,051 - 1,100 out of 56,391

Document Document Title
WO/2022/246681A1
A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a topside protective film. ...  
WO/2022/250136A1
This method for producing an electronic device at least includes: a step (A) for preparing a structure comprising a wafer which has a circuit-forming surface and an adhesive film stuck on the circuit-forming surface side of the wafer; a ...  
WO/2022/250041A1
This adhesive is for a flexible display, and contains an acrylic copolymer and a curing agent. The acrylic copolymer is a copolymer of a monomer mixture containing all of monomers (a-1)-(a-4). The storage modulus and the loss tangent of ...  
WO/2022/249726A1
The present invention provides an adhesive sheet that can maintain a sufficient adhesive power as a structural material even when being exposed to acidic liquids and alkaline liquids in a configuration where there is a restriction in thi...  
WO/2022/246562A1
A medical adhesive device for stabilizing bone fragments comprising an adhesive which has a tackifying temperature of at least 40°C, comprising a polymer derived from a polyester, poly ether, polyalkylene glycol, polysilicone, or polyca...  
WO/2022/250025A1
[Problem] To suppress, in an optical laminate including a polarizer on which iodine is adsorbed and oriented, a rise in the iodine concentration of a pressure-sensitive adhesive layer stacked on the optical laminate. [Solution] Provided ...  
WO/2022/246877A1
The present invention provides a mid-infrared-through heat-insulation packaged mid-infrared heating supply wall cloth. The wall cloth has a laminated structure and comprises a top surface covering layer, a porous polyethylene heat-insula...  
WO/2022/250137A1
A method for producing an electronic device, the method comprising at least: a step (A) for preparing a structure that is provided with a wafer having a circuit formation surface and an adhesive film that is bonded to the circuit formati...  
WO/2022/250128A1
Provided is a back grinding adhesive film that is used to protect the surface of a wafer. This adhesive film includes a substrate layer and an adhesive resin layer provided on one side of the substrate layer and composed of a UV-curable ...  
WO/2022/250129A1
A method for producing an electronic device, the method comprising at least: a step (A) for preparing a structure that is provided with a wafer having a circuit formation surface and an adhesive film that is bonded to a circuit formation...  
WO/2022/250242A1
An adhesive tape for a body-attached device, according to the present invention, which is for attaching the body-attached device to a user's body, comprises: an adhesive film having an adhesive layer on one side thereof; and a release sh...  
WO/2022/249899A1
[Problem] A mold release film is provided which, substantially silicone-free, has a light release force before and after heating, and a light release force even in the case of quick release. [Solution] This mold release film includes a b...  
WO/2022/246682A1
A tape includes an electrically conductive adhesive first layer having opposite outermost first and second major surfaces. The first layer includes an electrically conductive porous medium and an adhesive disposed in, and extending throu...  
WO/2022/246787A1
A computing system includes a computing component connected to a housing with an anisotropic stretch release tape. The anisotropic stretch release tape includes a backing having an upper surface and a lower surface. The upper surface inc...  
WO/2022/249682A1
Provided are: a method which is for manufacturing an image display panel, and which suppresses a decrease in manufacturing efficiency; and a surface protective film that contributes to suppressing a decrease in the manufacturing efficien...  
WO/2022/250131A1
This method for producing an electronic device includes at least a step (A) of preparing a structure that is provided with a wafer having a circuit-forming surface and an adhesive film affixed on the circuit-forming surface side of the w...  
WO/2022/250105A1
The purpose of the present disclosure is to provide an adhesive composition having excellent adhesiveness. An adhesive composition according to the present disclosure contains a copolymer (A) that includes, as constituent monomers, at le...  
WO/2022/249888A1
Provided is an adhesive sheet for rear surface grinding with which an adhesive layer is prevented from peeling off and a wafer can be easily peeled off from the adhesive sheet. According to the present invention, this adhesive sheet fo...  
WO/2022/249889A1
Provided is an adhesive sheet for backgrinding that can increase the conformance of a substrate layer to protruding sections of a semiconductor wafer. The present invention provides an adhesive sheet for backgrinding of a semiconductor...  
WO/2022/250106A1
The purpose of the present invention is to provide an adhesive primary agent for manufacturing an adhesive film with excellent adhesion in a wide range of temperatures. The adhesive primary agent contains a copolymer (A) which as constit...  
WO/2022/251879A1
The HMPSA compositions of this invention include from 10% by weight to 35% by weight of a styrenic block copolymer, from 10% by weight to 60% by weight of a near white rosin ester tackifying agent having a neat Molten Garner Color of no ...  
WO/2022/250130A1
Provided is an adhesive film for backgrinding, the adhesive film being used to protect the surface of a wafer, and comprising a base material layer and an adhesive resin layer that is provided on one side of the base material layer and c...  
WO/2022/249727A1
The present invention provides a double-sided adhesive sheet that is configured to have a limited thickness and that does not lift or peel from an adherend even when exposed to acidic liquids and alkaline liquids. Provided is a double-si...  
WO/2022/244813A1
A purpose of the present invention is to provide: an optical pressure-sensitive adhesive sheet that has a layered structure including a pressure-sensitive adhesive layer which is less apt to have failures regarding transparency, appearan...  
WO/2022/244301A1
Provided is a circular polarizing plate in which a polarizer is inhibited from deteriorating due to ultraviolet light, light emission of an optical panel, or the like, and that is less likely to come off an optical panel. The circular po...  
WO/2022/244888A1
The present invention provides a production method that comprises the formation of an adhesive sheet from a coating film of an adhesive composition, which contains, as a main component, a (meth)acrylic polymer (A) and additionally contai...  
WO/2022/244812A1
A purpose of the present invention is to provide a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer which is less apt to have failures regarding transparency, appearance, or durability, exhib...  
WO/2022/244450A1
Provided is a pressure-sensitive adhesive which has flexibility suitable for both adhesion and conformability to adherend surfaces and can form highly reliable joints having a high refractive index. The pressure-sensitive adhesive is a p...  
WO/2022/244887A1
The present invention provides an adhesive sheet having a haze of 0.1% or more, wherein if 10 evaluation regions each having an area of 1.5 μm square are arbitrarily selected from a cross-sectional image of this adhesive sheet and an is...  
WO/2022/244886A1
Provided is an adhesive sheet configured such that, on a stress-distortion curve obtained through an evaluation test conducted on the adhesive sheet, the peak value of stress X (peak top stress Xmax) is 0.5 MPa or greater. Evaluation tes...  
WO/2022/244286A1
An adhesive sheet (100) of the present invention has: a first resin layer (10) containing a 4-methyl-1-pentene polymer; and a design layer (30), wherein at least a portion of the first resin layer (10) is exposed on a surface (11) and a ...  
WO/2022/244535A1
The present invention provides a thermally expandable sheet which sufficiently bonds two surfaces to be bonded by being thermally expanded therebetween, while being capable of suppressing the occurrence of resin flow, the two surfaces to...  
WO/2022/244558A1
The present invention provides an adhesive sheet having an adequate storage elastic modulus and improved durability. This adhesive sheet has a 25°C storage elastic modulus G' of 0.4 MPa or greater. When a cross-section of the adhesive s...  
WO/2022/244756A1
The purpose of the present invention is to provide an adhesive tape which exhibits excellent peeling performance with respect to a chip component, and which can suppress adhesive residue on a chip component. The present invention is an a...  
WO/2022/245006A1
The present invention relates to an easily constructed stone chip-preventing protection film attachable to the outside of an automobile windshield. The easily constructed stone chip-preventing protection film attachable to the outside of...  
WO/2022/244554A1
The present invention provides a pressure-sensitive adhesive composition which contains a sufficient amount of an isocyanate-based crosslinking agent and is suitable for producing pressure-sensitive adhesive sheets that are less apt to c...  
WO/2022/244557A1
This adhesive composition includes a (meth) acrylic-based polymer (A) as a main component thereof and also includes a crosslinking agent (B). The crosslinking agent (B) is blended in the amount of at least 5 parts by weight relative to 1...  
WO/2022/244796A1
The purpose of the present invention is to provide a surface-protective film which has high adhesive force (initial adhesive force) and which, after having been applied to an adherend, is less apt to increase in adhesive force with the l...  
WO/2022/244555A1
An adhesive composition provided herein includes a (meth)acrylic polymer (A) as a main component, and further includes a cross-linking agent (B) having a functional group reactive with a hydroxyl group, and a polyfunctional alcohol (C). ...  
WO/2022/239805A1
This pressure-sensitive adhesive tape comprises a paper substrate and a pressure-sensitive adhesive layer disposed on a surface of the paper substrate, wherein the pressure-sensitive adhesive layer includes a rubber ingredient comprising...  
WO/2022/238377A1
Method for bonding a thermoplastic piping system (1) without the use of solvent-based adhesives, the piping system (1) comprising at least one first pipe or fitting part (11), and at least one second pipe or fitting part (12), which comp...  
WO/2022/239452A1
A heat-ray reducing membrane (11) equipped with an anti-fogging function according to the present invention is such that indium tin oxide (ITO) particles and a glycerin compound serving as an anti-fogging agent are uniformly dispersed in...  
WO/2022/239508A1
[Problem] To suppress an increase in iodine concentration of a second adhesive layer of an optical laminate under high-temperature and high-humidity conditions. [Solution] This optical laminate includes a first adhesive layer, a first pr...  
WO/2022/236796A1
Provided is a fluorosilicone release coating composition comprising: (A) a linear organopolysiloxane having at least two alkenyl groups and at least one fluoroalkyl group per molecule, and not having a silicon atom-bonded hydrogen atom: ...  
WO/2022/234525A1
A multilayer pressure-sensitive adhesive foam tape that includes: a pressure-sensitive adhesive polymeric foam layer having a first major surface and a second major surface, wherein the polymeric foam comprises: a poly(meth)acrylate deri...  
WO/2022/235501A1
The disclosure relates to a membrane leaf packet, and a spiral membrane element including a plurality of such membrane leaf packets, including such elements exhibiting enhanced sanitary properties. Such membrane elements can be used for ...  
WO/2022/234726A1
Provided is an adhesive sheet with a release film, the adhesive sheet being configured such that when one release film is peeled off from the double-sided adhesive sheet in which the surfaces thereof are protected by two respective relea...  
WO/2022/234133A1
The invention relates to a method for forming a syntactically foamed polymer layer, comprising the steps of: a) producing or providing a polymer mass comprising a plurality of at least partially expanded microballoons, b) introducing the...  
WO/2022/233788A1
What is illustrated and described is a material tape system (1) having a carrier tape (3), which has a first end portion (13) and a second end portion (15) and extends from the first end portion (13) to the second end portion (15), a fix...  
WO/2022/234442A1
Studded membrane (10) for underfloor heating, of the detaching membrane type which also acts as a support for the laying of electrical conductors, consisting of one waterproof plastic sheet (100) coupled to one base layer (110) for ancho...  

Matches 1,051 - 1,100 out of 56,391