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WO/2022/270073A1 |
Provided is electronic device processing tape comprising a base material tape laminated with a release film. The base material tape comprises a label section, a residue peeling section, and a peripheral section. The label section has a p...
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WO/2022/265074A1 |
This adhesive film contains a thermoplastic resin, wherein the tanδ maximum peak temperature is 0-52°C, the shear storage elastic modulus at 20°C is 3×105 Pa or greater and the proportion of undissolved components when 1.0 g of an ea...
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WO/2022/263954A1 |
Stretch removable articles include a multi-layer extensible backing substrate of at least three layers and either a discontinuous inextensible layer with regions of inextensible material and gaps between the regions of inextensible mater...
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WO/2022/264861A1 |
The present invention provides an adhesive sheet with which concealment of an adherend and blocking of infrared rays is possible. Provided is an adhesive sheet having an adhesive layer. This adhesive sheet exhibits at most 20% transmitta...
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WO/2022/265075A1 |
In an adhesive film according to the present invention, a thermoplastic resin is contained; the thickness is 150-2000 μm; when a prescribed compression creep test is performed, the amount of change in the thickness of a test sample A is...
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WO/2022/261858A1 |
A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a topside protective film. ...
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WO/2022/265073A1 |
This adhesive film includes a thermoplastic resin, does not include a plasticizer or includes less than 20 parts by mass of a plasticizer per 100 parts by mass of the thermoplastic resin, has a shear storage modulus of 3×105 Pa or great...
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WO/2022/264860A1 |
The present invention provides an adhesive sheet with which concealment of an adherend and superior blocking of infrared rays is possible. Provided is an adhesive sheet having an adhesive layer. The adhesive layer includes an infrared ab...
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WO/2022/262572A1 |
The present invention belongs to the technical field of waterproofing, and relates to a waterproofing coiled material, a preparation method therefor, a construction method therefor, and a tunnel waterproofing system. The waterproofing co...
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WO/2022/265039A1 |
The present invention provides an adhesive film 10 having an adhesive layer 12 which is disposed on at least one surface of a heat-resistant layer 11. An essential component of the heat-resistant layer 11 is a thermoplastic resin having ...
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WO/2022/264546A1 |
This electroconductive sheet comprises a binder resin and electroconductive particles, and has a 70°C viscosity of 10-10,000 kPa·s and a 70°C elongation at break of 110% or higher.
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WO/2022/264560A1 |
The present invention is repair tape used to repair LED chips installed in a micro LED display, the repair tape comprising: an elongated first tape material 2 which can be wound into a roll shape and has, on one surface thereof, an adhes...
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WO/2022/262252A1 |
The present application relates to the technical field of materials, and specifically discloses a rare earth long persistent luminescent film, a preparation method, and an application. The raw materials for preparing the film comprise a ...
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WO/2022/264102A1 |
Antistatic optically clear adhesives are described. In particular, antistatic optically clear adhesives that include an N-ethyl pyridinium TFSI salt additive are described. Such optically clear adhesives may enable good static charge dis...
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WO/2022/265077A1 |
An adhesive film according to the present invention includes a thermoplastic resin, has a shear storage modulus of 0.06×106 Pa to 1.00×106 Pa at 85°C, does not include a plasticizer or includes less than 20 parts by mass of a plastici...
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WO/2022/261123A1 |
A multilayer composite containing a polymeric membrane, a hot-melt adhesive layer, and a release liner, wherein the hot-melt adhesive layer comprises a thermally curable pressure- sensitive adhesive. The invention further relates to a pr...
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WO/2022/259968A1 |
An adhesive comprising an isocyanate-terminated prepolymer. The isocyanate-terminated prepolymer comprises a product of a reaction between a polyisocyanate component containing xylylene diisocyanate and a polyol component containing a po...
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WO/2022/257095A1 |
This disclosure relates to curable silicone rubber compositions suitable for use in the manufacture of cured-in-place gaskets (CIPGs), silicone elastomers resulting from the cure of said compositions and methods for making cured-in-place...
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WO/2022/259852A1 |
The present invention provides adhesive tape for bicycle rims which has favorable workability. The adhesive tape for bicycle rims is an adhesive sheet to be used for blocking spoke holes in a bicycle rim, said adhesive sheet comprising a...
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WO/2022/260277A1 |
A unit cell according to one embodiment of the present invention has separators and electrodes alternately stacked in the order of a lower separator, a first electrode, an upper separator, and a second electrode. An adhesive is applied t...
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WO/2022/260806A1 |
In devices with flexible displays, multilayer adhesive stacks may be included. A multilayer adhesive may attach a flexible display panel to the display cover layer in an electronic device. Including multiple layers of adhesive in the adh...
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WO/2022/259869A1 |
Provided is a heat resistant adhesive film to be used in a high-temperature heat treatment step wherein said film can be peeled off without leaving adhesive residue on an adherend, even when the adhesive force to the adherend is increase...
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WO/2022/258964A1 |
The present invention provides a double-sided adhesive flexographic printing plate underlay for use in the manufacture and mounting of flexographic printing plates. The underlay is carrier sheet with a solvent acrylic adhesive stripe-coa...
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WO/2022/255141A1 |
Provided is an adhesive composition that is for forming a low-dielectric adhesive layer having both heat resistance and chemical resistance (solvent resistance), that exhibits excellent adhesiveness even with respect to a low-dielectric ...
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WO/2022/255145A1 |
Provided is a structure protection sheet having exceptional strength, the structure protection sheet making it possible to greatly reduce a construction time when providing a protective sheet to the surface of a structure made of concret...
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WO/2022/253985A1 |
The invention relates to an adhesive tape for covering elongate items such as particularly lines or cable sets, comprising a strip-type support on at least one face of which a curable adhesive compound is present, characterized in that t...
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WO/2022/255308A1 |
The purpose of the present invention is to provide a UV-curable adhesive composition having excellent printability, UV reactivity in the presence of oxygen, and adhesiveness with respect to a variety of types of base materials. Another p...
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WO/2022/255321A1 |
Disclosed is an integrated dicing/die bonding film which comprises a base layer, one or more pressure-sensitive adhesive layers including an ultraviolet-curable pressure-sensitive adhesive layer comprising an ultraviolet-curable pressure...
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WO/2022/255136A1 |
Provided is an adhesive composition that is for forming a low-dielectric adhesive layer having heat resistance and being capable of preventing resin flow (resin flow-out properties), that exhibits excellent adhesiveness even with respect...
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WO/2022/255132A1 |
(Problem) To provide a layered body capable of preventing formation of air bubbles in an adhesive agent layer or escape of an adhesive agent therefrom even when being repeatedly bent so as to have the back surface layer side thereof loca...
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WO/2022/255165A1 |
Provided is a laminated film capable of improving work efficiency in a process for producing a semiconductor device. The laminated film according to the present invention is such that a first separator, a first adhesive layer composed ...
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WO/2022/255078A1 |
Provided is a resin composition for adhesive films which has a low dielectric loss and nevertheless attains a sufficient adhesion strength and which can give adhesive films inhibited from suffering resin flow. The resin composition compr...
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WO/2022/255137A1 |
The present invention provides an adhesive composition for forming a low-dielectric adhesive layer that has both heat resistance and chemical resistance (solvent resistance), the adhesive composition exhibiting favorable adhesion to a lo...
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WO/2022/255131A1 |
[Problem] To provide a multilayer body which is capable of suppressing the occurrence of adhesive omission or air bubbles in an adhesive layer even in cases where the multilayer body is repeatedly bent under high temperature conditions, ...
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WO/2022/254097A1 |
The specification relates to an adhesive label comprising a water-borne multilayer pressure sensitive adhesive with enhanced performance. The adhesive label comprises a face layer and a multilayer adhesive adjoined to the face layer. The...
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WO/2022/253792A1 |
The invention relates to a method for generating a multilayer floor marking, having the steps of: a. applying at least one first polymer mixture onto the surface of a fixed support in order to produce a base layer, b. applying at least o...
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WO/2022/255012A1 |
Provided is an adhesive agent composition having high adhesion strength and an excellent storage life. The adhesive agent composition according to the present invention comprises a binder composition containing a cation-polymerizable com...
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WO/2022/255322A1 |
Disclosed is a dicing-die bonding integrated film. This dicing-die bonding integrated film comprises a dicing film that includes a base material layer and a pressure-sensitive adhesive layer composed of a UV-curable pressure-sensitive ad...
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WO/2022/252755A1 |
Disclosed are a ribbon carrier film, a preparation method therefor, and an application thereof, the ribbon carrier film comprising a pre-crosslinked layer and a bonding layer, the matrix resin of the pre-crosslinked layer and the bonding...
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WO/2022/255328A1 |
The present invention relates to a display device that has an inter-member pressure-sensitive adhesive layer, the maximum value of the loss tangent tanδ (f) of the pressure-sensitive adhesive layer at 25°C and a frequency f (Hz) of 100...
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WO/2022/255317A1 |
A purpose of the present invention is to provide an ultraviolet-curable heat-dissipating resin composition excellent in terms of printability, heat-dissipating property, and adhesiveness to various substrates. Another purpose is to provi...
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WO/2022/255313A1 |
The purpose of the present invention is to provide an ultraviolet-curable composition excellent in terms of printability, ultraviolet-light reactivity in the presence of oxygen, and tackiness at ordinary temperature and high temperatures...
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WO/2022/255210A1 |
The present invention provides an adhesive agent composition which does not rely on a tin-based catalyst, has a satisfactory pot life, undergoes rapid aging after curing, and can form an adhesive agent whose peeling force hardly depends ...
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WO/2022/255049A1 |
A pressure-sensitive adhesive composition comprising: a combination of a β-1,3-glucan derivative obtained by introducing acyl groups into β-1,3-glucan, the β-1,3-glucan derivative having a degree of acyl substitution of 2.6 or higher ...
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WO/2022/255370A1 |
The present invention addresses the problem of providing a multilayer sheet which comprises an adhesive layer that contains an acid-modified polyolefin and a base material layer that contains a polyamide, wherein the peel strength betwee...
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WO/2022/255414A1 |
An adhesive tape 11 is a long adhesive tape 11 comprising an adhesive layer 13 on one surface side of a substrate 12, wherein a terminal part of the adhesive tape 11 does not have the adhesive layer 13, but does have an exposed area K wh...
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WO/2022/246681A1 |
A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a topside protective film. ...
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WO/2022/250136A1 |
This method for producing an electronic device at least includes: a step (A) for preparing a structure comprising a wafer which has a circuit-forming surface and an adhesive film stuck on the circuit-forming surface side of the wafer; a ...
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WO/2022/250041A1 |
This adhesive is for a flexible display, and contains an acrylic copolymer and a curing agent. The acrylic copolymer is a copolymer of a monomer mixture containing all of monomers (a-1)-(a-4). The storage modulus and the loss tangent of ...
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WO/2022/249726A1 |
The present invention provides an adhesive sheet that can maintain a sufficient adhesive power as a structural material even when being exposed to acidic liquids and alkaline liquids in a configuration where there is a restriction in thi...
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