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WO/2023/017832A1 |
The present invention relates to a method for manufacturing a semiconductor device using an adhesive sheet for semiconductor processing having a base material, an intermediate layer, and an adhesive layer in that order, one or more layer...
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WO/2023/017835A1 |
The present invention provides a polyisocyanate composition which is derived from at least one diisocyanate that is selected from the group consisting of aliphatic diisocyanates and alicyclic diisocyanates, and at least one polyester pol...
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WO/2023/018212A1 |
The present invention relates to a composition for adhesion of dissimilar materials, and a preparation method therefor, and, more specifically, to a composition for adhesion of dissimilar materials, and a preparation method therefor, the...
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WO/2023/017876A1 |
The present invention is applicable in the field of substrates for high-frequency circuits, and for example, relates to a composite polyimide substrate, a composite polyimide composition, and a printed circuit board using same. The compo...
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WO/2023/018216A1 |
Disclosed are a display protection film, and an electronic device comprising same. The electronic device according to various embodiments of the present invention comprises: a flexible display; and a display protection film disposed abov...
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WO/2023/012947A1 |
Provided is an adhesive sheet 1 comprising at least an adhesive agent layer 11, wherein the gel fraction of an adhesive agent that makes up the adhesive agent layer 11 is less than 10%, and the 500% modulus of the adhesive agent layer 11...
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WO/2023/013489A1 |
This composition contains a (meth)acrylic copolymer A which has a number average molecular weight greater than 10000, measured by gel permeation chromatography, and a polymer X which has a number average molecular weight of 1000-10000, m...
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WO/2023/011184A1 |
The present invention relates to a coating composition for a waterproof composite and a waterproof composite containing same. Specifically, the present invention relates to a coating composition for a waterproof composite and the use the...
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WO/2023/013399A1 |
The present invention provides an adhesive composition with which it is possible to form an adhesive having both a high refractive index and low elastic modulus. Provided is an adhesive composition including an acrylic polymer and a plas...
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WO/2023/013899A1 |
A display device comprises a display panel, a lower module, a flexible circuit film, and a conductive adhesive tape. The display panel includes a first non-folding area, a second non-folding area, and a folding area. The lower module is ...
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WO/2023/013532A1 |
The purpose of the present invention is to provide a pressure-sensitive adhesive tape that has high adhesive strength to rough surfaces and excellent shear strength at high temperatures. Further, a pressure-sensitive adhesive tape accord...
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WO/2023/012664A1 |
An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second ...
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WO/2023/013538A1 |
The purpose of the present disclosure is to provide: an electromagnetic shield that is suitable for attachment to a member; and a communication unit provided with said electromagnetic shield. An electromagnetic shield (1) comprises a met...
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WO/2023/013701A1 |
An adhesive skin patch material having good adhesive properties (adhesive strength, water-resistant adhesiveness, etc.) even in the presence of water such as bathing, perspiring, etc., in addition to practical initial adhesive properties...
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WO/2023/006629A1 |
The present invention relates to a web-shaped adhesive compound which contains at least one poly(meth)acrylate and optionally at least one synthetic rubber; and - at least one polyurethane- and/or silicone-based filler. The invention als...
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WO/2023/008183A1 |
Provided is an adhesive composition that: includes (A) an acid-modified styrene elastomer and (B) an alicyclic epoxy resin that includes a structure formed by epoxidation of the unsaturated bond of a cyclic olefin structure; but does not...
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WO/2023/008333A1 |
Provided is an adhesive composition which exhibits excellent adhesive properties and soldering heat resistance, exhibits excellent adhesive properties even after being exposed to a high temperature environment for a long time, and exhibi...
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WO/2023/006911A1 |
The invention is directed to a membrane (1) comprising: i. A membrane top layer (2), ii. A reinforcing scrim (3) having first and second major surfaces, and iii. Optionally a membrane back layer (4), characterized in that at least a port...
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WO/2023/007947A1 |
This mold release film comprises a base material layer and an adhesive layer, wherein the thickness of the adhesive layer is 4-30% of the total thickness of the base material layer and the adhesive layer, and the thickness of the base ma...
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WO/2023/004523A1 |
The present invention relates to a biodegradable antifungal coating comprising an emulsion of a polymer selected from a copolymer of ethylene and poly(vinyl alcohol) (PVOH) and a volatile antimicrobial agent selected from cinnamaldehyde,...
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WO/2023/008961A1 |
The present invention relates to a shatterproof heat shield sheet and, more specifically, to a shatterproof heat shield sheet which is disposed between a display panel substrate and an outermost display cover window to prevent display pa...
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WO/2023/002981A1 |
The present invention provides: an adhesive composition which is capable of forming an adhesive layer that has a low dielectric constant and a low dielectric loss in a high frequency band, while having dielectric characteristics that are...
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WO/2023/002970A1 |
Provided is a curable adhesive composition comprising a binder resin (A) having a reactive functional group, a poly(phenylene ether) resin (B) having a vinyl group and a number-average molecular weight of 1,500 or higher but lower than 5...
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WO/2023/002980A1 |
Provided are: an adhesive composition which can form an adhesive layer that has low permittivity and low dielectric loss in a high-frequency band, and which is suitable for bonding members constituting a millimeter-wave antenna; and an a...
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WO/2023/002982A1 |
Provided are: a pressure-sensitive adhesive agent composition capable of forming a pressure-sensitive adhesive agent layer that has low dielectric constant and dielectric loss at a high frequency band, that is unlikely to be affected by ...
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WO/2023/002350A2 |
A composite adhesive fire barrier comprises a fire barrier material having first and second opposed major surfaces and a pressure-sensitive adhesive layer disposed on the first major surface of the fire barrier material. The fire barrier...
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WO/2023/002780A1 |
The present disclosure is, inter alia, a thermoplastic resin composition to be used to form a resin sheet, wherein the resin sheet is to be used in crosslinking adhesion with a rubber, the thermoplastic resin composition contains a therm...
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WO/2023/003546A1 |
A pressure sensitive hot melt adhesive is provided including at least one olefin block copolymer, a hydrogenated hydrocarbon tackifier, and a plasticizer. The adhesive is free from any oil containing constituents and the pressure sensiti...
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WO/2023/288259A1 |
The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range. The invention features a ...
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WO/2023/286713A1 |
The present invention addresses the problem of providing a polymer that has exceptional heat resistance and dielectric properties and that can be dissolved at a high concentration in an organic solvent, a resin composition including the ...
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WO/2023/286808A1 |
The present invention addresses the problem of providing a multilayer sheet that exhibits a high interlayer peel strength and that comprises: an adhesive layer containing an acid-modified polyolefin; and a substrate layer containing a po...
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WO/2023/285236A1 |
An aqueous pressure-sensitive adhesive composition for recycling-compatible pressure-sensitive adhesive labels is described. The adhesive composition comprises (A) a pressure-sensitive adhesive polymer made by emulsion polymerization of ...
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WO/2023/283711A1 |
The present invention relates to a novel proposal for a material for packaging agricultural products, such as cotton, in particular in cylindrical bales using automated agricultural equipment and machines, such as self-propelled balers. ...
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WO/2023/286389A1 |
Problem: To provide a thermoconductive film-like adhesive agent that can sufficiently cause progression of a curing reaction under a milder condition, that can, when being used as a die-attach film, effectively suppress residual voids be...
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WO/2023/288260A1 |
The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range. The invention features a ...
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WO/2023/286576A1 |
The present invention aims to provide a novel polarizing plate that: has an adhesive layer formed from an adhesive that has sufficient pot life during production; and suppresses reduction in transmittance when exposed to high-temperature...
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WO/2023/286681A1 |
A tape laminate is provided which, when used to seal a flow path, enables suppressing gas leakage and contamination while not being prone to peeling due to gas generation. This tape laminate 1 is provided with: a first substrate 2; a f...
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WO/2023/286620A1 |
Provided is a pressure-sensitive adhesive sheet which has satisfactory conformability to the surface contours of adherends and which, when used for encapsulating a semiconductor chip with a resin on the pressure-sensitive adhesive layer,...
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WO/2023/286487A1 |
Provided are: a heat-fusible laminated film which has high interlaminar adhesion strength and which, when heat-fused, brings about a satisfactory bonded state; and a roll obtained by winding the heat-fusible laminated film. The heat-fu...
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WO/2023/286621A1 |
Provided is a pressure-sensitive adhesive sheet having excellent removability from adherends. The pressure-sensitive adhesive sheet comprises a substrate and a pressure-sensitive adhesive layer disposed on at least one side of the substr...
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WO/2023/286712A1 |
Provided is an adhesive composition comprising (A) an acid-modified styrene-based elastomer, (B) an isocyanate compound having at least two isocyanate groups per molecule, (C) fluorine-based polymer microparticles and (D) olefin-based po...
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WO/2023/286619A1 |
The present invention provides an adhesive sheet having a satisfactory balance of reduced adhesive residue when peeling and excellent conformability to the surface shape of an adherend. Provided is an adhesive sheet comprising a base mat...
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WO/2023/281861A1 |
[Problem] To provide a protective sheet for semiconductor processing that sufficiently suppresses electrostatic charge generated during processing of a wafer, even if the wafer is being thinned by DBG or the like, and that inhibits crack...
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WO/2023/282008A1 |
The present invention provides a double-sided adhesive sheet that has excellent impact resistance and excellent reworkability. A double-sided adhesive sheet 1 comprises an adhesive layer 2. The thickness of the double-sided adhesive sh...
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WO/2023/281215A1 |
The invention relates to 1) a crosslinkable adhesive composition comprising: at least one polymer (A) comprising a hydrolysable alkoxysilane group; at least one tackifying resin (B); at least one fumed silica (C), preferably hydrophic; a...
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WO/2023/282217A1 |
Provided is an adhesive tape having high adhesive strength with respect to olefinic materials at high temperature and having holding power at high temperature, these features being difficult to achieve with adhesive tapes using conventio...
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WO/2023/281860A1 |
[Problem] To provide: a protective sheet for semiconductor processing, the protective sheet being suppressed in breakage of a wafer when the protective sheet for semiconductor processing is removed therefrom even in cases where the wafer...
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WO/2023/282010A1 |
[Problem] To provide a double-sided pressure-sensitive adhesive sheet having excellent impact resistance, high shear adhesive force, and excellent initial tackiness. [Solution] A double-sided pressure-sensitive adhesive sheet 1 includes ...
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WO/2023/282011A1 |
Provided is a double-sided pressure-sensitive adhesive sheet which includes a colored pressure-sensitive adhesive layer and which exhibits excellent impact resistance and excellent processability. A double-sided pressure-sensitive adhe...
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WO/2023/281454A1 |
The invention relates to a self-adhesive label comprising a bilayer comprising at least one layer of paper coupled to at least one polymeric film, wherein the polymeric film is coated, on the surface opposite to the surface of coupling t...
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