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WO/2014/045986A1 |
A method for manufacturing an aluminum film by electrodepositing aluminum onto a substrate in an electrolytic cell to which a molten-salt-containing electrolyte is supplied. On the basis of a prescribed relationship between the overpoten...
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WO/2014/042201A1 |
Provided is a copper foil provided with a carrier, suitable for forming a fine pitch. A copper foil provided with a carrier, comprising a copper foil carrier, a release layer layered onto the copper foil carrier, and a very thin copper l...
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WO/2014/038716A1 |
Provided are surface-treated copper foil and a laminated board using this surface-treated copper foil which yields superior resin transparency after the copper foil has been etched and removed. After surface-treated copper foil has been ...
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WO/2014/038718A1 |
Provided are surface-treated copper foil, a laminated board, a copper-clad laminated board, a printed circuit board and an electronic device using this surface-treated copper foil which bonds well to resin and yields superior resin trans...
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WO/2014/038292A1 |
The objective of the present invention is to provide a method that is for producing an aluminum film and that can, at a low cost, form on the surface of a resin a favorable-quality aluminum film by means of an aluminum plating solution t...
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WO/2014/038717A1 |
Provided are surface-treated copper foil and a laminated board using this surface-treated copper foil which bonds well to resin and yields superior resin transparency after the copper foil has been etched and removed. After surface-treat...
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WO/2014/033917A1 |
Provided is an electrolytic copper foil which has high normal-state tensile strength, is reduced in surface roughness, and has few protrusions due to abnormal electrodeposition, in particular, an electrolytic copper foil which is useful ...
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WO/2014/024994A1 |
Provided is a copper foil with a carrier attached thereto, wherein the adhesive force between the carrier and an ultrathin copper layer is high before a step consisting of lamination to an insulating substrate but decreases after said st...
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WO/2014/013962A1 |
Provided are a continuous pattern plating transfer system and a method for manufacturing continuous pattern plating transfer material that carry out patterning only with plating and do not require etching. The present invention includes:...
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WO/2014/006781A1 |
Provided is an ultrathin copper foil which has improved thickness accuracy of an ultrathin copper layer on a supporting copper foil. An ultrathin copper foil which is provided with a supporting copper foil, a releasing layer that is lami...
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WO/2014/002996A1 |
Provided are an electrolytic copper foil, a negative electrode that is for a lithium ion secondary battery, and a lithium ion secondary battery into which the electrode is incorporated. The electrolytic copper foil exhibits good conducti...
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WO/2014/002997A1 |
An electrolytic copper foil having increased tensile strength and electrical conductivity is provided, as is a manufacturing method therefor. A lithium-ion secondary battery using a negative electrode that uses the aforementioned electro...
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WO/2013/191026A1 |
Provided are a printed circuit board, and a manufacturing device and manufacturing method therefor wherein patterning is applied by only plating to remove the need for etching. First and second circuit pattern plated layers are formed on...
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WO/2013/183348A1 |
Provided is a metallic material which permits ultrafine machining such as high-precision engraving or mirror-like finishing. This metallic material is an amorphous metallic material which comprises nickel as the main component, 10 to 20w...
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WO/2013/182615A1 |
The invention relates to a method for the production of a part, comprising the following steps: a) deposition of a diffractive layer on a substrate; b) deposition of a first photosensitive resin layer on the diffractive layer; c) illumin...
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WO/2013/176133A1 |
Provided are a surface-treated copper foil that adheres well to resins and imparts superior resin transparency after the copper foil is etched away, and a laminated board using the same. A surface-treated copper foil is bonded, from a si...
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WO/2013/161334A1 |
A carrier-supported copper foil is provided in which the adhesion force between the carrier and the ultrathin copper layer is high before a step for laminating to an insulating substrate and which, after the step for laminating to an ins...
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WO/2013/153578A1 |
Provided is a method for manufacturing an electroformed component that is manufactured by electroforming to form a component with a high width-to-height ratio. The present invention comprises: a step for roughening the substrate surface ...
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WO/2013/150640A1 |
An electrolytic copper foil characterized in that the difference in Vickers hardness (Hv) between the front and back of the electrolytic copper foil or the treated electrolytic copper foil is 10 or less. The electrolytic copper foil, cha...
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WO/2013/146088A1 |
Provided is a metal foil which has excellent adhesion to adhesives. At least one surface of the metal foil has a ten-point average roughness (Rz) of 2.0-6.0 µm and has a ratio of the roughness (Rz) to the average spacing (S) between the...
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WO/2013/140449A1 |
This cover assembly for an electronic component is an assembly of a plurality of covers for electronic components formed by electroforming. Covers for electronic components are lined up in equidistant intervals to form a grid of m covers...
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WO/2013/136729A1 |
Provided is a laminated board that is provided with an insulating layer and copper foil positioned on at least one surface of the insulating layer, and that is used in a device mounting substrate obtained by forming a conductor circuit b...
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WO/2013/129588A1 |
Provided are: an electrolytic copper foil, which has similar surface configurations on both surfaces, good wettability with an active material slurry and high battery capacity, while being suppressed in deterioration of the battery capac...
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WO/2013/129508A1 |
The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad laminate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in the...
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WO/2013/129479A1 |
The present invention is characterized in that, in the preparation of a plating solution comprising at least (1) a dialkyl sulfone, (2) an aluminum halide and (3) a nitrogenated compound, the dialkyl sulfone, the aluminum halide and the ...
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WO/2013/129664A1 |
Provided is an electrolytic copper foil exhibiting a high normal tensile strength, and a small tensile strength-reduction after a thermal history. The electrolytic copper foil has a normal tensile strength in the range of 500-750MPa, and...
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WO/2013/118416A1 |
A copper foil with a carrier provided with a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer. The intermediate layer is configured by lami...
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WO/2013/119116A1 |
The present invention is directed to a method of manufacturing nanostructures on a surface of a metal substrate, comprising forming said nanostructures by means of a forming step, said forming step including subsequently performing at le...
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WO/2013/099532A1 |
A method for producing a porous metal body, the method being characterized in comprising: a step for forming an electroconductive covering layer by applying a coating on at least a skeleton surface of a porous resin in the form of a thre...
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WO/2013/088752A1 |
Provided are: a composition for the production of a contact, said composition being capable of yielding a versatile contact permitting a low stroke; and so on. This composition for the production of a contact comprises both a nickel-coba...
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WO/2013/081139A1 |
The purpose of the present invention is to provide an electrolysis copper alloy foil that has excellent laser workability properties and that after laser working can be etched at a uniform speed in the thickness direction. In the present...
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WO/2013/072952A1 |
Provided is a transfer mold that has excellent durability and is capable of accurate pattern forming. This transfer mold has a first metal layer, a mesh netting on the first metal layer upper surface, and a second metal layer plate-grown...
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WO/2013/072954A1 |
Provided are: a transfer mold for forming a component, using electroforming, that has good workability and excellent durability; and the component produced using same. Also provided is a production method for the transfer mold, that incl...
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WO/2013/073778A1 |
The present invention relates to a controlled expansion flexible metal substrate material and to a production method therefor. In the present invention, an electrocasting method is used in order to produce a metal substrate material whic...
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WO/2013/073872A1 |
The present invention relates to an apparatus and a method for manufacturing metal foil by electroforming. Provided is a horizontal electroforming apparatus comprising: base plate supply means for continuously supplying flexible and cond...
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WO/2013/072953A1 |
Provided are: a transfer mold for forming a component using electroforming, that has excellent durability, and has an aspect ratio; and the component produced using same. Also provided is a production step for the transfer mold, includin...
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WO/2013/072955A1 |
Provided are: a production method for a multi-stage transfer mold for forming a multi-stage component using electroforming, said method using electroforming and being capable of saving labor in a cascade-connection type connection proces...
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WO/2013/072964A1 |
Provided is a transfer mold for forming a component using electroforming, that has good workability and excellent durability. Also provided is a production method for the transfer mold, which includes: a step in which a component-shaped ...
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WO/2013/065699A1 |
[Problem] To provide an electrolytic copper foil which has high mechanical strength in a normal state, and which has a reduced susceptibility to heat degradation, even when heated to approximately 300°C. [Solution] An electrolytic coppe...
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WO/2013/061841A1 |
Provided is a porous current collector that can be manufactured cheaply, and has high heat resistance and oxidation resistance, and furthermore, is provided with the necessary mechanical strength, and is capable of demonstrating high dur...
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WO/2013/062026A1 |
This method for manufacturing a porous aluminum foil is characterized in comprising: forming a porous aluminum coating on the surface of a substrate by electrolysis using a plating solution including at least (1) a dialkyl sulfone, (2) a...
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WO/2013/057772A1 |
This method for producing a perforated metal foil includes: a conductive substrate preparation step (S20) for preparing a conductive substrate having a structure such that an insulating layer has been formed at a second region correspond...
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WO/2013/058289A1 |
This method for producing a perforated metal foil is characterized by including: a conductive substrate preparation step (S10) for preparing a conductive substrate having a structure of an insulating layer being formed at a second region...
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WO/2013/054786A1 |
This method for producing metal filters includes: a laminating step in which a photosensitive resin composition is laminated on a copper substrate to form a photosensitive resin composition layer; an exposure step in which prescribed are...
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WO/2013/047056A1 |
The purpose of the present invention is to provide a copper foil for lamination, said copper foil exhibiting excellent adhesion to a substrate and being capable of forming a high-precision wiring pattern. This copper foil for lamination ...
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WO/2013/043657A1 |
Systems and methods are provided for electroforming a dome for use in a dome switch. A mandrel having several dome shapes incorporated in a planar surface is provided. The mandrel can serve as a cathode in an electroforming process to co...
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WO/2013/040208A1 |
A method for modifying a surface by generating nanotubes at one or more selected sites on the surface, the surface including a first metal. The method includes the steps of positioning at least one cathode and at least one anode relative...
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WO/2013/030871A1 |
Provided is a holed foil electrolytic precipitation device with which a metal foil, in which multiple holes arranged in a desired pattern and having a desired aperture ratio are formed, can be manufactured without controlling the thickne...
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WO/2013/030870A1 |
Provided is a metal foil electrolytic deposition device in which the surface of the anode plate, on the side thereof furnished with the power supply terminals, is faced toward the outside of the electrolytic bath, and a single-bath desig...
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WO/2013/018773A1 |
Provided is an electrolytic copper alloy foil which has high mechanical strength in a normal state and is not susceptible to thermal deterioration even if heated to 300°C or higher. This electrolytic copper foil is an electrolytic coppe...
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