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JP2009009785A |
To enhance reliability by heightening adhesiveness of an insulating part and bridge electrodes.The MEMS switch 11 is provided with an insulation board 2, a signal wire 3 fitted and segmented on the insulation board 2, a bridge 4 provided...
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JP2009009884A |
To provide a manufacturing method of an MEMS switch capable of improving a switching characteristic and reliability; and an MEMS switch.A sacrifice layer arranged between a movable electrode 5 and an attraction electrode 4 constituting t...
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JP4206856B2 |
Disclosed is a switch having a movable electrode to be separately driven downward and upward to secure signal transmission efficiency and insulation capability and operate for signal connection and disconnect at a high speed. The switch ...
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JP4210203B2 |
Provided is a microelectro mechanical system (MEMS). The provided MEMS switch includes a substrate; a signal line formed on the substrate; a beam deformed by an electrostatic force to electrically switch with the signal line; and a sprin...
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JP2008300301A |
To reduce drive voltage without causing any specific troubles.A movable plate 12 is supported by a leaf spring portion 14 so that it can move up and down against a base board 11. Above the movable plate 12, there is arranged a fixed plat...
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JP2008296336A |
To provide a hollow sealing structure and manufacturing method for a hollow sealing structure, which downsizes the hollow sealing structure and shortens a removing time of an internal sacrifice layer.The hollow sealing structure 1 compri...
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JP2008294540A |
To obtain a beam adjusting device capable of electrically switching the beam axis of an antenna by using a phase shifter having less insertion loss and easily adjusting the beam axis.The adjusting device is provided with: a transmitter/r...
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JP4188316B2 |
An electronic device includes a first and a second micro-electromechanical switch assembly on a substrate, between which first and second switch assembly a first line having a first impedance and a second line having a second impedance a...
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JP4186727B2 |
A switch comprises voltage applying means for providing direct current potentials to first to third beams arranged with a spacing slightly distant one from another, and electrodes for inputting/outputting signals to/from the beams. By co...
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JP2008283473A |
To provide a power amplifier which can reduce insertion loss and power consumption and can be prevented from being made large in size.The power amplifier 1 includes: a power distributor 2 for dividing an input signal into a plurality of ...
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JP4182861B2 |
A plurality of fixed contacts and signal lines are provided on a fixed substrate. A movable contact which is closed or opened with the fixed contacts is provided on a movable substrate opposed to the fixed substrate. A film thickness of ...
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JP2008278651A |
To provide an electrostatic actuator generating large force even when starting suction, and to provide a micro-switch, electronic apparatus and a manufacturing method of the electrostatic actuator.The electrostatic actuator electrostatic...
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JP4174761B2 |
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JP4177672B2 |
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JP2008253058A |
To decrease possibility that a jointed portion to a wiring board peels off, when mounting on the wiring board is performed and decrease the possibility of a lead wire being cut, when an electrode is electrically connected through a wire ...
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JP2008238330A |
To provide a MEMS (Micro-Electro-Mechanical System) device having low operation voltage and strong pressure contact force and separating force.This MEMS device has a substrate 1, a supporting part 2 provided on the substrate 1, a fixed e...
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JP2008235254A |
To provide a drive microsystem which is provided with an opening travel end stop part of a pivot arm so that a rotation of the pivot arm can be controlled.The drive microsystem 1 is formed on a plane base plate 2 and is provided with a p...
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JP4151338B2 |
The variable capacity element has a flexible beam and an electrode between which the voltage is applied, to change the electrostatic capacitance between the beam and electrode. An independent claim is also included for variable capacity ...
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JP2008210640A |
To provide an electrostatically-driven element high in reliability for operation.Fixed conductor patterns 3a and 3b are formed on a surface of a board 2, and a movable part 4 is arranged on the upper of the fixed conductor patterns 3a an...
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JP2008204768A |
To provide a miniature relay which has a high isolation characteristic and can be easily produced by minimizing a capacity coupling component between contacts without requiring high alignment precision.The miniature relay includes a mova...
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JP4144717B2 |
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JP4144230B2 |
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JP2008198607A |
To provide a MEMS (micro electromechanical system) switch capable of being operated by high input/output current, and interconnecting method and packaging method applicable to a MEMS relay.A MEMS structural body is provided which is furt...
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JP4137872B2 |
A switch with an actuator has two supporting columns on a substrate, and a rocking plate on the supporting columns. The rocking plate is pivoted by (pivotally mounted on) the two supporting columns. The rocking plate is made of conductiv...
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JP2008186771A |
To construct a switch effectively preventing stiction using a rotor suspended by a beam.A meniscus intervening between switch contact surfaces is deformed in a shearing direction to separate cross-linkage of the meniscus off, so as to ma...
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JP2008529813A |
The micromechanical device comprises a mobile beam attached via the two ends thereof to a rigid frame comprising two arms each having two ends. The ends of an arm are respectively secured to the two ends of the mobile beam. Each arm has ...
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JP4130736B2 |
Bi-lamina driver of micro-device is made up of resistive elements (14, 15) in intimate contact and local with deformable element (11). Resistive elements are able to, when traversed by electric control current, dilate sufficiently under ...
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JP2008171586A |
To provide an electrical machine switch, which realizes enhanced performance of an electrical machine switch, such as high-speed response, low-voltage driving, high reliability (durability, high power), or extendability (such as SPDT: Si...
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JP4124428B2 |
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JP2008160563A |
To reduce impedance mismatching, insertion loss, or the like in a high frequency signal attenuating device, or the like.Signal lines 2S constituting a portion of a coplaner line 2 at end parts of input and output sides of the high freque...
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JP4109498B2 |
A switch capable of responding at a high rate at a lower DC potential and providing a high isolation is provided. In this switch, using microstructure group 103 having microstructure 102a, 102b and 102c, by slightly moving the microstruc...
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JP4109992B2 |
There is provided a switch 10 for connecting a first terminal with a second terminal electrically. The switch 10 includes: the first terminal 46; the second terminal 26 and a third terminal 28 confronting said first terminal 46; driving ...
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JP4109182B2 |
The MEMS switch comprises a first anchor formed over a substrate, a first spring connected to the first anchor, an upper electrode which is connected to the first spring and makes a motion above the substrate, elastically deforming the f...
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JP4109675B2 |
A micromechanical relay is made by surface micromachining techniques. It includes a metallic cantilever beam deflectable by an electrostatic field and a beam contact connected to the beam and electrically insulated from the beam by an in...
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JP4108708B2 |
A micro electro mechanical system switch and a method of fabricating the micro electro mechanical system switch. The micro electro mechanical system switch includes a substrate, a plurality of signal lines formed on the substrate and inc...
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JP4107329B2 |
To stably change capacitance for a change in temperature by constantly warping a movable part, whereby reliability is enhanced. A movable part 6 is provided above a substrate 2 by using supporting portions 4, support beams 7, etc., s...
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JP4100404B2 |
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JP4099480B2 |
A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both t...
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JP2008130613A |
To realize MEMS variable capacity having a large capacity ratio.The MEMS variable capacity system is provided with an MEMS variable capacity VC that is connected in series between first and second ports P1 and P2, a first power circuit P...
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JP2008131096A |
To provide a phase shifter which has high-frequency characteristics and can suppress deterioration in insertion loss and reflection loss.The phase shifter 3b includes a substrate 11, a high-frequency signal line 12 which is provided on t...
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JP2008517777A |
The invention relates to a microsystem comprising a deformable bridge, the ends of which are connected to a substrate. According to the invention, at least one actuation electrode, which is solidly connected to the bridge, is disposed be...
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JP4089803B2 |
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JP2008517568A |
An antenna for a wireless device may be kept dynamically tuned to a desired center frequency to compensate for detuning which may be caused by environmental influences. A sensor provides a feedback signal to a controller to select an app...
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JP2005523823T5 |
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JP2008515150A |
A MEMS switch having a thin film or layer that can be deformed when a voltage is applied is formed. In some embodiments, the application of voltage opens the switch contact. [Selection diagram] Fig. 11A
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JP4081012B2 |
A method of fabricating micro-electromechanical switches (MEMS) integrated with conventional semiconductor interconnect levels, using compatible processes and materials is described. The method is based upon fabricating a capacitive swit...
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JP2008091334A |
To provide a low-cost wafer-level packaging technique for MEMS devices, that reduces the total etching time of the sacrificial material layer and provides a reinforced protective cap structure for the MEMS device.A cap structure 4 is pro...
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JP4076829B2 |
Fine holes each having a diameter of scores of nanometers are formed in each of diamond thin films at an interval equal to the diameter of the fine hole, and metal electrodes each having a low resistivity are buried in the fine holes, an...
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JP4076536B2 |
A microelectromechanical system (MEMS) switch that includes a signal contact, an actuation electrode and a beam that engages the signal contact when a voltage is applied to the actuation electrode. The signal contact includes a first por...
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JP2008511105A |
A microelectromechanical system (MEMS) switch is provided which includes a multiple of three support arms extending from the periphery of a moveable electrode. In addition, MEMS switch includes a plurality of contact structures having po...
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