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JPWO2005117051A1 |
The present invention provides a highly reliable and long-life micromachine switch adapted to a wide range of signal frequencies by preventing fatigue fracture and stiffening of contacts. The fixed connection terminal (50) and the movabl...
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JP4072060B2 |
A capacitor with alterable capacitance for changing the impedance of a section of a coplanar waveguide, which may be used in particular as a high-frequency microswitch, is provided. A ground lead and a signal lead interrupted by an elect...
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JP4068346B2 |
A MEMS (Micro Electro Mechanical System) electrostatic device operated with lower and more predictable operating voltages is provided. An electrostatic actuator, an electrostatic attenuator of electromagnetic radiation, and a method for ...
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JP4066928B2 |
An RF-MEMS switch includes a plurality of movable electrodes disposed with a space provided therebetween in the direction of RF signal conduction of an RF signal-conducting unit which is provided above the RF signal-conducting unit. A mo...
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JP2008041589A |
To provide a high-frequency switch capable of securing sufficient isolation by manufacturing a structure coplanarly not along a perpendicular direction.This high-frequency switch is provided with a driving electrode, a spring drive part ...
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JP4045274B2 |
A micro-electromechanical (MEM) RF switch provided with a deflectable membrane ( 60 ) activates a switch contact or plunger ( 40 ). The membrane incorporates interdigitated metal electrodes ( 70 ) which cause a stress gradient in the mem...
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JP4045090B2 |
A fixed voltage (30) and a movable electrode (38) are placed face to face with each other, and an insulating film (31) is formed on the surface of the fixed electrode (30). The insulating film (31) is made of a nitride film (SiN) (47) as...
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JP2008021532A |
To provide a movable element capable of effectively reducing the parasitic capacity.The movable element includes, on a substrate 10, a signal line 20 for transmitting signals, a connector/disconnector 30 for mechanically connecting and d...
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JP4040308B2 |
A MEMS relay is provided. The MEMS relay includes a first wafer, a second wafer, and a third wafer that are sequentially stacked. The first wafer includes driving electrodes positioned at the bottom surface of the first wafer, input sign...
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JP4030760B2 |
A MEMS (Micro Electro Mechanical System) electrostatically operated device is provided that can switch high voltages while providing improved arcing tolerance. The MEMS device comprises a microelectronic substrate, a substrate electrode,...
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JP2007335372A |
To prevent sticking even though micro-mechanical switches are used and reduce operation failure. According to a command signal, the switch device connects signal lines 2a and 2b if the command signal provides a close command, while it di...
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JP2007331095A |
To manufacture a microstructure and a micro machine without etching a sacrifice layer. A stripping layer 102 is formed on a substrate 101, and a layer 103 to serve as a movable electrode is formed on the stripping layer 102. The layer 10...
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JP4027388B2 |
A micro electro mechanical system switch and a method of fabricating the same. The micro electro mechanical system switch includes a substrate a plurality of signal lines formed at sides an upper surface of the substrate and including sw...
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JP4023372B2 |
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JP2007535797A |
A cantilevered beam radio frequency microelectro-mechanical switch may be formed of low stress gradient polysilicon with a metallic contact. The region between the beam and the substrate may be free of dielectric in some embodiments. Oxi...
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JP2007318712A |
To provide a device including a piezoelectric thin film capable of suppressing a spurious radiation by preventing the occurrence of unnecessary vibration in a lateral mode, and capable of avoiding degradation of reliability by stress con...
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JP4017897B2 |
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JP4010769B2 |
A relay device build using MEMS technology and having a semiconductor wafer base with a surface depression having a first electrically conductive surface pattern. A lower diaphragm is moveably positioned above the depression for contact ...
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JP2007533113A |
Integrated circuit with analog connection matrix. The integrated circuit includes an analog connection matrix having a plurality of analog i/o contacts. The analog i/o contacts have a plurality of electric interconnections with respect t...
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JP2007533105A |
MEMS switches of varying configurations provide individually acutatable contacts. The MEMS switches are sealed by an improved anodic bonding technique.
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JP2007294452A |
To reduce automatic operation action by improving contact characteristics of a microswitch by an electrostatic operation method using MEMS technology. The microswitch has a first open position and a second closed position. In the closed ...
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JP2007273347A |
To provide a micro switching element applicable for a transmission/reception changeover circuit of a mobile phone. This is provided with a cantilever 3, the lower part contact electrode 5 installed at the upper face of the cantilever 3, ...
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JP3993061B2 |
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JP3989860B2 |
A semiconductor torsional micro-electromechanical (MEM) switch is described having a conductive movable control electrode; an insulated semiconductor torsion beam attached to the movable control electrode, the insulated torsion beam and ...
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JP3987809B2 |
A method for fabricating a MEMS device having a fixing part, driving part, electrode part, and contact parts on a substrate. A driving electrode is formed on the substrate, and then an insulation layer is formed thereon. The insulation l...
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JP2007259691A |
To provide an electrostatic drive method with which a driving force applied to a movable part is made large and operation speed can be increased. MEMS includes a first electrode 10 which is integrally formed with the movable part 100 of ...
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JP3985229B2 |
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JP3986881B2 |
A micro-electro mechanical system (MEMS) switch having a single anchor is provided. The MEMS switch includes a substrate (60); grounding lines installed on the substrate to be distant away from each other; signal transmission lines (44, ...
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JP2007250262A |
To provide a matrix relay having excellent extendibility by which the number of contact circuits can be simply changed as required, a small number of components the inventory of which is to be controlled, a small number of man-hours for ...
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JP2007250434A |
To provide a micro-machine switch to generate a large driving force by simultaneously using an electromagnetic force and an electrostatic force in combination. The switch is constituted by mounting a spirally wound planar coil installed ...
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JP3981120B2 |
An electrical contact device (X1) includes a first contactor with contact portions (C1, C2) and a second contactor with contact portions (C3, C4). The device (X1) also includes an electrical circuit having a branch path (YA) provided by ...
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JP2007242462A |
To provide a mechanical switch in which reliability can be improved, and suppression of variations in movement is enabled. This mechanical switch is provided with the upper part control electrode 8 which is arranged so as to be opposed s...
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JP2007234448A |
To provide a microrelay switch without variations in sensitivity. The microrelay switch comprises: a stationary substrate 10 consisting of an insulating material; pattern coils 11a, 11b formed on the upper surface of the stationary subst...
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JP2007234582A |
To provide an electromechanical switch capable of rapid switching response with a low drive voltage even in a region of high frequency and having a small insertion loss. The electromechanical switch is provide with a beam of which both e...
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JP3975574B2 |
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JP2007220476A |
To provide an electric connection structure of a semiconductor device capable of bonding two substrates without a gap, and certainly securing electric connection at electric connection parts of both of the substrates. A movable substrate...
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JP2007525104A |
A 1:N MEM switch module comprises N MEM switches fabricated on a common substrate, each of which has input and output contacts and a movable contact which bridges the input and output contacts when the switch is actuated. The input conta...
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JP3967713B2 |
To provide a switching element with a small size at a low cost, having an excellent high frequency characteristic and a long lifetime, and to provide a relay circuit thereof. The relay circuit includes: a first terminal connected to a dr...
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JP2007214039A |
To provide a micro-machine switch which prevents sticking of a movable piece by a simple constitution and which has high reliability. The micro-machine switch 1A is provided with a substrate 2, a high frequency signal wire 3 installed on...
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JP2007196303A |
To provide a micro-structure manufacturing method suitable for avoiding a sticking phenomenon, and a micro-structure. The micro-structure includes: a base substrate; a first structural part 11 joined to the base substrate; and a second s...
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JP2007521612A |
The MEMS element of the invention has a first, a second and an intermediate third electrode. It is given an increased dynamic range in that the switchable capacitor constituted by the second and the third electrode is provided in the sig...
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JP3942532B2 |
To provide a micro-switching element providing a desired deformation amount even by weak electrostatic force when an applied voltage is lowered, and capable of preventing a sticking phenomenon while having small rigidity. In the micro-sw...
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JP2007165317A |
To provide a pneumatic RF MEMS switch improved in operation and manufacture reliability by minimizing a drive voltage; and to provide its manufacturing method.This pneumatic RF MEMS switch includes: a pneumatic actuating part having a pl...
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JP3937360B2 |
PURPOSE: To allow easy manufacturing, reduce cost and provide a display quicker and more stable than an active matrix system. CONSTITUTION: A plurality of display cells 10A are arranged in the neighborhood of each intersection with a plu...
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JP2007157511A |
To realize a bistable MEMS switch with reduced size and simple structure, which can be driven by low voltage, with stable holding state for long time, easy to load a semiconductor integrated circuit together.The switch is composed of a b...
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JP2007157714A |
To arrange that stability of a switch can be promoted according as a contact failure is reduced in an MEMS switch using static electricity and in its manufacturing method.The MEMS switch 100 is composed including a substrate 101, a fixed...
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JP3935477B2 |
To provide a seesaw type MEMS switch for RF capable of reducing driving voltage. The seesaw type MEMS switch for RF has a signal transmission line formed on an upper part of a semiconductor base plate so as to form a gap for releasing a ...
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JP2007149370A |
To provide a switch capable of downsizing and achieving low voltage of drive power or stability of contact operation of the switch contact part.The switch is equipped with a plurality of torsion springs (12a, 12b) of which one end is res...
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JP2007513468A |
A bistable MEMS switch for use in selectively opening or closing electrical circuits included in an implantable medical device system is provided. The switch includes a central movable beam having a movable contact; a suspension system f...
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JP3918559B2 |
Fixed contacts (23A, 24A) are provided on the upper surface of a silicon substrate (21). Signal lines (23, 24) electrically continuous with the fixed contacts (23A, 24A) are provided so as to pass through a silicon substrate (21) from th...
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